Texas Instruments SN54HC244J, SN74HC244ADBLE, SN74HC244ADBR, SN74HC244APWLE, SN74HC244APWR Datasheet

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SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130B – DECEMBER 1982 – REVISED MA Y 1997
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
D
High-Current Outputs Drive up to 15 LSTTL Loads
D
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
description
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244 are organized as two 4-bit buffers/drivers with separate output-enable (OE
) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE
is high, the outputs are in the
high-impedance state. The SN54HC244 is characterized for operation
over the full military temperature range of –55°C to 125°C. The SN74HC244 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
OE A
Y
L H H L LL H X Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
1OE
1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1
GND
V
CC
2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1
SN54HC244 ...J OR W PACKAGE
SN74HC244 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4 5 6 7 8
18 17 16 15 14
1Y1 2A4 1Y2 2A3 1Y3
1A2 2Y3 1A3 2Y2 1A4
SN54HC244 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1
V
CC
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS
SCLS130B – DECEMBER 1982 – REVISED MA Y 1997
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic symbol
2
1A1
4
1A2
6
1A3
8
1A4
EN
1
1Y1
18
1Y2
16
1Y3
14
1Y4
12
11
2A1
13
2A2
15
2A3
17
2A4
EN
19
2Y1
9
2Y2
7
2Y3
5
2Y4
3
1OE
2OE
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1
2
4
6
8
19
11
13
15
17
3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2OE
1OE
absolute maximum ratings over operating free-air temperature range
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
(VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 2): DB package 115°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 128°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
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