Datasheet SN74CBT16390DGGR, SN74CBT16390DGVR, SN74CBT16390DL, SN74CBT16390DLR Datasheet (Texas Instruments)

FUNCTION
SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035C – OCTOBER 1997 – REVISED OCTOBER 1998
D
5- Switch Connection Between Two Ports
D
D
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
D
Latch-Up Performance Exceeds 250 mA Per JESD 17
D
Package Options Include Plastic Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV), and 300-mil Shrink Small-Outline (DL) Packages
description
The SN74CBT16390 is a 16-bit to 32-bit switch used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single path. This device can be used for memory interleaving, in which two different banks of memory must be addressed simultaneously. This also can be used to connect or isolate the PCI bus to one or two slots simultaneously.
Two output enables (OE1 data flow. When OE1 to 1B port. When OE2 to 2B port. When both OE1 A port is connected to both 1B and 2B ports. The control inputs can be driven with a 5-V CMOS, 5-V TTL, or an LVTTL driver.
The SN74CBT16390 is characterized for operation from –40°C to 85°C.
and OE2) control the
is low, A port is connected
is low, A port is connected
and OE2 are low, the
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
A1
1
2B1
2
2B2
3
A3
4
2B3
5
2B4
6
A5
7
2B5
8
2B6
9
A7
10
2B7
11
2B8
12
GND
13
V
14
CC
A9
15
2B9
16
2B10
2B12
2B13 2B14
2B15 2B16
17
A1 1
18
2B1 1
19 20 21
A13
22 23 24
A15
25 26 27
NC
28
NC
NC – No internal connection
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
1B1 1B2 A2 1B3 1B4 A4 1B5 1B6 A6 1B7 1B8 A8 GND V
CC
1B9 1B10 A10 1B1 1 1B12 A12 1B13 1B14 A14 1B15 1B16 A16 OE1 OE2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
FUNCTION TABLE
INPUTS
OE1 OE2
L L A = 1B and A = 2B
L H A = 1B H L A = 2B H H Isolation
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
1
SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035C – OCTOBER 1997 – REVISED OCTOBER 1998
logic diagram (positive logic)
A1
A16
OE1
OE2
1
31
30
29
56
32
26
1B1
2
2B1
1B16
2B16
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V Input voltage range, V
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I Package thermal impedance, θ
Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(V
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
I
(see Note 2): DGG package 81°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
DGV package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 74°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
recommended operating conditions (see Note 3)
MIN MAX UNIT
V V V T
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
2
Supply voltage 4.5 5.5 V
CC
High-level control input voltage 2 V
IH
Low-level control input voltage 0.8 V
IL
Operating free-air temperature –40 85 °C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
I
A
§
V
0
SN74CBT16390
16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035C – OCTOBER 1997 – REVISED OCTOBER 1998
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
IK
I
I
CC
I
CC
C
i
C
io(OFF)
r
on
All typical values are at VCC = 5 V, TA = 25°C.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§
Measured by the voltage drop between A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals.
Control inputs VCC = 5.5 V, One input at 3.4 V , Other input at VCC or GND 2.5 mA Control inputs VI = 3 V or 0 5 pF
switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
t
pd
t
en
t
dis
The propagation delay is based on the RC time constant of the typical on-state resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).
VCC = 4.5 V, II = –18 mA –1.2 V VCC = 0, VI = 5.5 V 10 VCC = 5.5 V, VI = 5.5 V or GND ±1 VCC = 5.5 V, IO = 0, VI = VCC or GND 3 µA
VO = 3 V or 0 5.5 pF
II = 64 mA 5 7 II = 30 mA 5 7
TO
(OUTPUT)
A or B 1.3 5.9 ns A or B 1 5.3 ns
MIN MAX UNIT
VCC = 4.5 V
=
I
VI = 2.4 V, II = 15 mA 7 12
FROM
(INPUT)
A or B B or A 0.25 ns
OE OE
µ
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
SN74CBT16390 16-BIT TO 32-BIT FET MULTIPLEXER/DEMULTIPLEXER BUS SWITCH
SCDS035C – OCTOBER 1997 – REVISED OCTOBER 1998
PARAMETER MEASUREMENT INFORMATION
dis
S1
.
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
t
PLH
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. t
F. t
G. t
1.5 V 1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
and t
PLZ PZL PLH
and t
and t
PHZ PZH
PHL
500
500
1.5 V 1.5 V
are the same as t are the same as ten. are the same as tpd.
t
PHL
7 V
Open
GND
3 V
0 V
V
OH
V
OL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TEST S1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
t
PZL
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
t
PLZ
1.5 V
t
PHZ
1.5 V
Open
7 V
Open
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3.5 V
V
OL
V
OH
0 V
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOL VE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...