BiCMOS (ALB) Technology Design for 3.3-V
Operation
D
Schottky Diodes on All Inputs to Eliminate
Overshoot and Undershoot
D
Industry Standard ’16244 Pinout
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
description
The SN74ALB16244 16-bit buffer and line driver
is designed for high-speed, low-voltage (3.3-V)
V
operation. This device is intended to replace
CC
the conventional driver in any speed-critical path.
The small propagation delay is achieved using a
unity gain amplifier on the input and feedback
resistors from input to output, which allows the
output to track the input with a small offset voltage.
The device can be used as four 4-bit buffers, two
8-bit buffers, or one 16-bit buffer. This device
provides true outputs and symmetrical active-low
output-enable (OE
The SN74ALB16244 is characterized for
operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each buffer)
INPUTS
OE
LHH
LLL
HXZ
OUTPUT
A
Y
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN74ALB16244
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
Input voltage range, VI: Except I/O ports (see Note 1) –0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O ports (see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Notes 1 and 2) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through each V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 3)
VCC = 3.3 V ± 0.3 V
MIN TYP‡MAX
t
pd
t
en
t
dis
‡
All typical values are at VCC = 3.3 V, TA = 25°C.
4
FROMTO
(INPUT)(OUTPUT)
A
OE
OE
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Y0.61.32ns
Y1.32.54.7ns
Y1.82.84.2ns
SN74ALB16244
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS647C – AUGUST 1995 – REVISED JUL Y 1997
OUTPUT VOLTAGE HIGH
vs
3.5
3
2.5
–100 µA
– Output Voltage – V
OH
V
2
1.5
1.522.533.54
INPUT VOLTAGE
–25 mA
–6 mA
VI – Input Voltage – V
Figure 1. VOH Over Recommended Free-Air Temperature Range
OUTPUT VOLTAGE LOW
vs
2
1.5
1
– Output Voltage – V
OL
V
0.5
0
00.511.52
INPUT VOLTAGE
25 mA
100 µA
6 mA
VI – Input Voltage – V
Figure 2. VOL Over Recommended Free-Air Temperature Range
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
SN74ALB16244
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS647C – AUGUST 1995 – REVISED JUL Y 1997
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
500 Ω
500 Ω
S1
6 V
Open
GND
TESTS1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
Open
6 V
GND
LOAD CIRCUIT
Timing
Input
t
Data
Input
Input
Output
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, trv
D. The outputs are measured one at a time with one transition per measurement.
E. t
PLZ
F. t
PZL
G. t
PLH
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V1.5 V
VOLTAGE WAVEFORMS
and t
PHZ
and t
PZH
and t
PHL
1.5 V
t
t
PLH
h
.
dis
su
1.5 V1.5 V
are the same as t
are the same as ten.
are the same as tpd.
t
PHL
3 V
0 V
3 V
0 V
Output Control
(low-level enabling)
3 V
0 V
V
OH
V
OL
Input
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PZL
1.5 V
t
PZH
1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
3 V
0 V
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
2.5 ns, tfv
3 V
0 V
3 V
V
OL
V
OH
0 V
2.5 ns.
Figure 3. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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