Designed Specifically for High-Speed
Memory Decoders and Data Transmission
Systems
D
Incorporate Three Enable Inputs to Simplify
Cascading and/or Data Reception
D
Package Options Include Plastic
Small-Outline (D), Thin Shrink
Small-Outline (PW), and Ceramic Flat (W)
Packages, Ceramic Chip Carriers (FK), and
Standard Plastic (N) and Ceramic (J)
300-mil DIPs
description
The ’HC138 are designed to be used in
high-performance memory-decoding or datarouting applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can be used to
minimize the effects of system decoding. When
employed with high-speed memories utilizing a
fast enable circuit, the delay times of these
decoders and the enable time of the memory are
usually less than the typical access time of the
memory. This means that the effective system
delay introduced by the decoders is negligible.
The conditions at the binary-select inputs at the
three enable inputs select one of eight output
lines. Two active-low and one active-high enable
inputs reduce the need for external gates or
inverters when expanding. A 24-line decoder can
be implemented without external inverters and a
32-line decoder requires only one inverter. An
enable input can be used as a data input for
demultiplexing applications.
SN54HC138 ...J OR W PACKAGE
SN74HC138 . . . D, N, OR PW PACKAGE
SN54HC138 ...FK PACKAGE
C
G
2A
NC
G
2B
G1
NC – No internal connection
(TOP VIEW)
A
1
B
2
C
3
2A
G
4
5
G
2B
6
G1
7
Y7
GND
8
(TOP VIEW)
BANC
3212019
4
5
6
7
8
910111213
Y7
GND
NC
16
15
14
13
12
11
10
9
CC
V
Y6
V
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y0
18
17
16
15
14
Y5
CC
Y1
Y2
NC
Y3
Y4
The SN54HC138 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74HC138 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROMTO
(INPUT)(OUTPUT)
A, B, or CAny Y
pd
EnableAny Y
t
t
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitanceNo load85pF
pd
Any
CC
2 V67180270225
4.5 V18365445
6 V15314638
2 V66155235195
4.5 V18314739
6 V15264033
2 V387511095
4.5 V8152219
6 V6131916
TA = 25°CSN54HC138SN74HC138
MINTYPMAXMINMAXMINMAX
ns
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
LOAD CIRCUIT
Input
NOTES: A. CL includes probe and test-fixture capacitance.
90%90%
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. t
PLH
and t
PHL
Test
Point
CL = 50 pF
(see Note A)
50%50%
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
V
CC
10%10%
0 V
t
f
Input
In-Phase
Output
Out-of-Phase
Output
V
50%
t
PLH
90%90%
t
PHL
50%50%
10%10%
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORMS
50%
t
PHL
50%50%
t
r
t
PLH
t
f
CC
0 V
V
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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