Combines D-Type Latches and D-Type
Flip-Flops for Operation in Transparent,
Latched, Clocked, or Clock-Enabled Mode
D
Bidirectional Interface Between GTL+
Signal Levels and LVTTL Logic Levels
D
Equivalent to ’16601 Function
D
LVTTL Interfaces Are 5-V Tolerant
D
High-Drive GTL+ Outputs (100 mA)
D
LVTTL Outputs (–24 mA/24 mA)
D
Variable Edge-Rate Control (ERC) Input
Selects GTL+ Rise and Fall Times for
Optimal Data-Transfer Rate and Signal
Integrity
D
I
, Power-Up 3-State, and BIAS V
off
Support Live Insertion
D
Bus Hold on A-Port Data Inputs
D
Distributed VCC and GND-Pin Configuration
Minimizes High-Speed Switching Noise
D
Packaged in Plastic Thin Shrink
Small-Outline Package
description
The SN74GTLPH1612 is a high-drive 18-bit
universal bus transceiver (UBT) that provides
LVTTL-to-GTL+ and GTL+-to-LVTTL signal-level
translation. It allows for transparent, latched,
clocked, or clock-enabled modes of data transfer
identical to the ’16601 function. The device
provides a high-speed interface between cards
operating at LVTTL logic levels and a backplane
operating at GTL+ signal levels. High-speed
(about two times faster than standard TTL or
LVTTL) backplane operation is a direct result of
GTLP’s reduced output swing (<1 V), reduced
input threshold levels, improved differential input,
and output edge control (OEC). Improved GTLP
OEC circuits minimize bus settling time and have
been designed and tested using several
backplane models. The high drive is suitable for
driving double-terminated low-impedance
backplanes using incident-wave switching.
CC
DGG PACKAGE
OEAB
LEAB
A1
A2
GND
A3
V
CC
A4
A5
GND
A6
A7
A8
GND
A9
V
CC
A10
GND
A11
A12
GND
A13
A14
GND
A15
V
CC
A16
ERC
A17
A18
OEBA
LEBA
(TOP VIEW)
1
64
2
63
3
62
4
61
5
60
6
59
7
58
8
57
9
56
10
55
11
54
12
53
13
52
14
51
15
50
16
49
17
48
18
47
19
46
20
45
21
44
22
43
23
42
24
41
25
40
26
39
27
38
28
37
29
36
30
35
31
34
32
33
CEAB
CLKAB
B1
B2
GND
B3
BIAS V
B4
B5
GND
B6
B7
B8
GND
B9
V
CC
B10
GND
B11
B12
GND
B13
B14
GND
B15
V
REF
B16
GND
B17
B18
CLKBA
CEBA
CC
PRODUCT PREVIEW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OEC and UBT are trademarks of Texas Instruments Incorporated.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1999, Texas Instruments Incorporated
1
SN74GTLPH1612
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
description (continued)
GTL+ is the Texas Instruments derivative of the Gunning transceiver logic (GTL) JEDEC standard JESD 8-3.
The AC specification of the SN74GTLPH1612 is given only at the preferred higher noise margin GTL+, but the
user has the flexibility of using this device at either GTL (VTT = 1.2 V and V
and V
= 1 V) signal levels.
REF
Normally, the B port operates at GTL or GTL+ levels, while the A-port and control inputs are compatible with
LVTTL logic levels and are 5-V tolerant. V
This device is fully specified for live-insertion applications using I
is the reference input voltage for the B port.
REF
, power-up 3-state, and BIAS VCC. The I
off
circuitry disables the outputs, preventing damaging current backflow through the device when it is powered
down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power
down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port
input/output connections, preventing disturbance of active data on the backplane during card insertion or
removal, and permits true live-insertion capability.
High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC
input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to
optimize system data-transfer rate and signal integrity to the backplane load.
Active bus-hold circuitry is provided to hold unused or undriven L VTTL inputs at a valid logic state. Use of pullup
or pulldown resistors with the bus-hold circuitry is not recommended.
= 0.8 V) or GTL+ (VTT = 1.5 V
REF
off
When VCC is between 0 and 1.5 V , the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, the output-enable (OE) input should be tied to V
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of
the driver.
The SN74GTLPH1612 is characterized for operation from –40°C to 85°C.
functional description
The SN74GTLPH1612 is a high-drive (100 mA) 36-bit UBT containing D-type latches and D-type flip-flops for
data-path operation in transparent, latched, clocked, or clock-enabled modes and can replace any of the
functions shown in Table 1.
PRODUCT PREVIEW
FUNCTION8 BIT9 BIT10 BIT16 BIT18 BIT
Transceiver’245, ’623, ’645’863’861’16245, ’16623’16863
Buffer/Driver’241, ’244, ’541’827’16241, ’16244, ’16541’16825
Latched transceiver’543’16543’16472
Latch’373, ’573’843’841’16373’16843
Registered transceiver’646, ’652’16646, ’16652’16474
Flip-flop’374, ’574’821’16374
Standard UBT’16500, ’16501
Universal bus driver’16835
Registered transceiver with CLK enable’2952’16470, ’16952
Flip-flop with CLK enable’377’823’16823
Standard UBT with CLK enable’16600, ’16601
Table 1. SN74GTLPH1612 UBT Replacement Functions
CC
SN74GTLPH1612 UBT replaces all above functions
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MODE
Latched storage of A data
Transparent
Clocked storage of A data
SN74GTLPH1612
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
functional description (continued)
Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA),
and clock (CLKAB and CLKBA) inputs. The clock can be controlled by clock-enable (CEAB and CEBA) inputs.
OEAB and OEBA control the 18 bits of data for the A-to-B and B-to-A directions, respectively.
For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the
A data is latched if CEAB
in the latch/flip-flop on the low-to-high transition of CLKAB if CEAB also is low. When OEAB is low, the outputs
are active. When OEAB is high, the outputs are in the high-impedance state.
Data flow for B to A is similar to that for A to B, buses OEBA, LEBA, CLKBA, and CEBA.
is low and CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51.
5. Normal connection sequence is GND first, BIAS VCC = 3.3 V second, and VCC = 3.3 V , I/O, control inputs, VTT and V
last. However, if the B-port I/O precharge is not required, the acceptable connection sequence is GND first and VCC = 3.3 V,
BIAS VCC = 3.3 V , I/O, control inputs, VTT and V
6. VTT and RTT can be adjusted to accommodate backplane impedances as long as they do not exceed the DC absolute IOL ratings.
Similarly , V
Implications of Slow or Floating CMOS Inputs
can be adjusted to optimize noise margins, but normally is 2/3 VTT.
REF
GTL0.740.80.87
GTL+0.8711.1
B portV
Except B portV
B portV
ERC
Except B port and ERC2
B portV
ERC
Except B port and ERC0.8
A port24
B port100
, literature number SCBA004.
(any order) last. When VCC is connected, the BIAS VCC circuitry is disabled.
REF
+0.05
REF
VCC –0.6V
CC
GND0.6
REF
TT
CC
–0.05
REF
V
V
(any order)
PRODUCT PREVIEW
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
3.15 V
V
V
V
V
‡
V
3.45 V
V
CC
I
O
C
pF
SN74GTLPH1612
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
electrical characteristics over recommended operating free-air temperature range for GTL+
(unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYP†MAXUNIT
V
IK
V
OH
OL
I
I
I
BHL
I
BHH
I
BHLO
I
BHHO
I
CC
∆I
CC
C
i
io
†
All typical values are at VCC = 3.3 V, TA = 25°C.
‡
For I/O ports, the parameter II includes the off-state output leakage current.
§
The bus-hold circuit can sink at least the minimum low sustaining current at VILmax. I
then raising it to VILmax.
¶
The bus-hold circuit can source at least the minimum high sustaining current at VIHmin. I
then lowering it to VIHmin.
#
An external driver must source at least I
||
An external driver must sink at least I
k
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
A port
A port
B portVCC = 3.15 V
B port
A-port and
control inputs
§
A portVCC = 3.15 V,VI = 0.8 V75µA
¶
A portVCC = 3.15 V,VI = 2 V–75µA
#
A portVCC = 3.45 V,VI = 0 to V
||
A portVCC = 3.45 V,VI = 0 to V
A or B port
k
Control inputsVI = 3.15 V or 0pF
A portVO = 3.15 V or 0
B portVO = 1.5 V or 0
VCC = 3.15 V,II = –18 mA–1.2V
VCC = 3.15 V to 3.45 V,IOH = –100 µAVCC–0.2
=
CC
VCC = 3.15 V to 3.45 V,IOL = 100 µA0.2
= 3.15
CC
VCC = 3.45 V,VI = 0 to 1.5 V±10
=
CC
=
= 3.45 V,
VI (A-port or control input) = VCC or GND
VI (B port) = VTT or GND
VCC = 3.45 V, One A-port or control input at VCC – 0.6 V,
Other A-port or control inputs at VCC or GND
live-insertion specifications for A port over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMINMAXUNIT
I
off
I
OZPU
I
OZPD
VCC = 0,BIAS VCC = 0,VI or VO = 0 to 5.5 V100µA
VCC = 0 to 1.5 V,VO = 0.5 V to 3 V,OE = 0±100µA
VCC = 1.5 V to 0,VO = 0.5 V to 3 V,OE = 0±100µA
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
SN74GTLPH1612
I
(BIAS VCC)
BIAS V
V
port)
V
twPulse duration
ns
tsuSetup time
ns
thHold time
ns
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
live-insertion specifications for B port over recommended operating free-air temperature range
PARAMETERTEST CONDITIONSMINMAXUNIT
I
off
I
OZPU
I
OZPD
CC
V
O
I
O
timing requirements over recommended ranges of supply voltage and operating free-air
temperature, V
f
clock
Clock frequencyMHz
p
VCC = 0,BIAS VCC = 0,VI or VO = 0 to 1.5 V100µA
VCC = 0 to 1.5 V,VO = 0.5 V to 1.5 V,OE = 0±100µA
VCC = 1.5 V to 0,VO = 0.5 V to 1.5 V,OE = 0±100µA
VCC = 0 to 3.15 V
VCC = 3.15 V to 3.45 V
VCC = 0,BIAS VCC = 3.3 V0.951.05V
VCC = 0,BIAS VCC = 3.15 V to 3.45 V,VO (B port) = 0.6 V–1µA
= 1.5 V and V
TT
= 1 V for GTL+ (normal mode) (unless otherwise noted)
REF
= 3.15 V to 3.45 V,
CC
LEAB or LEBA high
CLKAB or CLKBA high or low
A before CLKAB↑
B before CLKBA↑
A before LEAB↓, CLK = don’t care
B before LEBA↓, CLK = don’t care
CEAB before CLKAB↑
CEBA before CLKBA↑
A after CLKAB↑
B after CLKBA↑
A after LEAB↓, CLK = don’t care
B after LEBA↓, CLK = don’t care
CEAB after CLKAB↑
CEBA after CLKBA↑
p
(B
O
= 0 to 1.5
MINMAXUNIT
5mA
10µA
PRODUCT PREVIEW
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
A
B
tpdLEAB
B
ns
CLKAB
B
OEAB
B
Slo
ns
OEAB
B
Fast
ns
t
,
ns
t
,
ns
OEBA
A
ns
SN74GTLPH1612
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, V
PARAMETER
f
max
t
en
t
dis
t
en
t
dis
r
f
t
pd
t
en
t
†
Slow (ERC = GND) and Fast (ERC = VCC)
‡
All typical values are at VCC = 3.3 V, TA = 25°C.
dis
= 1.5 V and V
TT
REF
FROM
(INPUT)
Rise time, B outputs
(0.6 V to 1.3 V)
Fall time, B outputs
(1.3 V to 0.6 V)
B
LEBA
CLKBA
= 1 V for GTL+ (normal mode) (see Figure 1)
TO
(OUTPUT)
Ans
EDGE RATE
Slow
Fast
Slow
Fast
Slow
Fast
Slow
Fast
Slow
Fast
†
w
MIN TYP‡MAXUNIT
MHz
PRODUCT PREVIEW
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
SN74GTLPH1612
18-BIT LVTTL-TO-GTL+ ADJUSTABLE-EDGE-RATE
UNIVERSAL BUS TRANSCEIVER
SCES287 – OCTOBER 1999
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT FOR A OUTPUTS
Input
Input
t
PLH
Output
Input
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
(A port to B port)
1 V1 V
500 Ω
500 Ω
t
w
1 V1 V
PRODUCT PREVIEW
t
PLH
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V1.5 V
(B port to A port)
S1
6 V
GND
t
PHL
t
PHL
Open
3 V
0 V
3 V
0 V
V
V
1.5 V
0 V
V
V
OH
OL
OH
OL
TEST
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Timing
Waveform 1
(see Note B)
Waveform 2
S1 at GND
(see Note B)
S1
Open
6 V
GND
Input
Data
Input
(VM = 1.5 V for A port and 1 V for B port)
(VH = 3 V for A port and 1.5 V for B port)
Output
Control
Output
S1 at 6 V
Output
V
M
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
From Output
Under Test
LOAD CIRCUIT FOR B OUTPUTS
1.5 V
t
su
1.5 V1.5 V
1.5 V
1.5 V
(A port)
12.5 Ω
CL = 30 pF
(see Note A)
t
h
V
M
VOL + 0.3 V
VOH – 0.3 V
1.5 V
t
PLZ
t
PHZ
Test
Point
3 V
0 V
V
H
0 V
3 V
0 V
3 V
V
OL
V
OH
≈0 V
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≤ 1 V/ns.
D. The outputs are measured one at a time with one transition per measurement.
This data sheet is specified for and tested to the lump load shown in Figure 1. However, the designer probably uses
this GTLP device in a distributed load like that shown in Figure 2, in which actual B-port backplane switching
characteristics are different. Therefore, the device is modeled as shown in Figure 3, which very closely matches the
results obtained using Figure 2. Switching characteristics based on Figure 3 more closely match actual backplane
design requirements.
V
TT
TT
.25”.875”
R
.625”.625”
1”1”
Figure 2. Test Backplane Model
.875”.25”
.625”.625”
Conn.
Drvr
Slot 1Slot 2Slot 15Slot 16
Conn.Conn.Conn.
1”1”
Rcvr
Rcvr
Rcvr
V
TT
TT
R
1.5 V
14 Ω
Test
Point
CL = 13 pF
From Output
Under Test
LL = 21 nH
Figure 3. Distributed-Load Circuit for B Outputs
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, V
PARAMETER
f
max
t
en
t
dis
t
en
t
dis
r
f
†
Slow (ERC = GND) and Fast (ERC = VCC)
‡
All typical values are at VCC = 3.3 V, TA = 25°C.
= 1.5 V and V
TT
REF
FROM
(INPUT)
Rise time, B outputs
(0.6 V to 1.3 V)
Fall time, B outputs
(1.3 V to 0.6 V)
= 1 V for GTL+ (see Figure 3)
TO
(OUTPUT)
EDGE RATE
Slow
Fast
Slow
Fast
Slow
Fast
Slow
Fast
Slow
Fast
†
w
MIN TYP‡MAXUNIT
MHz
PRODUCT PREVIEW
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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