TEXAS INSTRUMENTS SN74ALVC04 Technical data

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D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
1 2 3 4 5 6 7
9 8
1A 1Y 2A 2Y 3A 3Y
GND
V
CC
6A 6Y 5A 5Y 4A 4Y
RGY PACKAGE
(TOP VIEW)
1 14
7 8
2 3 4 5 6
11
9
6A 6Y 5A 5Y 4A
1Y 2A 2Y 3A 3Y
1A
4Y
V
GND
CC
A Y
查询SN74ALVC04D供应商
FEATURES
Operates From 1.65 V to 3.6 V
Max tpdof 2.8 ns at 3.3 V
±24-mA Output Drive at 3.3 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This hex inverter contains six independent inverters designed for 1.65-V to 3.6-V V
The SN74ALVC04 performs the Boolean function Y = A.
operation.
CC
SN74ALVC04
HEX INVERTER
SCES117J – JULY 1997 – REVISED JULY 2004
T
A
-40°C to 85°C SOP - NS Tape and reel SN74ALVC04NSR ALVC04
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ORDERING INFORMATION
PACKAGE
QFN - RGY Tape and reel SN74ALVC04RGYR VA04
SOIC - D ALVC04
TSSOP - PW VA04
TVSOP - DGV Tape and reel SN74ALVC04DGVR VA04
(1)
Tube SN74ALVC04D Tape and reel SN74ALVC04DR
Tube SN74ALVC04PW Tape and reel SN74ALVC04PWR
ORDERABLE PART NUMBER TOP-SIDE MARKING
FUNCTION TABLE
(each inverter)
INPUT OUTPUT
A Y
H L L H
LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC)
Copyright © 1997–2004, Texas Instruments Incorporated
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SN74ALVC04 HEX INVERTER
SCES117J – JULY 1997 – REVISED JULY 2004
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
V
CC
V
I
V
O
I
IK
I
OK
I
O
θ
JA
T
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) This value is limited to 4.6 V maximum. (4) The package thermal impedance is calculated in accordance with JESD 51-7. (5) The package thermal impedance is calculated in accordance with JESD 51-5.
Supply voltage range -0.5 4.6 V Input voltage range Output voltage range
(2)
(2) (3)
Input clamp current VI< 0 -50 mA Output clamp current VO< 0 -50 mA Continuous output current ±50 mA Continuous current through V
Package thermal impedance NS package
Storage temperature range -65 150 °C
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1)
MIN MAX UNIT
-0.5 4.6 V
-0.5 V
or GND ±100 mA
CC
D package DGV package
PW package RGY package
(4)
(4)
(4)
(4)
(5)
CC
+ 0.5 V
86
127
76 °C/W
113
47
RECOMMENDED OPERATING CONDITIONS
(1)
MIN MAX UNIT
V
CC
V
IH
V
IL
V
I
V
O
I
OH
I
OL
Supply voltage 1.65 3.6 V
V
= 1.65 V to 1.95 V 0.65 × V
High-level input voltage V
Low-level input voltage V
CC
= 2.3 V to 2.7 V 1.7 V
CC
V
= 2.7 V to 3.6 V 2
CC
V
= 1.65 V to 1.95 V 0.35 × V
CC
= 2.3 V to 2.7 V 0.7 V
CC
V
= 2.7 V to 3.6 V 0.8
CC
CC
Input voltage 0 3.6 V Output voltage 0 V
V
= 1.65 V -4
CC
V
= 2.3 V -12
High-level output current mA
Low-level output current mA
CC
V
= 2.7 V -12
CC
V
= 3 V -24
CC
V
= 1.65 V 4
CC
V
= 2.3 V 12
CC
V
= 2.7 V 12
CC
V
= 3 V 24
CC
t/v Input transition rise or fall rate 5 ns/V T
A
(1) All unused inputs of the device must be held at V
Operating free-air temperature -40 85 °C
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
CC
V
CC
2
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ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
IOH= -100 µA 1.65 V to 3.6 V V IOH= -4 mA 1.65 V 1.2 IOH= -6 mA 2.3 V 2
V
OH
IOH= -12 mA 2.7 V 2.2
IOH= -24 mA 3 V 2 IOL= 100 µA 1.65 V to 3.6 V 0.2 IOL= 4 mA 1.65 V 0.45
V
OL
I
I
I
CC
I
CC
C
i
(1) All typical values are at V
IOL= 6 mA 2.3 V 0.4
IOL= 12 mA
IOL= 24 mA 3 V 0.55 VI= V VI= V One input at V VI= V
or GND 3.6 V ±5 µA
CC
or GND, IO= 0 3.6 V 10 µA
CC
- 0.6 V, Other inputs at V
CC
or GND 3.3 V 3.5 pF
CC
= 3.3 V, TA= 25°C.
CC
or GND 3 V to 3.6 V 750 µA
CC
SN74ALVC04
HEX INVERTER
SCES117J – JULY 1997 – REVISED JULY 2004
CC
MIN TYP
- 0.2
CC
2.3 V 1.7 V
3 V 2.4
2.3 V 0.7
2.7 V 0.4
(1)
MAX UNIT
V
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
V
= 2.5 V V
V
= 1.8 V V
PARAMETER UNIT
t
pd
FROM TO
(INPUT) (OUTPUT)
A Y
CC
TYP MIN MAX MIN MAX MIN MAX
(1)
(1) This information was not available at the time of publication.
CC
± 0.2 V ± 0.3 V
= 2.7 V
CC
1 3 3.3 1 2.8 ns
OPERATING CHARACTERISTICS
TA= 25°C
V
PARAMETER TEST CONDITIONS UNIT
C
Power dissipation capacitance per inverter CL= 0, f = 10 MHz
pd
(1) This information was not available at the time of publication.
= 1.8 V V
CC
TYP TYP TYP
(1)
= 2.5 V V
CC
23 27.5 pF
= 3.3 V
CC
= 3.3 V
CC
3
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V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
OH
V
OL
t
h
t
su
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
Open
GND
R
L
R
L
Output
Control
(low-level
enabling)
Output Waveform 1 S1 at V
LOAD
(see Note B)
Output Waveform 2
S1 at GND
(see Note B)
t
PZL
t
PZH
t
PLZ
t
PHZ
0 V
VOL + V
VOH − V
0 V
V
I
0 V
0 V
t
w
V
I
V
I
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
Open
V
LOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as ten.
G. t
PLH
and t
PHL
are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
0 V
V
I
V
M
t
PHL
V
M
V
M
V
I
0 V
V
OH
V
OL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
V
M
V
M
t
PLH
V
LOAD
V
LOAD
/2
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 k 500 500 500
V
CC
R
L
2 × V
CC
2 × V
CC
6 V 6 V
V
LOAD
C
L
30 pF 30 pF 50 pF 50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
V
CC
V
CC
2.7 V
2.7 V
V
I
VCC/2 VCC/2
1.5 V
1.5 V
V
M
tr/t
f
2 ns
2 ns2.5 ns2.5 ns
INPUT
SN74ALVC04 HEX INVERTER
SCES117J – JULY 1997 – REVISED JULY 2004
PARAMETER MEASUREMENT INFORMATION
Figure 1. Load Circuit and Voltage Waveforms
4
PACKAGE OPTION ADDENDUM
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17-May-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
SN74ALVC04D ACTIVE SOIC D 14 50 Pb-Free
SN74ALVC04DGVR ACTIVE TVSOP DGV 14 2000 Pb-Free
SN74ALVC04DGVRE4 ACTIVE TVSOP DGV 14 2000 Pb-Free
SN74ALVC04DR ACTIVE SOIC D 14 2500 Pb-Free
SN74ALVC04NSR ACTIVE SO NS 14 2000 Pb-Free
SN74ALVC04NSRE4 ACTIVE SO NS 14 2000 TBD Call TI Call TI
SN74ALVC04PW ACTIVE TSSOP PW 14 90 Pb-Free
SN74ALVC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74ALVC04PWR ACTIVE TSSOP PW 14 2000 Pb-Free
SN74ALVC04RGYR ACTIVE QFN RGY 14 1000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
Call TI Level-2-260C-1YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
24
112
A
0,23 0,13
13
0,07
4,50 4,30
M
6,60 6,20
0,16 NOM
Gage Plane
0,25
0°8°
0,75 0,50
1,20 MAX
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
0,15 0,05
14
3,70
3,50
Seating Plane
3,50
20
5,10
4,90
0,08
5,103,70
4,90
382416
7,90
7,70
48
9,80
9,60
56
11,40
11,20
4073251/E 08/00
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15 0,05
8
1
A
DIM
14
0,10
6,60 6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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