ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (DW, NS), Shrink
Small-Outline (DB), Thin Very Small-Outline
(DGV), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Flat (W) Packages, Chip
Carriers (FK), and DIPs (J)
description
These octal buffers/line drivers are designed for
2-V to 5.5-V V
The ’L V244A devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters.
These devices are organized as two 4-bit line
drivers with separate output-enable (OE
When OE
is low, the device passes data from the
A inputs to the Y outputs. When OE
outputs are in the high-impedance state.
operation.
CC
) inputs.
is high, the
SN74LV244A. . . DB, DGV, DW, NS, OR PW PACKAGE
SN54LV244A...J OR W PACKAGE
(TOP VIEW)
1OE
1
1A1
2
2Y4
3
1A2
4
2Y3
5
1A3
6
2Y2
7
1A4
8
9
2Y1
GND
SN54LV244A. . . FK PACKAGE
1A2
2Y3
1A3
2Y2
1A4
10
(TOP VIEW)
2Y4
1A1
3212019
4
5
6
7
8
910111213
2Y1
GND
20
19
18
17
16
15
14
13
12
11
V
1OE
2A1
CC
1Y4
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
18
17
16
15
14
2A22OE
1Y1
2A4
1Y2
2A3
1Y3
T o ensure the high-impedance state during power up or power down, OE
should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54LV244A is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74LV244A is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
INPUTS
OEA
LHH
LLL
HXZ
OUTPUT
Y
Copyright 1998, Texas Instruments Incorporated
1
SN54LV244A, SN74LV244A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS383B – SEPTEMBER 1997 – REVISED JUNE 1998
logic symbol
1OE
1A1
1A2
1A3
1A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
†
1
2
4
6
8
EN
18
16
14
12
1Y1
1Y2
1Y3
1Y4
2OE
2A1
2A2
2A3
2A4
logic diagram (positive logic)
1
1OE
218
1A1
416
1A2
1Y1
1Y2
2OE
2A1
2A2
19
11
13
15
17
19
119
137
EN
2Y1
2Y2
9
2Y1
7
2Y2
5
2Y3
3
2Y4
614
1A3
812
1A4
1Y3
1Y4
155
2A3
173
2A4
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range applied in the high or low state, V
Output voltage range applied in high-impedance or power-off state, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 7 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage25.525.5V
CC
VCC = 2 V1.51.5
p
p
Input voltage05.505.5V
I
p
p
p
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs
VCC = 2.3 V to 2.7 VVCC× 0.7VCC× 0.7
VCC = 3 V to 3.6 VVCC× 0.7VCC× 0.7
VCC = 4.5 V to 5.5 VVCC× 0.7VCC× 0.7
VCC = 2 V0.50.5
VCC = 2.3 V to 2.7 VVCC× 0.3VCC× 0.3
VCC = 3 V to 3.6 VVCC× 0.3VCC× 0.3
VCC = 4.5 V to 5.5 VVCC× 0.3VCC× 0.3
High or low state0V
3-state05.505.5
VCC = 2 V–50–50µA
VCC = 2.3 V to 2.7 V–2–2
VCC = 3 V to 3.6 V–8–8
VCC = 4.5 V to 5.5 V–16–16
VCC = 2 V5050µA
VCC = 2.3 V to 2.7 V22
VCC = 3 V to 3.6 V88
VCC = 4.5 V to 5.5 V1616
VCC = 2.3 V to 2.7 V02000200
VCC = 3 V to 3.6 V01000100
VCC = 4.5 V to 5.5 V020020
, literature number SCBA004.
CC
0V
CC
mA
mA
ns/V
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54LV244A, SN74LV244A
PARAMETER
TEST CONDITIONS
V
UNIT
V
V
V
V
C
V
V
GND
pF
PARAMETER
UNIT
C
pF
ns
PARAMETER
UNIT
C
pF
ns
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS383B – SEPTEMBER 1997 – REVISED JUNE 1998
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV244ASN74LV244A
MINTYPMAXMINTYPMAX
p
I
I
I
I
OH
OL
I
OZ
CC
off
i
CC
IOH = –50 µA2 V to 5.5 VVCC–0.1VCC–0.1
IOH = –2 mA2.3 V22
IOH = –8 mA3 V2.482.48
IOH = –16 mA4.5 V3.83.8
IOL = 50 µA2 V to 5.5 V0.10.1
IOL = 2 mA2.3 V0.40.4
IOL = 8 mA3 V0.440.44
IOL = 16 mA4.5 V0.550.55
VI = VCC or GND5.5 V±1±1µA
VO = VCC or GND5.5 V±5±5µA
VI = VCC or GND,IO = 05.5 V2020µA
VI or VO = 0 to 5.5 V0 V2020µA
=
or
I
CC
3.3 V2.32.3
5 V2.32.3
switching characteristics over recommended operating free-air temperature range,
= 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
tpd*AY7.512.5115115
ten*
t
*
dis
t
pd
t
en
t
dis
†
t
sk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
Skew between any two outputs of the same package switching in the same direction
OE
OE
AY9.515.3118118
OE
OE
Y
Y9.114.1116116
Y
Y
CL = 15 pF
p
= 50
L
TA = 25°CSN54LV244ASN74LV244A
MINTYPMAXMINMAXMINMAX
8.914.6117117
10.817.8121121
13.419.2121121
22
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
tpd*AY5.48.4110110
ten*
t
*
dis
t
pd
t
en
t
dis
†
t
sk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
Skew between any two outputs of the same package switching in the same direction
OE
OE
AY6.811.9113.5113.5
OE
OE
Y
Y7.611113113
Y
Y
CL = 15 pF
p
= 50
L
TA = 25°CSN54LV244ASN74LV244A
MINTYPMAXMINMAXMINMAX
6.310.6112.5112.5
7.814.1116116
1116118118
1.51.5
ns
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
UNIT
C
50 pF
ns
PARAMETER
UNIT
C
d
Power dissi ation ca acitance
C
L
MHz
F
SN54LV244A, SN74LV244A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS383B – SEPTEMBER 1997 – REVISED JUNE 1998
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
tpd*AY3.95.516.516.5
ten*
t
*
dis
t
pd
t
en
t
dis
†
t
sk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
Skew between any two outputs of the same package switching in the same direction
OE
OE
AY4.97.518.518.5
OE
OE
Y
Y6.512.2113.5113.5
Y
Y
CL = 15 pF
p
=
L
TA = 25°CSN54LV244ASN74LV244A
MINTYPMAXMINMAXMINMAX
4.57.318.518.5
5.69.3110.5110.5
8.814.2115.5115.5
11
ns
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 5: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage2.31V
Low-level dynamic input voltage0.99V
= 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
CC
OL
OL
OH
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSV
p
p
p
p
= 50 F,f = 10
SN74LV244A
MINTYPMAX
0.55V
–0.5V
2.9V
TYPUNIT
CC
3.3 V14
5 V16
p
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54LV244A, SN74LV244A
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS383B – SEPTEMBER 1997 – REVISED JUNE 1998
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
(see Note A)
Test
Point
C
L
From Output
Under Test
(see Note A)
V
RL = 1 kΩ
C
L
S1
CC
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
t
w
Input
Input
In-Phase
Output
Out-of-Phase
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. t
F. t
G. t
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
50% V
CC
t
PLH
50% V
CC
t
PHL
50% V
CC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
PLZ
PZL
PHL
and t
and t
and t
are the same as t
PHZ
are the same as ten.
PZH
are the same as tpd.
PLH
3-STATE AND OPEN-DRAIN OUTPUTS
50% V
50% V
CC
dis
t
PHL
50% V
t
PLH
50% V
.
LOAD CIRCUIT FOR
V
CC
CC
0 V
V
CC
0 V
V
OH
CC
V
OL
V
OH
CC
V
OL
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
50% V
CC
t
CC
CC
h
50% V
50% V
CC
CC
VOL + 0.3 V
VOH – 0.3 V
t
su
50% V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
50% V
CC
t
PZL
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
t
PLZ
50% V
t
PHZ
50% V
V
CC
0 V
V
CC
0 V
V
CC
0 V
≈ V
V
OL
V
OH
≈ 0 V
CC
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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