TEXAS INSTRUMENTS SN74LVC1G07 Technical data

www.ti.com

3

2

4

51

NC V

CC

Y

A

GND

DBV PACKAGE

(TOP VIEW)

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

51

NC V

CC

Y

A

GND

3

2

4

51

NC

Y

A

GND

DNU

GND

V

CC

Y

A

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

423

5

V

CC

DNU − Do not use

YZV PACKAGE

(BOTTOM VIEW)

GND

V

CC

Y

A

312

4

查询SN74LVC1G07供应商

FEATURES

SN74LVC1G07

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

• Available in the Texas Instruments • I

Supports Partial-Power-Down Mode

off

NanoStar™ and NanoFree™ Packages Operation

• Supports 5-V V

• Input and Open-Drain Output Accept

Operation • Latch-Up Performance Exceeds 100 mA Per

CC

JESD 78, Class II

Voltages up to 5.5 V • ESD Protection Exceeds JESD 22

• Max tpdof 4.2 ns at 3.3 V – 2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10- µ A Max I

CC

– 200-V Machine Model (A115-A)

• ± 24-mA Output Drive at 3.3 V – 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

This single buffer/driver is designed for 1.65-V to 5.5-V V
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I

preventing damaging current backflow through the device when it is powered down.

PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

NanoStar, NanoFree are trademarks of Texas Instruments.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

operation.

CC

.The I

off

circuitry disables the outputs,

off

Copyright © 2000–2005, Texas Instruments Incorporated

www.ti.com

A Y

2 4

A Y

1 3

SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

ORDERING INFORMATION

T

A

NanoStar™ – WCSP (DSBGA)

0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)

0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)

0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA) _ _ _ _

0.23-mm Large Bump – YZV (Pb-free) CV

SOT (SOT-23) – DBV C07_

SOT (SC-70) – DCK CV_

SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G07DRLR CV_

PACKAGE

(1)

SN74LVC1G07YEAR

SN74LVC1G07YZAR

Reel of 3000 _ _ _CV_

SN74LVC1G07YEPR

SN74LVC1G07YZPR

Reel of 3000 SN74LVC1G07YZVR
Reel of 3000 SN74LVC1G07DBVR

Reel of 250 SN74LVC1G07DBVT
Reel of 3000 SN74LVC1G07DCKR
Reel of 250 SN74LVC1G07DCKT

ORDERABLE TOP-SIDE

PART NUMBER MARKING

(2)

FUNCTION TABLE

INPUT OUTPUT

A Y

H H
L L

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YZV Package)

2

www.ti.com

SN74LVC1G07

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

V

Supply voltage range –0.5 6.5 V

CC

V

Input voltage range

I

V

Voltage range applied to any output in the high-impedance or power-off state

O

V

Voltage range applied to any output in the high or low state

O

I

Input clamp current VI< 0 –50 mA

IK

I

Output clamp current VO< 0 –50 mA

OK

I

Continuous output current ±50 mA

O

Continuous current through V

θ

Package thermal impedance

JA

T

Storage temperature range –65 150 °C

stg

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of V
(4) The package thermal impedance is calculated in accordance with JESD 51-7.

(2)

is provided in the recommended operating conditions table.

CC

(1)

MIN MAX UNIT

–0.5 6.5 V

(2)

(2) (3)

or GND ±100 mA

CC

–0.5 6.5 V
–0.5 6.5 V

DBV package 206
DCK package 252

(4)

DRL package 142
YEA/YZA package 154
YEP/YZP package 132
YZV package 116

°C/W

3

www.ti.com

SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Recommended Operating Conditions

V

V

V

V
V

I

∆ t/ ∆ v Input transition rise or fall rate V

T

(1) All unused inputs of the device must be held at V

Supply voltage V

CC

High-level input voltage V

IH

Low-level input voltage V

IL

Input voltage 0 5.5 V

I

Output voltage 0 5.5 V

O

Low-level output current 16 mA

OL

Operating free-air temperature –40 85 ° C

A

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

(1)

or GND to ensure proper device operation. Refer to the TI application report,

CC

MIN MAX UNIT

Operating 1.65 5.5
Data retention only 1.5
V

= 1.65 V to 1.95 V 0.65 × V

CC

V

= 2.3 V to 2.7 V 1.7

CC

V

= 3 V to 3.6 V 2

CC

V

= 4.5 V to 5.5 V 0.7 × V

CC

V

= 1.65 V to 1.95 V 0.35 × V

CC

V

= 2.3 V to 2.7 V 0.7

CC

V

= 3 V to 3.6 V 0.8

CC

V

= 4.5 V to 5.5 V 0.3 × V

CC

V

= 1.65 V 4

CC

V

= 2.3 V 8

CC

V

= 3 V

CC

V

= 4.5 V 32

CC

V

= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20

CC

= 3.3 V ± 0.3 V 10 ns/V

CC

V

= 5 V ± 0.5 V 5

CC

CC

CC

CC

CC

24

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS V

IOL= 100 µ A 1.65 V to 5.5 V 0.1
IOL= 4 mA 1.65 V 0.45

V

OL

IOL= 8 mA 2.3 V 0.3
IOL= 16 mA 0.4
IOL= 24 mA 0.55

IOL= 32 mA 4.5 V 0.55
I
I
I
∆ I
C
C

(1) All typical values are at V

A input VI= 5.5 V or GND 0 to 5.5 V ± 5 µ A

I
off
CC

CC
i
o

VIor VO= 5.5 V 0 ± 10 µ A
VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 µ A
One input at V
VI= V

CC

VO= V

CC

– 0.6 V, Other inputs at V

CC

or GND 3 V to 5.5 V 500 µ A

CC

or GND 3.3 V 4 pF

or GND 3.3 V 5 pF

= 3.3 V, TA= 25 ° C.

CC

CC

3 V

MIN TYP

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )

V

= 1.8 V V

PARAMETER UNIT

t

pd

FROM TO

(INPUT) (OUTPUT)

A Y 2.4 8.3 1 5.5 1.5 4.2 1 3.5 ns

CC

± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V

MIN MAX MIN MAX MIN MAX MIN MAX

= 2.5 V V

CC

= 3.3 V V

CC

(1)

MAX UNIT

V

= 5 V

CC

4

www.ti.com

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

Operating Characteristics

TA= 25 ° C

V

= 1.8 V V

PARAMETER TEST CONDITIONS UNIT

C

Power dissipation capacitance f = 10 MHz 3 3 4 6 pF

pd

CC

TYP TYP TYP TYP

= 2.5 V V

CC

= 3.3 V V

CC

SN74LVC1G07

= 5 V

CC

5