Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the level at the direction-control
(DIR) input. The output-enable (OE
used to disable the device so the buses are
effectively isolated.
The SN74BCT245 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54BCT245 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74BCT245 is characterized for
operation from 0°C to 70°C.
) input can be
SN54BCT245 ...J OR W PACKAGE
SN74BCT245 . . . DB, DW, OR N P ACKAGE
SN54BCT245 . . . FK PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
DIR
1
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
9
A8
GND
10
(TOP VIEW)
A2A1DIR
3212019
4
5
6
7
8
910111213
A8
B8
20
19
18
17
16
15
14
13
12
11
V
B7
CC
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
B6OE
CC
B1
B2
B3
B4
B5
GND
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
INPUTS
OEDIR
LLB data to A bus
LHA data to B bus
HXIsolation
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1994, Texas Instruments Incorporated
2–1
SN54BCT245, SN74BCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS013F – SEPTEMBER 1988 – REVISED APRIL 1994
19
1
2
3
4
5
6
7
8
9
†
G3
3EN1[BA]
3EN2[AB]
18
17
16
15
14
13
12
11
B1
B2
B3
B4
B5
B6
B7
B8
1
2
logic diagram (positive logic)
1
DIR
2
A1
To Seven Other Channels
19
18
OE
B1
logic symbol
OE
DIR
A1
A2
A3
A4
A5
A6
A7
A8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input voltage range: Control inputs (see Note 1)– 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Power dissipation is application dependent and is a function of supply voltage, operating temperature, the number of outputs
switching simultaneously , and output duty cycle. Because the thermal resistance of the DB package is higher than that of the DW
or N packages, the DB package may not be suitable for some applications.
t
†
NOTE 3: Load circuits and voltage waveforms are shown in Section 1.
PLZ
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
FROM
(INPUT)
TO
(OUTPUT)
R1 = 500 Ω,
R2 = 500 Ω,
TA = 25°C
′BCT245SN54BCT245SN74BCT245
MINTYPMAXMINMAXMINMAX
14.4617.217
1.54.86.61.57.61.57
1.589.41.511.21.510.9
1.5810.21.511.81.511.6
1.55.88.31.59.71.59.3
1.55.17.81.59.61.59.1
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX
†
UNIT
2–4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54BCT245, SN74BCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS013F – SEPTEMBER 1988 – REVISED APRIL 1994
TYPICAL CHARACTERISTICS
†
Figures 1 through 4 show the typical power dissipation for an SN74BCT245 over variations in outputs switching,
output frequency, and capacitive load.
POWER DISSIPATION
vs
FREQUENCY
1050
VCC = 5.5 V
TA = 70°C
900
RL = 500 Ω
Air Flow = 0
750
CL = 15 pF
600
450
300
D
P – Power Dissipation – mW
150
0
050
10203040
f – Frequency – MHz
Eight Switching
Four Switching
One Switching
POWER DISSIPATION
FREQUENCY
1400
1200
1000
D
P – Power Dissipation – mW
800
600
400
200
0
VCC = 5.5 V
TA = 70°C
RL = 500 Ω
Air Flow = 0
CL = 50 pF
0
10203040
f – Frequency – MHz
vs
Eight Switching
Four Switching
One Switching
50
Figure 1Figure 2
POWER DISSIPATION
vs
1750
VCC = 5.5 V
1500
1250
1000
D
P – Power Dissipation – mW
TA = 70°C
RL = 500 Ω
Air Flow = 0
CL = 100 pF
750
500
250
0
050
FREQUENCY
Eight Switching
10203040
f – Frequency – MHz
Figure 3Figure 4
†
The dashed lines are for the DB package only.
Four Switching
One Switching
POWER DISSIPATION
FREQUENCY
1750
1500
1250
1000
D
P – Power Dissipation – mW
VCC = 5.5 V
TA = 70°C
RL = 500 Ω
Air Flow = 0
CL = 150 pF
750
500
250
0
050
10203040
f – Frequency – MHz
vs
Eight Switching
Four Switching
One Switching
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2–5
SN54BCT245, SN74BCT245OCTAL BUS TRANSCEIVERSWITH 3-STATE OUTPUTS
SCBS013F – SEPTEMBER 1988 – REVISED APRIL 1994
2–6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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