Texas Instruments SN74ALVCH162836DGGR, SN74ALVCH162836DGVR, SN74ALVCH162836DL, SN74ALVCH162836DLR, SN74ALVCH162836GR Datasheet

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SN74ALVCH162836
20-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCES122E – JULY 1997 – REVISED JUNE 1999
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Widebus
Family
D
EPIC
(Enhanced-Performance Implanted
CMOS) Submicron Process
D
Output Port Has Equivalent 26- Series Resistors, So No External Resistors Are Required
D
Designed to Comply With JEDEC 168-Pin and 200-Pin SDRAM Buffered DIMM Specification
D
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
D
Latch-Up Performance Exceeds 250 mA Per JESD 17
D
Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
D
Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages
NOTE: For tape and reel order entry:
The DGGR package is abbreviated to GR, and the DGVR package is abbreviated to VR.
description
This 20-bit universal bus driver is designed for
1.65-V to 3.6-V VCC operation. Data flow from A to Y is controlled by the
output-enable (OE) input. The device operates in the transparent mode when the latch-enable (LE) input is low. When LE
is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE is high, the outputs are in the high-impedance state.
The output port includes equivalent 26-series resistors to reduce overshoot and undershoot. T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH162836 is characterized for operation from –40°C to 85°C.
Copyright 1999, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
OE
Y1 Y2
GND
Y3 Y4
V
CC
Y5 Y6 Y7
GND
Y8
Y9 Y10 Y11 Y12 Y13
GND
Y14 Y15 Y16
V
CC
Y17 Y18
GND
Y19 Y20
NC
CLK A1 A2 GND A3 A4 V
CC
A5 A6 A7 GND A8 A9 A10 A11 A12 A13 GND A14 A15 A16 V
CC
A17 A18 GND A19 A20 LE
NC – No internal connection
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SN74ALVCH162836 20-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS
SCES122E – JULY 1997 – REVISED JUNE 1999
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
OUTPUT
OE LE CLK A
Y
H X X X Z L LXL L L LXH H L H LL L H HH L H L or H X Y
0
Output level before the indicated steady-state input conditions were established
logic symbol
A1
55
A2
54
A3
52
A4
51
A5
49
A6
48
A7
47
A8
45
A9
44
A10
43
A11
42
A12
41
A13
40
A14
38
A15
37
A16
36
A17
34
A18
33
OE
EN1
1 56
CLK
2
Y1
3
Y2
5
Y3
1
6
Y4
8
Y5
9
Y6
10
Y7
12
Y8
13
Y9
14
Y10
15
Y11
16
Y12
17
Y13
19
Y14
20
Y15
21
Y16
23
Y17
24
Y18
C3
29
G2
LE
2C3
113D
A19
31
A20
30
26
Y19
27
Y20
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
SN74ALVCH162836
20-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
SCES122E – JULY 1997 – REVISED JUNE 1999
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
1
56
29
55
1D C1
CLK
2
To 19 Other Channels
OE
CLK
LE
A1
Y1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
(see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) –50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through each VCC or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 3): DGG package 81°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 74°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
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