Package Options Include Plastic
Small-Outline (D), Thin Shrink
Small-Outline (PW), and Ceramic Flat (W)
Packages, Ceramic Chip Carriers (FK), and
Standard Plastic (N) and Ceramic (J)
300-mil DIPs
description
SN54HC165, SN74HC165
8-BIT PARALLEL-LOAD SHIFT REGISTERS
SCLS116C – DECEMBER 1982 – REVISED MAY 1997
SN54HC165 ...J OR W PACKAGE
SN74HC165 . . . D, N, OR PW PACKAGE
SH/LD
CLK
Q
GND
(TOP VIEW)
1
2
E
3
F
4
G
5
H
6
7
H
8
16
15
14
13
12
11
10
9
V
CC
CLK INH
D
C
B
A
SER
Q
H
The ’HC165 are 8-bit parallel-load shift registers
that, when clocked, shift the data toward a serial
(Q
) output. Parallel-in access to each stage is
H
SN54HC165 . . . FK PACKAGE
(TOP VIEW)
provided by eight individual direct data (A–H)
inputs that are enabled by a low level at the
shift/load (SH/LD) input. The ’HC165 also feature
a clock-inhibit (CLK INH) function and a
complementary serial (Q
) output.
H
Clocking is accomplished by a low-to-high
transition of the clock (CLK) input while SH/LD
is
held high and CLK INH is held low. The functions
of CLK and CLK INH are interchangeable. Since
a low CLK and a low-to-high transition of CLK INH
also accomplish clocking, CLK INH should be
changed to the high level only while CLK is high.
Parallel loading is inhibited when SH/LD
is held
CLK
3212019
4
E
5
F
6
NC
7
G
8
H
910111213
H
Q
NC – No internal connection
SH/LD
NC
NC
GND
CC
V
CLK INH
18
17
16
15
14
H
Q
SER
D
C
NC
B
A
high. While SH/LD is low, the parallel inputs to the
register are enabled independently of the levels of
the CLK, CLK INH, or serial (SER) inputs.
The SN54HC165 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74HC165 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
INPUTS
SH/LD
†
Shift = content of each internal register shifts
toward serial output QH. Data at SER is
shifted into the first register.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally ,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
Supply voltage256256V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage0V
I
Output voltage0V
O
Input transition (rise and fall) time
Operating free-air temperature–55125–4085°C
A
VCC = 4.5 V
VCC = 6 V4.24.2
VCC = 2 V00.500.5
VCC = 4.5 V
VCC = 6 V01.801.8
VCC = 2 V0100001000
VCC = 4.5 V
VCC = 6 V04000400
3.153.15
01.3501.35
CC
CC
05000500
0V
0V
CC
CC
V
V
V
V
ns
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54HC165SN74HC165
MINTYPMAXMINMAXMINMAX
V
V
V
V
I
I
C
OH
OL
I
CC
CC
2 V1.91.9981.91.9
IOH = –20 µA
VI = VIH or V
VI = VIH or V
VI = VCC or 06 V±0.1±100±1000±1000nA
VI = VCC or 0,IO = 06 V816080µA
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°CSN54HC165SN74HC165
CC
MINMAXMINMAXMINMAX
2 V0604.205
f
clock
t
su
Clock frequency
SH/LD low
CLK high or low
SH/LD high before CLK
SER before CLK
Setup timeCLK INH low before CLK
CLK INH high before CLK
Data before SH/LD
SER data after CLK
PAR data after SH/LD
4.5 V
6 V036025029
2 V80120100
4.5 V162420
6 V142017
2 V80120100
4.5 V162420
6 V142017
2 V80120100
4.5 V162420
6 V142017
2 V406050
4.5 V81210
6 V7109
2 V100150125
4.5 V203025
6 V172521
2 V406050
4.5 V81210
6 V7109
2 V100150125
4.5 V203025
6 V172621
2 V555
4.5 V555
6 V555
2 V555
4.5 V555
6 V555
031021025
MHz
ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54HC165, SN74HC165
PARAMETER
V
UNIT
8-BIT PARALLEL-LOAD SHIFT REGISTERS
SCLS116C – DECEMBER 1982 – REVISED MAY 1997
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54HC165SN74HC165
MINTYPMAXMINMAXMINMAX
MHz
ns
ns
f
max
t
pd
t
t
FROMTO
(INPUT)(OUTPUT)
SH/LDQH or Q
CLKQH or Q
HQH or Q
Any
CC
2 V6134.25
4.5 V31502125
6 V36622529
2 V80150225190
H
H
H
4.5 V20304538
6 V16263832
2 V75150225190
4.5 V15304538
6 V13263832
2 V75150225190
4.5 V15304538
6 V13263832
2 V387511095
4.5 V8152219
6 V6131916
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitanceNo load75pF
pd
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50%
Test
Point
CL = 50 pF
(see Note A)
t
h
50%50%
From Output
Under Test
LOAD CIRCUIT
Reference
Input
t
su
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
90%90%
t
r
VOLTAGE WAVEFORMS
SN54HC165, SN74HC165
8-BIT PARALLEL-LOAD SHIFT REGISTERS
SCLS116C – DECEMBER 1982 – REVISED MAY 1997
V
0 V
V
0 V
CC
CC
V
CC
0 V
V
50%50%
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
High-Level
Pulse
Low-Level
Pulse
Input
V
CC
0 V
V
CC
10%10%
0 V
t
f
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
t
t
PLH
PHL
50%
t
w
50%
VOLTAGE WAVEFORMS
PULSE DURATIONS
90%90%
t
r
50%50%
10%10%
t
f
VOLTAGE WAVEFORMS
50%
t
50%
50%
t
PHL
PLH
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, f
D. The outputs are measured one at a time with one input transition per measurement.
E. t
PLH
and t
PHL
is measured when the input duty cycle is 50%.
max
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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