MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
• Full Parallel Access for Loading
• Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK) and Flatpacks (W), and
Plastic and Ceramic 300-mil DIPs (J, N)
description
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the ′BCT574 are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
will be set to the logic levels that were set up at the
data (D) inputs.
SN54BCT574 ...J OR W PACKAGE
SN74BCT574 . . . DW OR N PACKAGE
SN54BCT574 . . . FK PACKAGE
3D
4D
5D
6D
7D
(TOP VIEW)
1
OE
2
1D
3
2D
4
3D
5
4D
6
5D
7
6D
8
7D
9
8D
GND
10
(TOP VIEW)
2D1DOE
3 2 1 20 19
4
5
6
7
8
910111213
20
19
18
17
16
15
14
13
12
11
V
CC
V
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
1Q
18
17
16
15
14
CC
2Q
3Q
4Q
5Q
6Q
A buffered output-enable (OE
to place the eight outputs in either a normal logic
) input can be used
8D
GND
CLK
8Q
7Q
state (high or low logic levels) or a highimpedance state. In the high-impedance state, the
outputs neither load nor drive the bus lines significantly . The high-impedance state and increased drive provide
the capability to drive bus lines without need for interface or pullup components.
The output enable (OE
) does not affect the internal operations of the flip-flops. Old data can be retained or new
data can be entered while the outputs are in the high-impedance state.
The SN54BCT574 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74BCT574 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
OECLKD
L↑HH
L↑LL
LH or LXQ
HXXZ
OUTPUT
Q
0
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
SN54BCT574, SN74BCT574
UNIT
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS074B – SEPTEMBER 1991 – REVISED NOVEMBER 1993
logic symbol
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
†
1
11
2
3
4
5
6
7
8
9
EN
1D
C1
19
18
17
16
15
14
13
12
logic diagram (positive logic)
1
OE
11
CLK
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
1D
2
To Seven Other Channels
1D
C1
19
1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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