Datasheet SN74CBT16212ADGGR, SN74CBT16212ADGVR, SN74CBT16212ADL, SN74CBT16212ADLR, SNJ54CBT16212AWD Datasheet (Texas Instruments)

FUNCTION
SN54CBT16212A, SN74CBT16212A
24-BIT FET BUS-EXCHANGE SWITCHES
SCDS007M – NOVEMBER 1992 – REVISED SEPTEMBER 1998
D
5- Switch Connection Between Two Ports
D
D
Latch-Up Performance Exceeds 250 mA Per JESD 17
D
ESD Protection Exceeds 2000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV), and Shrink Small-Outline (DL) Packages, and Ceramic Flat (WD) Package
description
The ’CBT16212A devices provide 24 bits of high-speed TTL-compatible bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.
Each device operates as a 24-bit bus switch or a 12-bit bus exchanger, which provides data exchanging between the four signal ports via the data-select (S0, S1, S2) terminals.
The SN54CBT16212A is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74CBT16212A is characterized for operation from –40°C to 85°C.
SN54CBT16212A ...WD PACKAGE
SN74CBT16212A . . . DGG, DGV, OR DL PACKAGE
S0 1A1 1A2 2A1 2A2 3A1 3A2
GND
4A1 4A2 5A1 5A2 6A1 6A2 7A1 7A2
V
CC
8A1
GND
8A2 9A1 9A2
10A1 10A2
1 1A1
1 1A2 12A1 12A2
(TOP VIEW)
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
S1 S2 1B1 1B2 2B1 2B2 3B1 GND 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 GND 8B2 9B1 9B2 10B1 10B2 1 1B1 1 1B2 12B1 12B2
INPUTS
S2 S1 S0 A1 A2
L L L Z Z Disconnect L L H B1 port Z A1 port = B1 port L H L B2 port Z A1 port = B2 port
L HH Z B1 port A2 port = B1 port H LL ZB2 port A2 port = B2 port H LH Z Z Disconnect
H H L B1 port B2 port
H H H B2 port B1 port
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
FUNCTION TABLE
INPUTS/OUTPUTS
A1 port = B1 port A2 port = B2 port
A1 port = B2 port A2 port = B1 port
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1998, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
1
SN54CBT16212A, SN74CBT16212A 24-BIT FET BUS-EXCHANGE SWITCHES
SCDS007M – NOVEMBER 1992 – REVISED SEPTEMBER 1998
logic diagram (positive logic)
1A1
1A2
12A1
12A2
2
3
27
28
54
53
30
29
1B1
1B2
12B1
12B2
1
S0
56
S1
55
S2
Pin numbers shown are for the DGG, DGV, and DL packages.
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
UNIT
PARAMETER
TEST CONDITIONS
UNIT
I
A ¶
on
V
0
SN54CBT16212A, SN74CBT16212A
24-BIT FET BUS-EXCHANGE SWITCHES
SCDS007M – NOVEMBER 1992 – REVISED SEPTEMBER 1998
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V Input voltage range, V
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I Package thermal impedance, θ
(V
< 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
I
(see Note 2): DGG package 81°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
DGV package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 74°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
recommended operating conditions (see Note 3)
SN54CBT16212A SN74CBT16212A
MIN MAX MIN MAX
V V V T
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage 4 5.5 4 5.5 V
CC
High-level control input voltage 2 2 V
IH
Low-level control input voltage 0.8 0.8 V
IL
Operating free-air temperature –55 125 –40 85 °C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
SN54CBT16212A SN74CBT16212A
MIN TYP‡MAX MIN TYP‡MAX
V
IK
I
I
CC
Control
§
I
CC
inputs
i io(OFF)
Control inputs
C C
r
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals.
VCC = 4.5 V, II = –18 mA –1.2 –1.2 V VCC = 0, VI = 5.5 V 10 10 VCC = 5.5 V, VI = 5.5 V or GND ±1 ±1 VCC = 5.5 V,
VI = VCC or GND VCC = 5.5 V,
Other inputs at VCC or GND VI = 3 V or 0 2.5 2.5 pF VO = 3 V or 0, S0, S1, or S2 = V
VCC = 4 V, TYP at VCC = 4 V
VCC = 4.5 V
IO = 0,
One input at 3.4 V ,
CC
VI = 2.4 V, II = 15 mA 14 20 14 20
=
I
VI = 2.4 V, II = 15 mA 6 14 6 12
II = 64 mA 4 10 4 7 II = 30 mA 4 10 4 7
3.2 3 µA
2.5 2.5 mA
7.5 7.5 pF
µ
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
SN54CBT16212A, SN74CBT16212A 24-BIT FET BUS-EXCHANGE SWITCHES
SCDS007M – NOVEMBER 1992 – REVISED SEPTEMBER 1998
switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54CBT16212A SN74CBT16212A
PARAMETER
t
pd
t
pd
t
en
t
dis
* On products compliant to MIL-PRF-38535, this parameter is not production tested. †
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
FROM
(INPUT)
A or B B or A 0.8* 0.35 0.25 ns
S A or B 14 1.5 13 10 1.5 9.1 ns S A or B 15 1.5 13.7 10.4 1.5 9.7 ns S A or B 14.2 1.5 13.5 9.2 1.5 8.8 ns
PARAMETER MEASUREMENT INFORMATION
TO
(OUTPUT)
VCC = 4 V
MIN MAX MIN MAX MIN MAX MIN MAX
VCC = 5 V
± 0.5 V
VCC = 4 V
VCC = 5 V
± 0.5 V
UNIT
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
t
PLH
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement.
E. t F. t
G. t
1.5 V 1.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
and t
PLZ PZL PLH
and t and t
PHZ PZH
PHL
500
500
1.5 V 1.5 V
are the same as t are the same as ten. are the same as tpd.
dis
.
S1
t
PHL
7 V
Open
GND
3 V
0 V
V
OH
V
OL
Output
Control (low-level enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TEST S1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
t
PZL
1.5 V
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
t
PLZ
t
PHZ
1.5 V
Open
7 V
Open
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3.5 V
V
OL
V
OH
0 V
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...