TEXAS INSTRUMENTS SN74LVC3G07 Technical data

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DCT OR DCU PACKAGE

(TOP VIEW)

1
2
3
4

8
7
6
5

1A
3Y
2A

GND

V

CC

1Y
3A
2Y

4
3
2
1

5
6
7
8

GND

2A
3Y
1A

2Y
3A
1Y
V

CC

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

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FEATURES

• Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

• Supports 5-V V

• Max tpdof 3.7 ns at 3.3 V

• Low Power Consumption, 10- µ A Max I

• ± 24-mA Output Drive at 3.3 V

• Input and Open-Drain Output Accepts

Voltages up to 5.5 V

• Typical V

at V

• Typical V

V

CC

• I

off

OLP

= 3.3 V, T

CC

OHV

= 3.3 V, T

Supports Partial-Power-Down Mode

Operation

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

Operation

CC

(Output Ground Bounce) <0.8 V

= 25°C

A

(Output V

= 25°C

A

Undershoot) >2 V at

OH

SN74LVC3G07

TRIPLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

SCES365H – AUGUST 2001 – REVISED JUNE 2005

CC

DESCRIPTION/ORDERING INFORMATION

This triple buffer/driver is designed for 1.65-V to 5.5-V V
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

T

A

–40°C to 85°C

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

operation.

CC

ORDERING INFORMATION

PACKAGE

NanoStar™ – WCSP (DSBGA)

0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)

0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT Reel of 3000 SN74LVC3G07DCTR C07_ _ _

VSSOP – DCU C07_

(1)

Reel of 3000 _ _ _CV_

Reel of 3000 SN74LVC3G07DCUR
Reel of 250 SN74LVC3G07DCUT

ORDERABLE PART NUMBER TOP-SIDE MARKING

SN74LVC3G07YEAR

SN74LVC3G07YZAR

SN74LVC3G07YEPR

SN74LVC3G07YZPR

(2)

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Copyright © 2001–2005, Texas Instruments Incorporated

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1A 1Y

1 7

2A 2Y

3 5

3A 3Y

6 2

SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS

SCES365H – AUGUST 2001 – REVISED JUNE 2005

DESCRIPTION/ORDERING INFORMATION (CONTINUED)

The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial-power-down applications using I
preventing damaging current backflow through the device when it is powered down.

FUNCTION TABLE

(EACH BUFFER/DRIVER)

INPUT OUTPUT

A Y

H H
L L

LOGIC DIAGRAM (POSITIVE LOGIC)

. The I

off

circuitry disables the outputs,

off

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

V

Supply voltage range –0.5 6.5 V

CC

V

Input voltage range

I

V

Voltage range applied to any output in the high-impedance or power-off state

O

V

Voltage range applied to any output in the high or low state

O

I

Input clamp current VI< 0 –50 mA

IK

I

Output clamp current VO< 0 –50 mA

OK

I

Continuous output current ±50 mA

O

Continuous current through V

θ

Package thermal impedance

JA

T

Storage temperature range –65 150 °C

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) The value of V
(4) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

or GND ±100 mA

CC

DCT package 220

(4)

is provided in the recommended operating conditions table.

CC

DCU package 227
YEA/YZA package 140
YEP/YZP package 102

–0.5 6.5 V

(2)

(2) (3)

–0.5 6.5 V
–0.5 6.5 V

°C/W

2

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Recommended Operating Conditions

V

V

V

V
V

I

Supply voltage V

CC

High-level input voltage V

IH

Low-level input voltage V

IL

Input voltage 0 5.5 V

I

Output voltage 0 5.5 V

O

Low-level output current 16 mA

OL

(1)

∆ t/ ∆ v Input transition rise or fall rate V

T

(1) All unused inputs of the device must be held at V

Operating free-air temperature –40 85 °C

A

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

CC

SN74LVC3G07

TRIPLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

SCES365H – AUGUST 2001 – REVISED JUNE 2005

MIN MAX UNIT

Operating 1.65 5.5
Data retention only 1.5
V

= 1.65 V to 1.95 V 0.65 × V

CC

V

= 2.3 V to 2.7 V 1.7

CC

V

= 3 V to 3.6 V 2

CC

V

= 4.5 V to 5.5 V 0.7 × V

CC

V

= 1.65 V to 1.95 V 0.35 × V

CC

V

= 2.3 V to 2.7 V 0.7

CC

V

= 3 V to 3.6 V 0.8

CC

V

= 4.5 V to 5.5 V 0.3 × V

CC

V

= 1.65 V 4

CC

V

= 2.3 V 8

CC

V

= 3 V

CC

V

= 4.5 V 32

CC

V

= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20

CC

= 3.3 V ± 0.3 V 10 ns/V

CC

V

= 5 V ± 0.5 V 5

CC

CC

CC

CC

CC

24

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS V

IOL= 100 µ A 1.65 V to 5.5 V 0.1
IOL= 4 mA 1.65 V 0.45

V

OL

I

I

I

off

I

CC

∆ I

CC

C

i

A inputs VI= 5.5 V or GND 0 to 5.5 V ±5 µ A

(1) All typical values are at V

IOL= 8 mA 2.3 V 0.3
IOL= 16 mA 0.4
IOL= 24 mA 0.55
IOL= 32 mA 4.5 V 0.55

VIor VO= 5.5 V 0 ±10 µ A
VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 µ A
One input at V
VI= V

CC

= 3.3 V, TA= 25°C.

CC

– 0.6 V, Other inputs at V

CC

or GND 3 V to 5.5 V 500 µ A

CC

or GND 3.3 V 3.5 pF

CC

MIN TYP

(1)

MAX UNIT

V

3 V

3

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SN74LVC3G07
TRIPLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS

SCES365H – AUGUST 2001 – REVISED JUNE 2005

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )

V

= 1.8 V V

PARAMETER UNIT

t

pd

FROM TO

(INPUT) (OUTPUT)

A Y 1.5 7.8 1 4.3 1.1 3.7 1 2.9 ns

CC

± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V

MIN MAX MIN MAX MIN MAX MIN MAX

Operating Characteristics

TA= 25°C

V

= 1.8 V V

PARAMETER TEST CONDITIONS UNIT

C

Power dissipation capacitance f = 10 MHz 3 3 4 5 pF

pd

CC

TYP TYP TYP TYP

= 2.5 V V

CC

CC

= 2.5 V V

= 3.3 V V

CC

= 3.3 V V

CC

CC

CC

= 5 V

= 5 V

4