Package Options Include Plastic
Small-Outline (D) and Ceramic Flat (W)
Packages, Ceramic Chip Carriers (FK), and
Standard Plastic (N) and Ceramic (J) DIPs
description
The ’HC1 12 devices contain two independent J-K
negative-edge-triggered flip-flops. A low level at
the preset (PRE
resets the outputs regardless of the levels of the
other inputs. When PRE
(high), data at the J and K inputs meeting the
setup time requirements are transferred to the
outputs on the negative-going edge of the clock
(CLK) pulse. Clock triggering occurs at a voltage
level and is not directly related to the rise time of
CLK. Following the hold-time interval, data at the
J and K inputs may be changed without affecting
the levels at the outputs. These versatile flip-flops
perform as toggle flip-flops by tying J and K high.
The SN54HC112 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74HC112 is characterized for
operation from –40°C to 85°C.
) or clear (CLR) inputs sets or
and CLR are inactive
PRECLRCLKJKQQ
LHXXXHL
HLXXXLH
LLXXXH
HH↓LLQ
HH↓HLHL
HH↓LHLH
HH↓HHToggle
HHHXXQ
†
This configuration is unstable; that is, it does not persist
when either PRE
SN54HC112 ...J OR W PACKAGE
SN74HC112 ...D OR N PACKAGE
1CLK
1PRE
GND
SN54HC112 . . . FK PACKAGE
1J
1PRE
NC
1Q
1Q
FUNCTION TABLE
INPUTS
or CLR returns to its inactive (high) level.
NC – No internal connection
OUTPUTS
†
H
Q
0
Q
0
(TOP VIEW)
1
1K
2
1J
3
4
5
1Q
6
1Q
7
2Q
8
(TOP VIEW)
1K
1CLK
NC
3212019
4
5
6
7
8
910111213
2Q
GND
†
0
0
NC
16
15
14
13
12
11
10
9
CC
2QV
V
CC
1CLR
2CLR
2CLK
2K
2J
2PRE
2Q
1CLR
18
17
16
15
14
2PRE
2CLR
2CLK
NC
2K
2J
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
1
SN54HC112, SN74HC112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS099C – DECEMBER 1982 – REVISED APRIL 1999
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, N, and W packages.
†
1J
1K
2J
2K
4
3
1
2
15
10
11
13
12
14
S
1J
C1
1K
R
1PRE
1CLK
1CLR
2PRE
2CLK
2CLR
logic diagram, each flip-flop (positive logic)
PRE
J
C
5
1Q
6
1Q
9
2Q
7
2Q
C
CLK
CLR
TG
K
C
C
C
TG
C
C
TG
C
C
TG
C
Q
Q
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
‡
SN54HC112, SN74HC112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS099C – DECEMBER 1982 – REVISED APRIL 1999
absolute maximum ratings over operating free-air temperature range
Supply voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally ,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage256256V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage0V
I
Output voltage0V
O
Input transition (rise and fall) time
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs
VCC = 4.5 V
VCC = 6 V4.24.2
VCC = 2 V00.500.5
VCC = 4.5 V
VCC = 6 V01.801.8
VCC = 2 V0100001000
VCC = 4.5 V
VCC = 6 V04000400
, literature number SCBA004.
3.153.15
01.3501.35
CC
CC
05000500
0V
0V
CC
CC
V
V
V
V
ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54HC112, SN74HC112
PARAMETER
TEST CONDITIONS
V
UNIT
V
UNIT
twPulse duration
ns
tsuSetup time before CLK↓
ns
↓
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS099C – DECEMBER 1982 – REVISED APRIL 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54HC112SN74HC112
MINTYPMAXMINMAXMINMAX
V
V
V
V
I
I
C
OH
OL
I
CC
CC
2 V1.9 1.9981.91.9
IOH = –20 µA
VI = VIH or V
VI = VIH or V
VI = VCC or 06 V±0.1±100±1000±1000nA
VI = VCC or 0,IO = 06 V48040µA
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°CSN54HC112SN74HC112
CC
MINMAXMINMAXMINMAX
2 V53.44
f
clock
t
h
Clock frequency
p
Hold time, data after CLK
PRE or CLR low
CLK high or low
Data (J, K)
PRE or CLR inactive
4.5 V
6 V292024
2 V100150125
4.5 V203025
6 V172521
2 V100150125
4.5 V203025
6 V172521
2 V100150125
4.5 V203025
6 V172521
2 V100150125
4.5 V203025
6 V172521
2 V000
4.5 V000
6 V000
251720
MHz
ns
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
V
UNIT
t
ns
SN54HC112, SN74HC112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS099C – DECEMBER 1982 – REVISED APRIL 1999
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROMTO
(INPUT)(OUTPUT)
f
max
PRE or CLRQ or Q
pd
CLKQ or Q
t
t
Q or Q
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitanceNo load35pF
pd
CC
2 V5103.44
4.5 V25501720
6 V29602024
2 V54165245205
4.5 V16334941
6 V13284235
2 V56125185155
4.5 V16253731
6 V13213126
2 V297511095
4.5 V9152219
6 V8131916
TA = 25°CSN54HC112SN74HC112
MINTYPMAXMINMAXMINMAX
MHz
ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN54HC112, SN74HC112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCLS099C – DECEMBER 1982 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
High-Level
50%
Test
Point
CL = 50 pF
(see Note A)
t
h
Low-Level
Input
V
CC
0 V
V
50%50%
CC
10%10%
0 V
t
f
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
From Output
Under Test
LOAD CIRCUIT
Reference
Input
t
su
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
90%90%
t
r
VOLTAGE WAVEFORMS
Pulse
Pulse
50%
t
50%
VOLTAGE WAVEFORMS
PULSE DURATIONS
50%
t
PLH
90%90%
t
PHL
50%50%
10%10%
VOLTAGE WAVEFORMS
V
0 V
V
0 V
CC
CC
V
CC
0 V
V
50%50%
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
50%
w
50%
50%
t
PHL
t
r
t
PLH
t
f
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, f
D. The outputs are measured one at a time with one input transition per measurement.
E. t
PLH
and t
PHL
is measured when the input duty cycle is 50%.
max
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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