PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7432N ACTIVE PDIP N 14 25 Pb-Free
SN7432N ACTIVE PDIP N 14 25 Pb-Free
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
4-Jun-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
no Sb/Br)
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
4-Jun-2007
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
4-Jun-2007
(3)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
4-Jun-2007
(3)
SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device Package Pins Site Reel
Diameter
(mm)
SN74LS32DBR DB 14 MLA 330 16 8.2 6.6 2.5 12 16 Q1
SN74LS32DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1
SN74LS32NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1
SN74S32DR D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1
SN74S32NSR NS 14 MLA 330 16 8.2 10.5 2.5 12 16 Q1
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
19-May-2007
Pin1
Quadrant
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
SN74LS32DBR DB 14 MLA 342.9 336.6 28.58
SN74LS32DR D 14 MLA 342.9 336.6 28.58
SN74LS32NSR NS 14 MLA 342.9 336.6 28.58
SN74S32DR D 14 MLA 342.9 336.6 28.58
SN74S32NSR NS 14 MLA 342.9 336.6 28.58
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
5962-9557401QCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
5962-9557401QDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30501B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N/AforPkgType
JM38510/30501BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N/AforPkgType
JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N/AforPkgType
JM38510/30501SCA ACTIVE CDIP J 14 1 TBD A42 SNPB N/AforPkgType
JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30501SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN7432N ACTIVE PDIP N 14 25 Pb-Free
SN7432N ACTIVE PDIP N 14 25 Pb-Free
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free
SN7432NE4 ACTIVE PDIP N 14 25 Pb-Free
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS32D ACTIVE SOIC D 14 50 Green (RoHS &
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
no Sb/Br)
SN74LS32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32D ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DE4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DG4 ACTIVE SOIC D 14 50 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
9-Oct-2007
(3)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DR ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32N ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32NE4 ACTIVE PDIP N 14 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSR ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5432J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ5432W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
9-Oct-2007
(3)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
SN74LS32DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74S32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS32DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LS32DR SOIC D 14 2500 346.0 346.0 33.0
SN74LS32NSR SO NS 14 2000 346.0 346.0 33.0
SN74S32DR SOIC D 14 2500 346.0 346.0 33.0
SN74S32NSR SO NS 14 2000 346.0 346.0 33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
(11,63)
(16,76)
(19,32)(18,78)
(24,43)
(29,59)
0.358
(9,09)
0.458
(10,31)
0.660
(12,58)
0.761
(12,58)
0.962
1.165
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
0.495
0.495
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
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