TEXAS INSTRUMENTS SN74LVC2G66 Technical data

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DCT OR DCU PACKAGE
(TOP VIEW)
1 2 3 4
8 7 6 5
1A 1B 2C
GND
V
CC
4 3 2 1
5 6 7 8
GND
2A 2B 1C V
CC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
查询SN74LVC2G66DCTR供应商
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
FEATURES
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1.65-V to 5.5-V V
Inputs Accept Voltages to 5.5 V
Max tpdof 0.8 ns at 3.3 V
High On-Off Output Voltage Ratio
High Degree of Linearity
High Speed, Typically 0.5 ns
(V
= 3 V, C
CC
L
Rail-to-Rail Input/Output
Low On-State Resistance, Typically 6
(V
= 4.5 V)
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESCRIPTION/ORDERING INFORMATION
This dual bilateral analog switch is designed for 1.65-V to 5.5-V V The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up
to 5.5 V (peak) to be transmitted in either direction. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the
associated switch section. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
Operation
CC
= 50 pF)
operation.
CC
T
A
NanoStar™ WCSP (DSBGA)
0.17-mm Small Bump YEA NanoFree™ WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free) NanoStar™ WCSP (DSBGA)
–40°C to 85°C
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
0.23-mm Large Bump YEP NanoFree™ WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free) SSOP DCT Reel of 3000 SN74LVC2G66DCTR C66_ _ _
VSSOP DCU C66_
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ORDERING INFORMATION
PACKAGE
(1)
Reel of 3000 _ _ _C6_
Reel of 3000 SN74LVC2G66DCUR Reel of 250 SN74LVC2G66DCUT
ORDERABLE PART NUMBER TOP-SIDE MARKING
SN74LVC2G66YEAR
SN74LVC2G66YZAR
SN74LVC2G66YEPR
SN74LVC2G66YZPR
Copyright © 2001–2005, Texas Instruments Incorporated
(2)
www.ti.com
1B
1C
1A
1
7
2
One of Two Switches
SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
FUNCTION TABLE
(EACH SECTION)
CONTROL
INPUT SWITCH
(C)
L Off H On
LOGIC DIAGRAM, EACH SWITCH (POSITIVE LOGIC)
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
Supply voltage range
CC
V
Input voltage range
I
V
Switch I/O voltage range
O
I
Control input clamp current VI< 0 –50 mA
IK
I
I/O port diode current V
I/OK
I
On-state switch current V
T
Continuous current through V
θ
Package thermal impedance
JA
T
Storage temperature range –65 150 °C
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground, unless otherwise specified. (3) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) This value is limited to 5.5 V maximum. (5) The package thermal impedance is calculated in accordance with JESD 51-7.
(2)
(2) (3)
(2) (3) (4)
< 0 or V
I/O
= 0 to V
I/O
or GND ±100 mA
CC
> V
I/O
CC
CC
–0.5 6.5 V –0.5 6.5 V –0.5 V
CC
DCT package 220
(5)
DCU package 227 YEA/YZA package 140 YEP/YZP package 102
+ 0.5 V
–50 mA ±50 mA
°C/W
2
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SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Recommended Operating Conditions
V V
V
V
V
t/ v Input transition rise/fall time ns/V
T
(1) All unused inputs of the device must be held at V
Supply voltage 1.65 5.5 V
CC
I/O port voltage 0 V
I/O
High-level input voltage, control input V
IH
Low-level input voltage, control input V
IL
Control input voltage 0 5.5 V
I
Operating free-air temperature –40 85 °C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(1)
V
= 1.65 V to 1.95 V V
CC
V
= 2.3 V to 2.7 V V
CC
V
= 3 V to 3.6 V V
CC
V
= 4.5 V to 5.5 V V
CC
V
= 1.65 V to 1.95 V V
CC
V
= 2.3 V to 2.7 V V
CC
V
= 3 V to 3.6 V V
CC
V
= 4.5 V to 5.5 V V
CC
V
= 1.65 V to 1.95 V 20
CC
V
= 2.3 V to 2.7 V 20
CC
V
= 3 V to 3.6 V 10
CC
V
= 4.5 V to 5.5 V 10
CC
or GND to ensure proper device operation. Refer to the TI application report,
CC
× 0.65
CC
× 0.7
CC
× 0.7
CC
× 0.7
CC
MIN MAX UNIT
× 0.35
CC
× 0.3
CC
× 0.3
CC
× 0.3
CC
V
CC
3
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SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
r
r
r
I
I
I
I
I C C C
On-state switch resistance VC= V
on
Peak on-state resistance VC= V
on(p)
Difference of on-state resistance
on
between switches
Off-state switch leakage current VI= GND and VO= VCC, 5.5 V µ A
S(off)
On-state switch leakage current 5.5 V µ A
S(on)
Control input current VC= V
I
Supply current VC= V
CC
Supply-current change VC= V
CC
Control input capacitance 5 V 3.5 pF
ic
Switch input/output capacitance 5 V 6 pF
io(off)
Switch input/output capacitance 5 V 14 pF
io(on)
(1) TA= 25°C
VI= V (see Figure 1 and Figure 2 )
VI= V (see Figure 1 and Figure 2 )
VI= V VC= V (see Figure 1 and Figure 2 )
VI= V VC= VIL(see Figure 3 )
VI= V (see Figure 4 )
or GND,
CC
IH
to GND,
CC
IH
to GND,
CC
IH
and VO= GND or ±1
CC
or GND, VC= VIH, VO= Open
CC
or GND 5.5 V µ A
CC
or GND 5.5 V µ A
CC
0.6 V 5.5 V 500 µ A
CC
MIN TYP
CC
(1)
MAX UNIT
IS= 4 mA 1.65 V 12.5 30 IS= 8 mA 2.3 V 9 20 IS= 24 mA 3 V 7.5 15 IS= 32 mA 4.5 V 6 10 IS= 4 mA 1.65 V 85 120 IS= 8 mA 2.3 V 22 30 IS= 24 mA 3 V 12 20 IS= 32 mA 4.5 V 7.5 15 IS= 4 mA 1.65 V 7 IS= 8 mA 2.3 V 5 IS= 24 mA 3 V 3 IS= 32 mA 4.5 V 2
±0.1
±0.1
±0.1
(1) (1)
(1)
±1
(1)
±1
(1)
10
(1)
1
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5 )
V
= 1.8 V V
PARAMETER UNIT
(1)
t
pd
(2)
t
en
(3)
t
dis
(1) t (2) t
(3) t
and t
PLH
switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
and t
PZL
and t
PLZ
are the same as tpd. The propagation delay is the calculated RC time constant of the typical on-state resistance of the
PHL
are the same as ten.
PZH
are the same as t
PHZ
FROM TO
(INPUT) (OUTPUT)
A or B B or A 2 1.2 0.8 0.6 ns
C A or B 2.3 10 1.6 5.6 1.5 4.4 1.3 3.9 ns C A or B 2.5 10.5 1.2 6.9 2 7.2 1.1 6.3 ns
.
dis
CC
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
MIN MAX MIN MAX MIN MAX MIN MAX
4
= 2.5 V V
CC
= 3.3 V V
CC
CC
= 5 V
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DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Analog Switch Characteristics
TA= 25°C
PARAMETER TEST CONDITIONS V
Frequency response
(switch on)
Crosstalk
(between switches)
Crosstalk
(control input to signal output)
Feedthrough attenuation
(switch off)
Sine-wave distortion A or B B or A %
(1) Adjust finvoltage to obtain 0 dBm at input.
(1)
FROM TO
(INPUT) (OUTPUT)
CL= 50 pF, RL= 600 , fin= sine wave (see Figure 6 )
A or B B or A MHz
CL= 5 pF, RL= 50 , fin= sine wave (see Figure 6 )
CL= 50 pF, RL= 600 , fin= 1 MHz (sine wave) (see Figure 7 )
A or B B or A dB
CL= 5 pF, RL= 50 , fin= 1 MHz (sine wave) (see Figure 7 )
CL= 50 pF, RL= 600 ,
C A or B fin= 1 MHz (square wave) mV
(see Figure 8 )
CL= 50 pF, RL= 600 , fin= 1 MHz (sine wave) (see Figure 9 )
A or B B or A dB
CL= 5 pF, RL= 50 , fin= 1 MHz (sine wave) (see Figure 9 )
CL= 50 pF, RL= 10 k , fin= 1 kHz (sine wave) (see Figure 10 )
CL= 50 pF, RL= 10 k , fin= 10 kHz (sine wave) (see Figure 10 )
CC
1.65 V 35
2.3 V 120 3 V 175
4.5 V 195
1.65 V >300
2.3 V >300 3 V >300
4.5 V >300
1.65 V –58
2.3 V –58 3 V –58
4.5 V –58
1.65 V –42
2.3 V –42 3 V –42
4.5 V –42
1.65 V 35
2.3 V 50 3 V 70
4.5 V 100
1.65 V –58
2.3 V –58 3 V –58
4.5 V –58
1.65 V –42
2.3 V –42 3 V –42
4.5 V –42
1.65 V 0.1
2.3 V 0.025 3 V 0.015
4.5 V 0.01
1.65 V 0.15
2.3 V 0.025 3 V 0.015
4.5 V 0.01
SN74LVC2G66
TYP UNIT
Operating Characteristics
TA= 25°C
V
= 1.8 V V
PARAMETER UNIT
C
Power dissipation capacitance f = 10 MHz 8 9 9.5 11 pF
pd
TEST
CONDITIONS
CC
TYP TYP TYP TYP
= 2.5 V V
CC
= 3.3 V V
CC
= 5 V
CC
5
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V
CC
VI = V
CC
or GND
V
O
r
on
V
I
V
O
I
S
V
I
- V
O
GND(On)
V
B or A
C
A or B
V
CC
V
IH
V
C
I
S
100
10
1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VCC = 1.65 V
VCC = 2.3 V
VCC = 3.0 V
VCC = 4.5 V
VIN - V
r
on
-
SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION
Figure 1. On-State Resistance Test Circuit
Figure 2. Typical ronas a Function of Input Voltage (V
) for VI= 0 to V
I
CC
6
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PARAMETER MEASUREMENT INFORMATION
Condition 1: V
I
= GND, VO = V
CC
Condition 2: VI = VCC, VO = GND
V
CC
V
I
V
O
GND(Off)
B or A
C
A or B
V
CC
V
IL
V
C
A
V
CC
V
O
GND(On)
B or A
C
A or B
V
CC
V
IH
V
C
A
VI = V
CC
or GND
VO = Open
Figure 3. Off-State Switch Leakage-Current Test Circuit
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Figure 4. On-State Leakage-Current Test Circuit
7
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V
M
t
h
t
su
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
V
LOAD
Open
GND
R
L
R
L
Data Input
Timing Input
V
I
0 V
V
I
0 V
0 V
t
w
Input
VOLTAGE W AVEFORMS
SETUP AND HOLD TIMES
VOLTAGE W AVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE W AVEFORMS
PULSE DURATION
t
PLH
t
PHL
t
PHL
t
PLH
V
OH
V
OH
V
OL
V
OL
V
I
0 V
Input
Output Waveform 1 S1 at V
LOAD
(see Note B)
Output Waveform 2
S1 at GND
(see Note B)
V
OL
V
OH
t
PZL
t
PZH
t
PLZ
t
PHZ
V
LOAD
/2
0 V
VOL + V
VOH − V
0 V
V
I
VOLTAGE W AVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
V
LOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as ten.
G. t
PLH
and t
PHL
are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
I
V
M
V
M
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V 5 V ± 0.5 V
1 k 500 500 500
V
CC
R
L
2 × V
CC
2 × V
CC
2 × V
CC
2 × V
CC
V
LOAD
C
L
30 pF 30 pF 50 pF 50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
V
CC
V
CC
V
CC
V
CC
V
I
VCC/2 VCC/2 VCC/2 VCC/2
V
M
tr/t
f
2 ns
2 ns2.5 ns2.5 ns
INPUTS
SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION
8
Figure 5. Load Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION
V
CC
V
O
GND
B or A
C
A or B
V
CC
V
C
V
IH
R
L
C
L
50
0.1 µF
(On)
VCC/2
RL/CL: 600 /50 pF RL/CL: 50 /5 pF
f
in
V
CC
V
O1
1B or 1A
C
1A or 1B
V
CC
V
C
V
IH
C
L
50 pF
50
0.1 µF
(On)
VCC/2
20log10(VO2/VI1) or 20log10(VO1/VI2)
f
in
R
L
600
R
in
600
V
O2
GND
2B or 2A
C
2A or 2B
V
C
V
IL
R
in
600
(Off)
VCC/2
R
L
600
C
L
50 pF
Figure 6. Frequency Response (Switch On)
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Figure 7. Crosstalk (Between Switches)
9
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V
CC
V
O
GND
B or A
C
A or B
V
CC
V
C
C
L
50 pF
50
VCC/2
VCC/2
R
in
600
R
L
600
V
CC
V
O
GND
B or A
C
A or B
V
CC
V
C
V
IL
R
L
C
L
50
0.1 µF
(Off)
VCC/2
RL/CL: 600 /50 pF RL/CL: 50 /5 pF
f
in
R
L
VCC/2
SN74LVC2G66 DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
PARAMETER MEASUREMENT INFORMATION
Figure 8. Crosstalk (Control Input, Switch Output)
10
Figure 9. Feedthrough (Switch Off)
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PARAMETER MEASUREMENT INFORMATION
V
CC
V
O
GND
B or A
C
A or B
V
CC
V
C
V
IH
R
L
10 k
C
L
50 pF
600
10 µF
(On)
VCC/2
VCC = 1.65 V , VI = 1.4 V
P-P
VCC = 2.3 V , V
I
= 2 V
P-P
VCC = 3 V , VI = 2.5 V
P-P
VCC = 4.5 V , VI = 4 V
P-P
f
in
10 µF
SN74LVC2G66
DUAL BILATERAL ANALOG SWITCH
SCES325H – JULY 2001 – REVISED JULY 2005
Figure 10. Sine-Wave Distortion
11
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
SN74LVC2G66DCTR ACTIVE SM8 DCT 8 3000 Pb-Free
SN74LVC2G66DCTRE4 ACTIVE SM8 DCT 8 3000 Pb-Free
SN74LVC2G66DCUR ACTIVE US8 DCU 8 3000 Pb-Free
SN74LVC2G66DCURE4 ACTIVE US8 DCU 8 3000 Pb-Free
SN74LVC2G66DCUT ACTIVE US8 DCU 8 250 Pb-Free
SN74LVC2G66DCUTE4 ACTIVE US8 DCU 8 250 Pb-Free
SN74LVC2G66YEAR ACTIVE WCSP YEA 8 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC2G66YEPR ACTIVE WCSP YEP 8 3000 TBD SNPB Level-1-260C-UNLIM SN74LVC2G66YZAR ACTIVE WCSP YZA 8 3000 Pb-Free
SN74LVC2G66YZPR ACTIVE WCSP YZP 8 3000 Pb-Free
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period isin effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may notbe available. OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
SNAGCU Level-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MA Y 1999 – REVISED OCT OBER 2002
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE P ACKAGE
0,65
PIN 1 INDEX AREA
0,30
0,15
8
1
3,15 2,75
5
2,90 2,70
4
1,30 MAX
M
0,13
4,25 3,75
Seating Plane
0,15 NOM
0° – 8°
Gage Plane
0,25
0,60 0,20
0,10 0,00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion D. Falls within JEDEC MO-187 variation DA.
0,10
4188781/C 09/02
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
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