Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Shrink Small-Outline (PW), and
Ceramic Flat (W) Packages, Ceramic Chip
Carriers (FK), and Standard Plastic (N) and
Ceramic (J) 300-mil DIPs
description
The ’HC4040 are 12-stage asynchronous binary
counters with the outputs of all stages available
externally. A high level at the clear (CLR) input
asynchronously clears the counter and resets all
outputs low. The count is advanced on a
high-to-low transition at the clock (CLK) input.
Applications include time-delay circuits, counter
controls, and frequency-dividing circuits.
The SN54HC4040 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74HC4040 is characterized for
operation from –40°C to 85°C.
11
10
†
RCTR12
0
CT=0
CT
11
logic symbol
CLR
CLK
13
12
14
15
SN54HC4040 . . . J OR W PACKAGE
SN74HC4040 . . . D, DB, N, OR PW PACKAGE
SN54HC4040 . . . FK PACKAGE
Q
E
Q
G
NC
Q
D
Q
C
9
Q
A
7
Q
B
6
Q
C
5
Q
D
3
Q
E
2
Q
F
4
Q
G
Q
H
Q
I
Q
J
Q
K
1
Q
L
NC – No internal connection
(TOP VIEW)
Q
1
L
Q
2
F
Q
3
E
Q
4
G
5
Q
D
6
Q
C
7
Q
B
GND
8
(TOP VIEW)
F
QQNC
3212019
4
5
6
7
8
910111213
B
Q
L
GND
NC
16
15
14
13
12
11
10
9
CC
V
A
Q
V
CC
Q
K
Q
J
Q
H
Q
I
CLR
CLK
Q
A
K
Q
18
17
16
15
14
CLK
Q
J
Q
H
NC
Q
I
CLR
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
Pin numbers shown are for the D, DB, J, N, PW, and W packages.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally ,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
Supply voltage256256V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage0V
I
Output voltage0V
O
Input transition (rise and fall) time
Operating free-air temperature–55125–4085°C
A
VCC = 4.5 V
VCC = 6 V4.24.2
VCC = 2 V00.500.5
VCC = 4.5 V
VCC = 6 V01.801.8
VCC = 2 V0100001000
VCC = 4.5 V
VCC = 6 V04000400
3.153.15
01.3501.35
CC
CC
05000500
0V
0V
CC
CC
V
V
V
V
ns
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54HC4040SN74HC4040
MINTYPMAXMINMAXMINMAX
V
V
V
V
I
I
C
OH
OL
I
CC
i
CC
2 V1.91.9981.91.9
IOH = –20 µA
VI = VIH or V
VI = VIH or V
VI = VCC or 06 V±0.1±100±1000±1000nA
VI = VCC or 0,IO = 06 V816080µA
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°CSN54HC4040SN74HC4040
CC
MINMAXMINMAXMINMAX
2 V05.503.704.3
f
clock
t
su
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
Clock frequency
Setup time, CLR inactive before CLK
FROMTO
(INPUT)(OUTPUT)
f
max
t
pd
t
PHL
t
t
CLKQ
CLRAny
CLK high or low
CLR high
A
Any
4.5 V
6 V033022025
2 V90135115
4.5 V182723
6 V152320
2 V7010590
4.5 V142118
6 V121815
2 V609075
4.5 V121815
6 V101513
CC
MINTYPMAXMINMAXMINMAX
2 V5.5103.74.3
4.5 V28451922
6 V33532225
2 V62150225190
4.5 V16304538
6 V12263832
2 V63140210175
4.5 V17284235
6 V13243630
2 V287511095
4.5 V8152219
6 V6131916
028019022
TA = 25°CSN54HC4040SN74HC4040
MHz
ns
MHz
ns
ns
ns
operating characteristics, TA = 25°C
4
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitanceNo load88pF
pd
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50%
Test
Point
CL = 50 pF
(see Note A)
t
h
50%50%
From Output
Under Test
LOAD CIRCUIT
Reference
Input
t
su
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
90%90%
t
r
VOLTAGE WAVEFORMS
SN54HC4040, SN74HC4040
12-BIT ASYNCHRONOUS BINARY COUNTERS
SCLS160B – DECEMBER 1982 – REVISED MA Y 1997
V
0 V
V
0 V
CC
CC
V
CC
0 V
V
50%50%
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
High-Level
Pulse
Low-Level
Pulse
Input
V
CC
0 V
V
CC
10%10%
0 V
t
f
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
t
t
PLH
PHL
50%
t
w
50%
VOLTAGE WAVEFORMS
PULSE DURATIONS
90%90%
t
r
50%50%
10%10%
t
f
VOLTAGE WAVEFORMS
50%
t
50%
50%
t
PHL
PLH
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, f
D. The outputs are measured one at a time with one input transition per measurement.
E. t
PLH
and t
PHL
is measured when the input duty cycle is 50%.
max
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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