Package Options Include Plastic
Small-Outline (DW), Thin Shrink
Small-Outline (PW), and Ceramic Flat (W)
Packages, Ceramic Chip Carriers (FK), and
Standard Plastic (N) and Ceramic (J)
300-mil DIPs
description
These circuits are positive-edge-triggered D-type
flip-flops with a direct clear (CLR) input.
Information at the data (D) inputs meeting the
setup time requirements is transferred to the
Q outputs on the positive-going edge of the clock
(CLK) pulse. Clock triggering occurs at a
particular voltage level and is not directly related
to the transition time of the positive-going pulse.
When CLK is at either the high or low level, the
D input has no effect at the output.
The SN54HC273 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74HC273 is characterized for
operation from –40°C to 85 °C.
SN54HC273 ...J OR W PACKAGE
SN74HC273 ...DW, N, OR PW PACKAGE
SN54HC273 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
(TOP VIEW)
1
CLR
2
1Q
3
1D
4
2D
5
2Q
6
3Q
7
3D
8
4D
9
4Q
GND
10
(TOP VIEW)
1D1QCLR
3212019
4
5
6
7
8
910111213
4Q
CLK
GND
20
19
18
17
16
15
14
13
12
11
V
5Q
CC
V
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
8Q
18
17
16
15
14
5D
CC
8D
7D
7Q
6Q
6D
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each flip-flop)
INPUTS
CLRCLKD
LXXL
H↑HH
H↑LL
HLXQ
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OUTPUT
Q
0
Copyright 1997, Texas Instruments Incorporated
1
SN54HC273, SN74HC273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS136B – DECEMBER 1982 – REVISED MA Y 1997
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
†
1
CLR
11
CLK
3
1D
4
2D2Q
7
3D
8
4D4Q
13
5D5Q
14
6D6Q
17
7D7Q
18
8D8Q
R
C1
1D
logic diagram (positive logic)
CLK
1D
11
3
1D
C1
R
2D
3D
4
1D
C1
R
7
1D
C1
R
4D
5D
8
1D
C1
R
13
1D
R
C1
12
15
16
19
2
5
6
9
6D
14
1D
R
1Q
3Q
C1
7D
17
1D
R
C1
8D
18
1D
C1
R
1
CLR
2
1Q
2Q
5
3Q
logic diagram, each flip-flop (positive logic)
C
D
CLK(I)
R
TG
C
C
TG
C
C
C
6
4Q
9
TG
12
5Q
C
C
TG
15
6Q
C
C
7Q
16
19
8Q
Q
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
SN54HC273, SN74HC273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS136B – DECEMBER 1982 – REVISED MA Y 1997
absolute maximum ratings over operating free-air temperature range
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°CSN54HC273SN74HC273
CC
MINMAXMINMAXMINMAX
2 V050404
f
clock
t
h
Clock frequency
p
Hold time, data after CLK
CLR low
CLK high or low
Data
CLR inactive
4.5 V
6 V032021025
2 V80120100
4.5 V162420
6 V142017
2 V80120100
4.5 V162420
6 V142017
2 V100150125
4.5 V203025
6 V172521
2 V100150125
4.5 V203025
6 V172521
2 V000
4.5 V000
6 V000
027018021
MHz
ns
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
V
UNIT
SN54HC273, SN74HC273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS136B – DECEMBER 1982 – REVISED MA Y 1997
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROMTO
(INPUT)(OUTPUT)
f
max
t
PHL
t
pd
t
t
CLRAny
CLKAny
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitance per flip-flopNo load35pF
pd
Any
CC
2 V51144
4.5 V27501821
6 V32602125
2 V55160240200
4.5 V15324840
6 V12274134
2 V56160240200
4.5 V15324840
6 V13274134
2 V387511095
4.5 V8152219
6 V6131916
TA = 25°CSN54HC273SN74HC273
MINTYPMAXMINMAXMINMAX
MHz
ns
ns
ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54HC273, SN74HC273
OCTAL D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS136B – DECEMBER 1982 – REVISED MA Y 1997
PARAMETER MEASUREMENT INFORMATION
50%
Test
Point
CL = 50 pF
(see Note A)
t
h
50%50%
From Output
Under Test
LOAD CIRCUIT
Reference
Input
t
su
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
90%90%
t
r
VOLTAGE WAVEFORMS
V
0 V
V
0 V
CC
CC
V
CC
0 V
V
50%50%
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
High-Level
Pulse
Low-Level
Pulse
Input
V
CC
0 V
V
CC
10%10%
0 V
t
f
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
t
t
PLH
PHL
50%
t
w
50%
VOLTAGE WAVEFORMS
PULSE DURATIONS
90%90%
t
r
50%50%
10%10%
t
f
VOLTAGE WAVEFORMS
50%
50%
50%
t
PHL
t
PLH
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, f
D. The outputs are measured one at a time with one input transition per measurement.
E. t
PLH
and t
PHL
is measured when the input duty cycle is 50%.
max
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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