3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
D
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
D
I
and Power-Up 3-State Support Hot
off
Insertion
D
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
D
Support Unregulated Battery Operation
Down to 2.7 V
D
Typical V
< 0.8 V at V
D
Latch-Up Performance Exceeds 500 mA Per
(Output Ground Bounce)
OLP
= 3.3 V, TA = 25°C
CC
JESD 17
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Ceramic (J)
DIPs
description
CC
SN54LVTH374...J OR W PACKAGE
SN74LVTH374. . . DB, DW, OR PW PACKAGE
)
SN54LVTH374. . . FK PACKAGE
2D
2Q
3Q
3D
4D
(TOP VIEW)
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
(TOP VIEW)
3 2 1 20 19
4
5
6
7
8
9 10 11 12 13
1
2
3
4
5
6
7
8
9
10
1D1QOE
4Q
CLK
GND
20
19
18
17
16
15
14
13
12
11
V
CC
5Q
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
8Q
18
17
16
15
14
5D
8D
7D
7Q
6Q
6D
These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to
provide a TTL interface to a 5-V system environment.
The eight flip-flops of the ’LVTH374 devices are edge-triggered D-type flip-flops. On the positive transition of
the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE
) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components.
OE
does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
When V
However, to ensure the high-impedance state above 1.5 V, OE
is between 0 and 1.5 V , the devices are in the high-impedance state during power up or power down.
CC
should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Copyright 1999, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54LVTH374, SN74LVTH374
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
description (continued)
These devices are fully specified for hot-insertion applications using I
and power-up 3-state. The I
off
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
The SN54LVTH374 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74LVTH374 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
logic symbol
INPUTS
OECLKD
L↑HH
L↑LL
LH or LXQ
HXXZ
†
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
1
11
3
4
7
8
13
14
17
18
EN
C1
1D
OUTPUT
Q
0
12
15
16
19
2
1Q
5
2Q
6
3Q
9
4Q
5Q
6Q
7Q
8Q
circuitry
off
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1
OE
11
CLK
3
1D
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
C1
1D
2
1Q
UNIT
SN54LVTH374, SN74LVTH374
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54LVTH374, SN74LVTH374
PARAMETER
TEST CONDITIONS
UNIT
V
V
V
V
V
V
V
V
V
V
I
A
D
V
3.6 V
V
V
I
I(hold)
Data in uts
µA
V
CC
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LVTH374SN74LVTH374
MIN TYP†MAXMIN TYP†MAX
V
IK
OH
OL
I
I
off
I
OZH
I
OZL
I
OZPU
I
OZPD
I
CC
∆I
CC
C
i
C
o
∗ On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
All typical values are at VCC = 3.3 V, TA = 25°C.
‡
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
§
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CLK
Q
ns
OE
Q
ns
OE
Q
ns
SN54LVTH374, SN74LVTH374
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
SN54LVTH374SN74LVTH374
f
clock
t
w
t
su
t
h
VCC = 3.3 V
± 0.3 V
MINMAXMINMAXMINMAXMINMAX
Clock frequency150150150150MHz
Pulse duration, CLK high or low3.33.33.33.3ns
Setup time, data before CLK↑1.621.52ns
Hold time, data after CLK↑0.80.50.80ns
VCC = 2.7 V
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
PARAMETER
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
†
All typical values are at VCC = 3.3 V, TA = 25°C.
= 50 pF (unless otherwise noted) (see Figure 1)
L
SN54LVTH374SN74LVTH374
FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V
MINMAXMINMAXMIN TYP†MAXMINMAX
150150150150MHz
1.74.75.31.82.94.55
1.74.54.61.82.94.24.3
1.24.95.71.32.84.75.6
1.54.85.41.634.75.2
1.84.851.934.64.9
1.94.9523.14.54.6
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
VCC = 2.7 V
UNIT
UNIT
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54LVTH374, SN74LVTH374
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS683E – MARCH 1997 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
6 V
From Output
Under Test
CL = 50 pF
(see Note A)
500 Ω
500 Ω
S1
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
6 V
GND
LOAD CIRCUIT
t
w
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
1.5 V1.5 V
t
PHL
1.5 V1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
t
PHL
t
PLH
2.7 V
0 V
V
OH
V
OL
V
OH
V
OL
2.7 V
0 V
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
1.5 V
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V
t
PZL
1.5 V
t
PZH
1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
t
h
1.5 V
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
2.7 V
0 V
2.7 V
0 V
2.7 V
0 V
3 V
V
OL
V
OH
≈ 0 V
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
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CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
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party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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