TEXAS INSTRUMENTS SN74LVC1G07 Technical data

www.ti.com

3

2

4

51

NC V

CC

Y

A

GND

DBV PACKAGE

(TOP VIEW)

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

51

NC V

CC

Y

A

GND

3

2

4

51

NC

Y

A

GND

DNU

GND

V

CC

Y

A

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

423

5

V

CC

DNU − Do not use

YZV PACKAGE

(BOTTOM VIEW)

GND

V

CC

Y

A

312

4

查询SN74LVC1G07供应商

FEATURES

SN74LVC1G07

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

• Available in the Texas Instruments • I

Supports Partial-Power-Down Mode

off

NanoStar™ and NanoFree™ Packages Operation

• Supports 5-V V

• Input and Open-Drain Output Accept

Operation • Latch-Up Performance Exceeds 100 mA Per

CC

JESD 78, Class II

Voltages up to 5.5 V • ESD Protection Exceeds JESD 22

• Max tpdof 4.2 ns at 3.3 V – 2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10- µ A Max I

CC

– 200-V Machine Model (A115-A)

• ± 24-mA Output Drive at 3.3 V – 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

This single buffer/driver is designed for 1.65-V to 5.5-V V
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I

preventing damaging current backflow through the device when it is powered down.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

NanoStar, NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

operation.

CC

.The I

off

circuitry disables the outputs,

off

Copyright © 2000–2005, Texas Instruments Incorporated

www.ti.com

A Y

2 4

A Y

1 3

SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

ORDERING INFORMATION

T

A

NanoStar™ – WCSP (DSBGA)

0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)

0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA) _ _ _ _

0.23-mm Large Bump – YZV (Pb-free) CV

SOT (SOT-23) – DBV C07_

SOT (SC-70) – DCK CV_

SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G07DRLR CV_

PACKAGE

(1)

SN74LVC1G07YEAR

SN74LVC1G07YZAR

Reel of 3000 _ _ _CV_

SN74LVC1G07YEPR

SN74LVC1G07YZPR

Reel of 3000 SN74LVC1G07YZVR
Reel of 3000 SN74LVC1G07DBVR

Reel of 250 SN74LVC1G07DBVT
Reel of 3000 SN74LVC1G07DCKR
Reel of 250 SN74LVC1G07DCKT

ORDERABLE TOP-SIDE

PART NUMBER MARKING

(2)

FUNCTION TABLE

INPUT OUTPUT

A Y

H H
L L

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YZV Package)

2

www.ti.com

SN74LVC1G07

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

Supply voltage range –0.5 6.5 V

CC

V

Input voltage range

I

V

Voltage range applied to any output in the high-impedance or power-off state

O

V

Voltage range applied to any output in the high or low state

O

I

Input clamp current VI< 0 –50 mA

IK

I

Output clamp current VO< 0 –50 mA

OK

I

Continuous output current ±50 mA

O

Continuous current through V

θ

Package thermal impedance

JA

T

Storage temperature range –65 150 °C

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of V
(4) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

is provided in the recommended operating conditions table.

CC

(1)

MIN MAX UNIT

–0.5 6.5 V

(2)

(2) (3)

or GND ±100 mA

CC

–0.5 6.5 V
–0.5 6.5 V

DBV package 206
DCK package 252

(4)

DRL package 142
YEA/YZA package 154
YEP/YZP package 132
YZV package 116

°C/W

3

www.ti.com

SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Recommended Operating Conditions

V

V

V

V
V

I

∆ t/ ∆ v Input transition rise or fall rate V

T

(1) All unused inputs of the device must be held at V

Supply voltage V

CC

High-level input voltage V

IH

Low-level input voltage V

IL

Input voltage 0 5.5 V

I

Output voltage 0 5.5 V

O

Low-level output current 16 mA

OL

Operating free-air temperature –40 85 ° C

A

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

or GND to ensure proper device operation. Refer to the TI application report,

CC

MIN MAX UNIT

Operating 1.65 5.5
Data retention only 1.5
V

= 1.65 V to 1.95 V 0.65 × V

CC

V

= 2.3 V to 2.7 V 1.7

CC

V

= 3 V to 3.6 V 2

CC

V

= 4.5 V to 5.5 V 0.7 × V

CC

V

= 1.65 V to 1.95 V 0.35 × V

CC

V

= 2.3 V to 2.7 V 0.7

CC

V

= 3 V to 3.6 V 0.8

CC

V

= 4.5 V to 5.5 V 0.3 × V

CC

V

= 1.65 V 4

CC

V

= 2.3 V 8

CC

V

= 3 V

CC

V

= 4.5 V 32

CC

V

= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20

CC

= 3.3 V ± 0.3 V 10 ns/V

CC

V

= 5 V ± 0.5 V 5

CC

CC

CC

CC

CC

24

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS V

IOL= 100 µ A 1.65 V to 5.5 V 0.1
IOL= 4 mA 1.65 V 0.45

V

OL

IOL= 8 mA 2.3 V 0.3
IOL= 16 mA 0.4
IOL= 24 mA 0.55

IOL= 32 mA 4.5 V 0.55
I
I
I
∆ I
C
C

(1) All typical values are at V

A input VI= 5.5 V or GND 0 to 5.5 V ± 5 µ A

I
off
CC

CC
i
o

VIor VO= 5.5 V 0 ± 10 µ A
VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 µ A
One input at V
VI= V

CC

VO= V

CC

– 0.6 V, Other inputs at V

CC

or GND 3 V to 5.5 V 500 µ A

CC

or GND 3.3 V 4 pF

or GND 3.3 V 5 pF

= 3.3 V, TA= 25 ° C.

CC

CC

3 V

MIN TYP

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )

V

= 1.8 V V

PARAMETER UNIT

t

pd

FROM TO

(INPUT) (OUTPUT)

A Y 2.4 8.3 1 5.5 1.5 4.2 1 3.5 ns

CC

± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V

MIN MAX MIN MAX MIN MAX MIN MAX

= 2.5 V V

CC

= 3.3 V V

CC

(1)

MAX UNIT

V

= 5 V

CC

4

www.ti.com

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Operating Characteristics

TA= 25 ° C

V

= 1.8 V V

PARAMETER TEST CONDITIONS UNIT

C

Power dissipation capacitance f = 10 MHz 3 3 4 6 pF

pd

CC

TYP TYP TYP TYP

= 2.5 V V

CC

= 3.3 V V

CC

SN74LVC1G07

= 5 V

CC

5

www.ti.com

V

M

t

h

t

su

From Output

Under Test

C

L

(see Note A)

LOAD CIRCUIT

S1

V

LOAD

Open

GND

R

L

R

L

Data Input

Timing Input

V

I

0 V

V

I

0 V

0 V

t

w

Input

VOLTAGE W AVEFORMS

SETUP AND HOLD TIMES

VOLTAGE W AVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE W AVEFORMS

PULSE DURATION

t

PLH

t

PHL

t

PHL

t

PLH

V

OH

V

OH

V

OL

V

OL

V

I

0 V

Input

Output
Waveform 1
S1 at V

LOAD

(see Note B)

Output
Waveform 2
S1 at V

LOAD

(see Note B)

V

OL

t

PZL

t

PZH

t

PLZ

t

PHZ

V

LOAD

/2

0 V

VOL + V

∆

V

LOAD/2

− V

∆

≈0 V

V

I

VOLTAGE W AVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

Output

Output

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, t

PLZ

and t

PZL

are the same as t

pd

.

F. t

PZL

is measured at V

M

.

G. t

PLZ

is measured at V

OL

+ V∆.

H. All parameters and waveforms are not applicable to all devices.

Output

Control

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

M

V

I

V

M

V

M

1.8 V ± 0.15 V

2.5 V ± 0.2 V

3.3 V ± 0.3 V
5 V ± 0.5 V

1 kΩ
500 Ω
500 Ω
500 Ω

V

CC

R

L

2 × V

CC

2 × V

CC

6 V

2 × V

CC

V

LOAD

C

L

30 pF
30 pF
50 pF
50 pF

0.15 V

0.15 V

0.3 V

0.3 V

V

∆

V

CC

V

CC

3 V

V

CC

V

I

VCC/2
VCC/2

1.5 V

VCC/2

V

M

tr/t

f

≤ 2 ns

≤ 2 ns
≤ 2.5 ns
≤ 2.5 ns

INPUT

t

PZL

(see Notes E and F)

t

PLZ

(see Notes E and G)

t

PHZ/tPZH

V

LOAD

V

LOAD

V

LOAD

TEST S1

V

LOAD

/2

SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

PARAMETER MEASUREMENT INFORMATION

(OPEN DRAIN)

6

Figure 1. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com

12-Oct-2005

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package
Drawing

Pins Package

Qty

Eco Plan

SN74LVC1G07DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &

no Sb/Br)

SN74LVC1G07DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &

no Sb/Br)

SN74LVC1G07DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DCKT ACTIVE SC70 DCK 5 250 Green (RoHS &

no Sb/Br)

SN74LVC1G07DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS &

no Sb/Br)

SN74LVC1G07DRLR ACTIVE SOP DRL 5 4000 Green (RoHS &

no Sb/Br)

SN74LVC1G07DRLRG4 ACTIVE SOP DRL 5 4000 Green (RoHS &

no Sb/Br)
SN74LVC1G07YEAR ACTIVE WCSP YEA 5 3000 TBD SNPB Level-1-260C-UNLIM
SN74LVC1G07YEPR ACTIVE WCSP YEP 5 3000 TBD SNPB Level-1-260C-UNLIM
SN74LVC1G07YZAR ACTIVE WCSP YZA 5 3000 Pb-Free

SN74LVC1G07YZPR ACTIVE WCSP YZP 5 3000 Pb-Free

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(RoHS)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

SNAGCU Level-1-260C-UNLIM

SNAGCU Level-1-260C-UNLIM

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

12-Oct-2005

Addendum-Page 2

MECHANICAL DATA

MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002

DCK (R-PDSO-G5) PLASTIC SMALL-OUTLINE P ACKAGE

0,65

1,10

0,80

1 3

2,15
1,85

45

0,10
0,00

0,30
0,15

1,40
1,10

0,10

2,40
1,80

Seating Plane

M

0,13 NOM

Gage Plane

0,15

0°–8°

0,10

0,46
0,26

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-203

4093553-2/D 01/02

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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