Package Options Include Plastic Thin
Shrink Small-Outline (DGG), Thin Very
Small-Outline (DGV), and Shrink
Small-Outline (DL) Packages, and Ceramic
Flat (WD) Package
description
The ’CBT16244 devices provide 16 bits of
high-speed TTL-compatible bus switching in a
standard ’16244 device pinout. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
These devices are organized as four 4-bit
low-impedance switches with separate
output-enable (OE
switch is on and data can flow from port A to port
B, or vice versa. When OE
open and a high-impedance state exists between
the two ports.
The SN54CBT16244 is characterized for
operation over the full military temperature range
of –55°C to 125°C. The SN74CBT16244 is
characterized for operation from –40°C to 85°C.
) inputs. When OE is low, the
is high, the switch is
SN54CBT16244 . . . WD PACKAGE
SN74CBT16244 . . . DGG, DGV, OR DL PACKAGE
1OE
1B1
1B2
GND
1B3
1B4
V
CC
2B1
2B2
GND
2B3
2B4
3B1
3B2
GND
3B3
3B4
V
CC
4B1
4B2
GND
4B3
4B4
4OE
(TOP VIEW)
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
V
CC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
V
CC
4A1
4A2
GND
4A3
4A4
3OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each 4-bit bus switch)
INPUT
OE
LA port = B port
HZ
OUTPUTS
A, B
Copyright 1998, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54CBT16244, SN74CBT16244
UNIT
16-BIT FET BUS SWITCHES
SCDS031G – MAY 1996 – REVISED SEPTEMBER 1998
logic diagram (positive logic)
13
17
2
1B1
6
1B4
3B1
3B4
47
1A1
43
1A4
1
1OE
36
3A1
32
3A4
25
3OE
Pin numbers shown are for the DGG, DGV, and DL packages.
41
2A1
37
2A4
48
2OE
30
4A14B1
26
4A4
24
4OE
12
19
23
8
2B1
2B4
4B4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Input clamp current, I
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
2
Supply voltage45.545.5V
CC
High-level control input voltage22V
IH
Low-level control input voltage0.80.8V
IL
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER
TEST CONDITIONS
UNIT
I
A
r
§
Ω
SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031G – MAY 1996 – REVISED SEPTEMBER 1998
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54CBT16244SN74CBT16244
MIN TYP†MAXMIN TYP†MAX
V
IK
I
I
CC
Control
‡
∆I
CC
inputs
i
io(OFF)
Control
inputs
C
C
on
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
Other inputs at VCC or GND
VI = 3 V or 02.52.5pF
VO = 3 V or 0,OE = V
VCC = 4 V,VI = 2.4 V,II = 15 mA2020
VCC = 4.5 V
IO = 0,
One input at 3.4 V ,
CC
VI = 0,II = 64 mA51057
VI = 0,II = 30 mA51057
VI = 2.4 V,II = 15 mA814812
3.23µA
2.52.5mA
4.54.5pF
µ
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
SN54CBT16244SN74CBT16244
PARAMETER
¶
t
pd
t
en
t
dis
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
FROM
(INPUT)
A or BB or A0.8*0.350.25ns
OE
OE
TO
(OUTPUT)
A or B10.319.25.515.1ns
A or B9.718.25.215.4ns
VCC = 4 V
MINMAXMINMAXMINMAXMINMAX
VCC = 5 V
± 0.5 V
VCC = 4 V
VCC = 5 V
± 0.5 V
UNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54CBT16244, SN74CBT16244
16-BIT FET BUS SWITCHES
SCDS031G – MAY 1996 – REVISED SEPTEMBER 1998
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
t
PLH
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. t
F. t
G. t
1.5 V1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
and t
PLZ
PZL
PLH
and t
and t
PHZ
PZH
PHL
500 Ω
500 Ω
1.5 V1.5 V
are the same as t
are the same as ten.
are the same as tpd.
dis
.
S1
t
PHL
7 V
GND
3 V
0 V
V
OH
V
OL
Open
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
t
PZL
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
t
PLZ
1.5 V
t
PHZ
1.5 V
Open
7 V
Open
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3.5 V
V
OL
V
OH
0 V
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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