High-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
D
Low Power Consumption, 80-µA Max I
SN54HC245 ...J OR W PACKAGE
SN74HC245 . . . DB, DW, N, NS, OR PW PACKAGE
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
(TOP VIEW)
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
CC
CC
D
Typical t
D
±6-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
= 12 ns
pd
SN54HC245 ...FK PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
B8
V
B7
A2A1DIR
3212019
4
5
6
7
8
910111213
A8
CC
OE
18
17
16
15
14
B6
GND
B1
B2
B3
B4
B5
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The
control-function implementation minimizes external timing requirements.
The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses are effectively isolated.
ORDERING INFORMA TION
T
A
PDIP – NTube of 20SN74HC245NSN74HC245N
°
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
SOP – NSReel of 2000SN74HC245NSRHC245
°
SSOP – DBReel of 2000SN74HC245DBRHC245
CDIP – JTube of 20SNJ54HC245JSNJ54HC245J
CFP – WT ube of 85SNJ54HC245WSNJ54HC245W
LCCC – FKTube of 55SNJ54HC245FKSNJ54HC245FK
PACKAGE
†
Tube of 25SN74HC245DW
Reel of 2000SN74HC245DWR
Tube of 70SN74HC245PW
Reel of 2000SN74HC245PWR
Reel of 250SN74HC245PWT
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
SN54HC245, SN74HC245
OPERATION
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D – DECEMBER 1982 – REVISED AUGUST 2003
logic diagram (positive logic)
1
DIR
2
A1
FUNCTION TABLE
INPUTS
OEDIR
LLB data to A bus
LHA data to B bus
HXIsolation
19
18
OE
B1
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54HC245SN74HC245
(INPUT)
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
(INPUT)
(OUTPUT)
(OUTPUT)
MINTYPMAXMINMAXMINMAX
2 V40105160130
4.5 V15213226
6 V12182722
2 V125230340290
4.5 V23466858
6 V20395849
2 V74200300250
4.5 V25406050
6 V21345143
2 V20609075
4.5 V8121815
6 V6101513
TA = 25°CSN54HC245SN74HC245
MINTYPMAXMINMAXMINMAX
2 V54135200170
4.5 V18274034
6 V15233429
2 V150270405335
4.5 V31548167
6 V25466956
2 V45210315265
4.5 V17426353
6 V13365345
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
4
Power dissipation capacitance per transceiverNo load40pF
pd
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
SN54HC245, SN74HC245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS131D – DECEMBER 1982 – REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
50%
t
PHL
t
PLH
S1
S2
50%50%
10%10%
Test
From Output
Under Test
(see Note A)
Input
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Input
50%
INPUT RISE AND FALL TIMES
Point
C
L
LOAD CIRCUIT
t
PLH
t
PHL
VOLTAGE WAVEFORMS
90%90%
t
r
VOLTAGE WAVEFORM
R
L
90%90%
t
r
50%50%
10%10%
t
f
CC
t
f
V
0 V
50%50%
CC
t
PLZ
10%
t
PHZ
90%
S2
V
CC
0 V
≈V
V
OL
V
OH
≈0 V
CC
PARAMETERC
t
Output
Control
Output
Output
t
t
t
PZH
t
PZL
t
PHZ
t
PLZ
PZL
PZH
t
en
t
dis
tpd or t
V
CC
0 V
V
OH
10%10%
V
OL
t
f
V
90%90%
V
t
r
(Low-Level
OH
OL
Enabling)
Waveform 1
(See Note B)
Waveform 2
(See Note B)
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
R
L
1 kΩ
1 kΩ
50%
VOLTAGE WAVEFORMS
L
50 pF
or
150 pF
50 pF
50 pF
or
150 pF
≈V
50%
50%
CC
S1
OpenClosed
ClosedOpen
OpenClosed
ClosedOpen
OpenOpen––
50%
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. t
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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