Texas Instruments SN74LVT16835DGGR, SN74LVT16835DL, SN74LVT16835DLR Datasheet

SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
D
Member of the Texas Instruments
Widebus
Family
D
Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With
3.3-V V
CC
)
D
Supports Unregulated Battery Operation Down to 2.7 V
D
T ypical V
OLP
(Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
D
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
D
Supports Live Insertion
D
Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB Layout
D
Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Spacings
description
The SN74LVT16835 is an 18-bit universal bus driver designed for low-voltage (3.3-V) V
CC
operation, but with the capability to provide a TTL interface to a 5-V system environment.
Data flow from A to Y is controlled by the output-enable (OE) input. This device operates in the transparent mode when the latch-enable (LE) input is high. The A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of the clock. When OE
is high, the outputs
are in the high-impedance state. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74L VT16835 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages,
which provide twice the input/output (I/O) pins and functionality of standard small-outline packages in the same printed circuit board area.
The SN74LVT16835 is characterized for operation from –40°C to 85°C.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Widebus is a trademark of Texas Instruments Incorporated.Widebus is a trademark of Texas Instruments Incorporated.
DGG OR DL PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
NC NC
Y1
GND
Y2 Y3
V
CC
Y4 Y5 Y6
GND
Y7 Y8
Y9 Y10 Y11 Y12
GND
Y13 Y14 Y15
V
CC
Y16 Y17
GND
Y18
OE
LE
GND NC A1 GND A2 A3 V
CC
A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 V
CC
A16 A17 GND A18 CLK GND
NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
OUTPUT
OE
LE CLK A
Y
H X X X Z L HXL L L HXH H L L LL L L HH L LHX Y
0
L L L X Y
0
Output level before the indicated steady-state input conditions were established, provided that CLK was high before LE went low
Output level before the indicated steady-state input conditions were established
logic symbol
§
EN1
27 30
CLK
C3
28
LE
G2
Y1
3
1
Y2
5
Y3
6
Y4
8
Y5
9
Y16
23
Y17
24
Y18
26
A1
54
3D
A2
52
A3
51
A4
49
A5
48
A16
34
A17
33
A18
31
2C3
OE
A6
47
A7
45
A8
44
A9
43
A10
42
A11
41
A12
40
A13
38
A14
37
A15
36
Y6
10
Y7
12
Y8
13
Y9
14
Y10
15
Y11
16
Y12
17
Y13
19
Y14
20
Y15
21
1
§
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
SN74LVT16835
3.3-V ABT 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
SCBS309D – MARCH 1994 – REVISED NOVEMBER 1996
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
OE
CLK
Y1
1D C1
CLK
To 17 Other Channels
LE
A1
27
30
28
54
3
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state or power-off state, V
O
(see Note 1) –0.5 V to 7 V. . . .
Current into any output in the low state, I
O
128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the high state, I
O
(see Note 2) 64 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 3):DGG package 1 W. . . . . . . . . . . . . . . . . . .
DL package 1.4 W. . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the
Package Thermal Considerations
application note in the
ABT Advanced BiCMOS T echnology Data
Book
.
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