MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
• Designed to Facilitate Incident-Wave
Switching for Line Impedances of 25 Ω
or Greater
• Distributed V
and GND Pins Minimize
CC
Noise Generated by the Simultaneous
Switching of Outputs
• Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (NT)
DW OR NT PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
1Y1
GND
1Y2
1Y3
GND
1Y4
2Y1
GND
2Y2
2Y3
GND
2Y4
1OE
1A1
1A2
V
CC
1A3
1A4
2A1
2A2
V
CC
2A3
2A4
2OE
description
This 25-Ω octal buffers and line driver is designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74BCT25240 is capable of sinking 188-mA IOL, which facilitates switching 25-Ω transmission lines on
the incident wave. The distributed VCC and GND pins minimize switching noise for more reliable system
operation.
When the output-enable (1OE and 2OE) inputs are low, the device transmits the inverted A-input data to the
Y outputs. When 1OE
and 2OE are high, the outputs are in the high-impedance state. 1OE affects only the 1Y
outputs; 2OE affects only the 2Y outputs.
The SN74BCT25240 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
LHL
LLH
HXZ
OUTPUT
A
Y
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
SN74BCT25240
25-Ω OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS101B – JUNE 1990 – REVISED NOVEMBER 1993
24
23
22
20
19
13
18
17
15
14
†
EN
1
EN
1
logic symbol
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
10
12
logic diagram (positive logic)
1OE
1
1Y1
3
1Y2
4
1Y3
6
1Y4
7
2Y1
9
2Y2
2Y3
2Y4
1A1
1A2
1A3
1A4
2OE
2A1
2A2
24
23
22
20
19
13
18
17
1
1Y1
3
1Y2
4
1Y3
6
1Y4
7
2Y1
9
2Y2
2A3
2A4
15
1412
10
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Voltage applied to any output in the disabled or power-off state, V
Voltage applied to any output in the high state, V
Input clamp current, I
Current into any output in the low state, I
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input negative-voltage rating may be exceeded if the input clamp-current rating is observed.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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