TEXAS INSTRUMENTS SN54LVC32A, SN74LVC32A Technical data

www.ti.com
SN74LVC32A . . . RGY PACKAGE
(TOP VIEW)
1 14
7 8
13 12 11 10
4B 4A 4Y 3B 3A
1B 1Y 2A 2B 2Y
1A
3Y
V
GND
CC
14 13 12 11 10
1A 1B 1Y 2A 2B 2Y
GND
V
CC
4B 4A 4Y 3B 3A 3Y
SN54LVC32A . . . J OR W PACKAGE
SN74LVC32A . . . D, DB, NS,
OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
18 17 16 15 14
4A NC 4Y NC 3B
1Y
NC
2A
NC
2B
1B1ANC
3Y
3A
V
4B
2Y
GND
NC
SN54LVC32A . . . FK PACKAGE
(TOP VIEW)
CC
NC - No internal connection
Y A B or Y A B
SN54LVC32A, SN74LVC32A
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS286P – JANUARY 1993 – REVISED APRIL 2005

FEATURES

Operate From 1.65 V to 3.6 V
Specified From –40°C to 85°C,
–40°C to 125°C, and –55°C to 125°C
Inputs Accept Voltages to 5.5 V
Max tpdof 3.8 ns at 3.3 V
Typical V
<0.8 V at V
OLP
CC
(Output Ground Bounce)
= 3.3 V, T
= 25°C 1000-V Charged-Device Model (C101)
A
Typical V
>2 V at V
OHV
CC
(Output V
= 3.3 V, T
A
OH
= 25°C
Undershoot)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A)

DESCRIPTION/ORDERING INFORMATION

The SN54LVC32A quadruple 2-input positive-OR gate is designed for 2.7-V to 3.6-V V SN74LVC32A quadruple 2-input positive-OR gate is designed for 1.65-V to 3.6-V V
The 'LVC32A devices perform the Boolean function
T
A
–40°C to 85°C QFN RGY Reel of 1000 SN74LVC32ARGYR LC32A
–40°C to 125°C
–55°C to 125°C CFP W Tube of 150 SNJ54LVC32AW SNJ54LVC32AW
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
in positive logic.
ORDERING INFORMATION
PACKAGE
SOIC D Reel of 2500 SN74LVC32ADR LVC32A
SOP NS Reel of 2000 SN74LVC32ANSR LVC32A SSOP DB Reel of 2000 SN74LVC32ADBR LC32A
TSSOP PW Reel of 2000 SN74LVC32APWR LC32A
CDIP J Tube of 25 SNJ54LVC32AJ SNJ54LVC32AJ
LCCC FK Tube of 55 SNJ54LVC32AFK SNJ54LVC32AFK
(1)
Tube of 50 SN74LVC32AD
Reel of 250 SN74LVC32ADT
Tube of 90 SN74LVC32APW
Reel of 250 SN74LVC32APWT
ORDERABLE TOP-SIDE
PART NUMBER MARKING
Copyright © 1993–2005, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
CC
operation.
CC
operation, and the
www.ti.com
A B
Y
SN54LVC32A, SN74LVC32A QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS286P – JANUARY 1993 – REVISED APRIL 2005

DESCRIPTION/ORDERING INFORMATION (CONTINUED)

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.
FUNCTION TABLE
(EACH GATE)
INPUTS
A B
H X H X H H
L L L
LOGIC DIAGRAM, EACH GATE (POSITIVE LOGIC)
OUTPUT
Y

Absolute Maximum Ratings

(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
V
I
V
O
I
IK
I
OK
I
O
θ
JA
T
stg
P
tot
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) The value of V (4) The package thermal impedance is calculated in accordance with JESD 51-7. (5) The package thermal impedance is calculated in accordance with JESD 51-5. (6) For the D package: above 70°C, the value of P (7) For the DB, DGV, NS, and PW packages: above 60°C, the value of P
Supply voltage range –0.5 6.5 V Input voltage range Output voltage range
(2)
(2) (3)
–0.5 6.5 V
–0.5 V Input clamp current VI< 0 –50 mA Output clamp current VO< 0 –50 mA Continuous output current ±50 mA Continuous current through V
Package thermal impedance NS package
or GND ±100 mA
CC
D package DB package
PW package RGY package
(4)
(4) (4)
(4)
(5)
Storage temperature range –65 150 °C Power dissipation TA= –40°C to 125°C
(6) (7)
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
is provided in the recommended operating conditions table.
CC
derates linearly with 8 mW/K.
tot
derates linearly with 5.5 mW/K.
tot
+ 0.5 V
CC
86 96 76 °C/W
113
47
500 mW
2
www.ti.com
SN54LVC32A, SN74LVC32A
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS286P – JANUARY 1993 – REVISED APRIL 2005

Recommended Operating Conditions

V
V V V V
I
OH
I
OL
t/ v Input transition rise or fall rate 7 ns/V
(1) All unused inputs of the device must be held at V
Supply voltage V
CC
High-level input voltage V
IH
Low-level input voltage V
IL
Input voltage 0 5.5 V
I
Output voltage 0 V
O
High-level output current mA
Low-level output current mA
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(1)
Operating 2 3.6 Data retention only 1.5
= 2.7 V to 3.6 V 2 V
CC
= 2.7 V to 3.6 V 0.8 V
CC
V
= 2.7 V –12
CC
V
= 3 V –24
CC
V
= 2.7 V 12
CC
V
= 3 V 24
CC
or GND to ensure proper device operation. Refer to the TI application report,
CC
SN54LVC32A –55 TO 125°C UNIT
MIN MAX
V
CC

Recommended Operating Conditions

(1)
SN74LVC32A TA= 25° C –40 TO 85° C –40 TO 125° C UNIT MIN MAX MIN MAX MIN MAX
V
V
V
V V
I
I
Supply voltage V
CC
High-level input
IH
voltage
Low-level input
IL
voltage
Input voltage 0 5.5 0 5.5 0 5.5 V
I
Output voltage 0 V
O
High-level output
OH
current
Low-level output
OL
current
Operating 1.65 3.6 1.65 3.6 1.65 3.6 Data retention only 1.5 1.5 1.5 V
= 1.65 V to 1.95 V 0.65 × V
CC
V
= 2.3 V to 2.7 V 1.7 1.7 1.7 V
CC
V
= 2.7 V to 3.6 V 2 2 2
CC
V
= 1.65 V to 1.95 V 0.35 × V
CC
V
= 2.3 V to 2.7 V 0.7 0.7 0.7 V
CC
V
= 2.7 V to 3.6 V 0.8 0.8 0.8
CC
V
= 1.65 V –4 –4 –4
CC
V
= 2.3 V –8 –8 –8
CC
V
= 2.7 V –12 –12 –12
CC
V
= 3 V –24 –24 –24
CC
V
= 1.65 V 4 4 4
CC
V
= 2.3 V 8 8 8
CC
V
= 2.7 V 12 12 12
CC
V
= 3 V 24 24 24
CC
CC
0.65 × V
CC
CC
CC
0.35 × V
0 V
0.65 × V
CC
CC
CC
0.35 × V
0 V
t/ v Input transition rise or fall rate 7 7 7 ns/V
(1) All unused inputs of the device must be held at V
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
or GND to ensure proper device operation. Refer to the TI application report,
CC
CC
V
CC
mA
mA
3
www.ti.com
SN54LVC32A, SN74LVC32A QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS286P – JANUARY 1993 – REVISED APRIL 2005

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
IOH= –100 µ A 2.7 V to 3.6 V V
V
OH
V
OL
I
I
I
CC
I
CC

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
V
OH
V
OL
I
I
I
CC
I
CC
C
i
IOH= –12 mA V
IOH= –24 mA 3 V 2.2 IOL= 100 µ A 2.7 V to 3.6 V 0.2 IOL= 12 mA 2.7 V 0.4 V IOL= 24 mA 3 V 0.55 VI= 5.5 V or GND 3.6 V ±5 µ A VI= V One input at V
or GND, IO= 0 3.6 V 10 µ A
CC
0.6 V, Other inputs at V
CC
or GND 2.7 V to 3.6 V 500 µ A
CC
SN74LVC32A
CC
TA= 25°C –40 TO 85°C –40 TO 125°C UNIT
MIN TYP MAX MIN MAX MIN MAX
IOH= –100 µ A 1.65 V to 3.6 V V
0.2 V
CC
IOH= –4 mA 1.65 V 1.29 1.2 1.05 IOH= –8 mA 2.3 V 1.9 1.7 1.55
IOH= –12 mA
2.7 V 2.2 2.2 2.05 3 V 2.4 2.4 2.25
IOH= –24 mA 3 V 2.3 2.2 2 IOL= 100 µ A 1.65 V to 3.6 V 0.1 0.2 0.3 IOL= 4 mA 1.65 V 0.24 0.45 0.6 IOL= 8 mA 2.3 V 0.3 0.7 0.85 V IOL= 12 mA 2.7 V 0.4 0.4 0.6 IOL= 24 mA 3 V 0.55 0.55 0.8 VI= 5.5 V or GND 3.6 V ±1 ±5 ±20 µ A VI= V One input at V
Other inputs at V GND
VI= V
or GND, IO= 0 3.6 V 1 10 40 µ A
CC
0.6 V,
CC
or 2.7 V to 3.6 V 500 500 5000 µ A
CC
or GND 3.3 V 5 pF
CC
CC
2.7 V 2.2 3 V 2.4
0.2 V
CC
SN54LVC32A –55 TO 125°C UNIT
MIN MAX
0.2
CC
0.3
CC
V

Switching Characteristics

over operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER V
t
pd
4
FROM TO
(INPUT) (OUTPUT)
A or B Y ns
SN54LVC32A
CC
–55 TO 125°C UNIT
MIN MAX
2.7 V 4.4
3.3 V ± 0.3 V 1 3.8
www.ti.com
QUADRUPLE 2-INPUT POSITIVE-OR GATES

Switching Characteristics

over operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER V
t
pd
t
sk(o)

Operating Characteristics

TA= 25°C
C
Power dissipation capacitance per gate f = 10 MHz 2.5 V 10.6 pF
pd
FROM TO
(INPUT) (OUTPUT)
A or B Y ns
PARAMETER V
CC
1.8 V ± 0.15 V 1 4.2 8.2 1 8.7 1 10.2
2.5 V ± 0.2 V 1 2.6 4.9 1 5.4 1 6.9
2.7 V 1 3 4.2 1 4.4 1 5.5
3.3 V ± 0.3 V 1 2.5 3.6 1 3.8 1 5
3.3 V ± 0.3 V 1 1.5 ns
TA= 25°C –40 TO 85°C –40 TO 125°C UNIT
MIN TYP MAX MIN MAX MIN MAX
SN54LVC32A, SN74LVC32A
SCAS286P – JANUARY 1993 – REVISED APRIL 2005
SN74LVC32A
TEST
CONDITIONS
1.8 V 7.5
3.3 V 12.5
TYP UNIT
CC
5
www.ti.com
V
M
t
h
t
su
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
V
LOAD
Open
GND
R
L
R
L
Data Input
Timing Input
V
I
0 V
V
I
0 V
0 V
t
w
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
t
PLH
t
PHL
t
PHL
t
PLH
V
OH
V
OH
V
OL
V
OL
V
I
0 V
Input
Output Waveform 1 S1 at V
LOAD
(see Note B)
Output Waveform 2
S1 at GND
(see Note B)
V
OL
V
OH
t
PZL
t
PZH
t
PLZ
t
PHZ
V
LOAD
/2
0 V
VOL + V
VOH - V
0 V
V
I
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
V
LOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as ten.
G. t
PLH
and t
PHL
are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
I
V
M
V
M
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 k 500 500 500
V
CC
R
L
2 × V
CC
2 × V
CC
6 V 6 V
V
LOAD
C
L
30 pF 30 pF 50 pF 50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
V
CC
V
CC
2.7 V
2.7 V
V
I
VCC/2 VCC/2
1.5 V
1.5 V
V
M
tr/t
f
2 ns
2 ns2.5 ns2.5 ns
INPUTS
SN54LVC32A, SN74LVC32A QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS286P – JANUARY 1993 – REVISED APRIL 2005

PARAMETER MEASUREMENT INFORMATION

6
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
5962-9761801Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-9761801QCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-9761801QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN74LVC32AD ACTIVE SOIC D 14 50 Green (RoHS &
SN74LVC32ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LVC32ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LVC32ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LVC32ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LVC32ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74LVC32ADR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LVC32ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LVC32ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74LVC32ADT ACTIVE SOIC D 14 250 Green (RoHS &
SN74LVC32ADTE4 ACTIVE SOIC D 14 250 Green (RoHS &
SN74LVC32ADTG4 ACTIVE SOIC D 14 250 Green (RoHS &
SN74LVC32ANSR ACTIVE SO NS 14 2000 Green (RoHS &
SN74LVC32ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
SN74LVC32ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
SN74LVC32APW ACTIVE TSSOP PW 14 90 Green (RoHS &
SN74LVC32APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
SN74LVC32APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
SN74LVC32APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74LVC32APWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
SN74LVC32APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
SN74LVC32APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
SN74LVC32APWT ACTIVE TSSOP PW 14 250 Green (RoHS &
SN74LVC32APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
20-Mar-2008
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
(2)
SN74LVC32APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
20-Mar-2008
(3)
no Sb/Br)
SN74LVC32AQDRG4Q1 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC32ARGYR ACTIVE QFN RGY 14 1000 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SN74LVC32ARGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS &
CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SNJ54LVC32AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LVC32AJ ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LVC32AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
Type
SN74LVC32ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LVC32ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC32ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LVC32APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC32ARGYR QFN RGY 14 1000 180.0 12.4 3.85 3.85 1.35 8.0 12.0 Q1
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC32ADBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LVC32ADR SOIC D 14 2500 346.0 346.0 33.0 SN74LVC32ANSR SO NS 14 2000 346.0 346.0 33.0 SN74LVC32APWR TSSOP PW 14 2000 346.0 346.0 29.0
SN74LVC32ARGYR QFN RGY 14 1000 190.5 212.7 31.8
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,25 0,09
0°ā8°
Gage Plane
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15 0,05
8
1
A
DIM
6,60 6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
22
23
24
25
21
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342 (8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358 (9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307 (7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850 (21,6)
1.047 (26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358 (9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858 (21,8)
1.063 (27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Wireless www.ti.com/wireless
Loading...