ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Very Small-Outline (DGV), Thin
Shrink Small-Outline (PW), and Ceramic
Flat (W) Packages, Ceramic Chip Carriers
(FK), and Standard Plastic (N) and Ceramic
(J) DIPs
description
The ’AHCU04 devices contain six independent
inverters. These devices perform the Boolean
function Y = A. Internal circuitry consists of
single-stage inverters that can be used in analog
applications such as crystal oscillators.
The SN54AHCU04 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74AHCU04 is characterized for
operation from –40°C to 85°C.
SN54AHCU04 ...J OR W PACKAGE
SN74AHCU04 . . . D, DB, DGV, N, OR PW PACKAGE
SN54AHCU04 . . . FK PACKAGE
2A
NC
2Y
NC
3A
NC – No internal connection
(TOP VIEW)
1A
1
1Y
2
2A
3
2Y
4
3A
5
6
3Y
GND
7
(TOP VIEW)
1Y1ANC
3212019
4
5
6
7
8
910111213
3Y
GND
NC
14
13
12
11
10
9
8
CC
V
4Y
V
6A
6Y
5A
5Y
4A
4Y
6A
18
17
16
15
14
4A
CC
6Y
NC
5A
NC
5Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each inverter)
INPUTAOUTPUT
Y
HL
LH
Copyright 2000, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54AHCU04, SN74AHCU04
HEX INVERTERS
SCLS234H – OCTOBER 1995 – REVISED JANUARY 2000
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
†
1
1A
3
2A2Y
5
3A3Y
9
4A4Y
11
5A5Y
13
6A6Y
1
10
12
2
1Y
4
6
8
logic diagram (positive logic)
YA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage25.525.5V
CC
VCC = 2 V1.71.7
High-level input voltage
IH
Low-level input voltage
IL
Input voltage05.505.5V
I
Output voltage0V
O
High-level output current
Low-level output current
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
VCC = 3 V
VCC = 5.5 V4.44.4
VCC = 2 V0.30.3
VCC = 3 V
VCC = 5.5 V1.11.1
VCC = 2 V–50–50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V–8–8
VCC = 2 V5050
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V88
2.42.4
0.60.6
CC
–4–4
44
0V
CC
V
V
V
m
A
m
A
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
2 V1.821.81.8
IOH = –50 mA
V
OH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
V
OL
IOL = 4 mA
IOL = 8 mA
I
I
I
CC
C
i
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
VI = VCC or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND,IO = 05.5 V22020
VI = VCC or GND5 V21010pF
3 V2.732.72.7
4.5 V44.544
3 V2.582.482.48
4.5 V3.943.83.8
2 V0.20.20.2
3 V0.30.30.3
4.5 V0.50.50.5
3 V0.360.50.44
4.5 V0.360.50.44
TA = 25°CSN54AHCU04SN74AHCU04
MINTYPMAXMINMAXMINMAX
V
V
m
A
m
A
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AHCU04, SN74AHCU04
PARAMETER
UNIT
AYC
15 pF
ns
AYC
50 pF
ns
PARAMETER
UNIT
AYC
pF
ns
AYC
pF
ns
PARAMETER
UNIT
HEX INVERTERS
SCLS234H – OCTOBER 1995 – REVISED JANUARY 2000
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
= 15
L
= 50
L
p
p
TA = 25°CSN54AHCU04SN74AHCU04
MINTYPMAXMINMAXMINMAX
5*7.1*1*8.5*18.5
5*7.1*1*8.5*18.5
7.510.6112112
7.510.6112112
TA = 25°CSN54AHCU04SN74AHCU04
MINTYPMAXMINMAXMINMAX
3.5*5.5*1*6*16.5
3.5*5.5*1*6*16.5
571818
571818
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 4: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage4V
Low-level dynamic input voltage1V
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz7.3pF
pd
= 5 V, C
CC
CC
PARAMETERTEST CONDITIONSTYPUNIT
= 50 pF, TA = 25°C (see Note 4)
L
OL
OL
OH
= 5 V, T
= 25°C
A
SN74AHCU04
MINTYPMAX
0.5V
–0.5V
4.3V
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHCU04, SN74AHCU04
HEX INVERTERS
SCLS234H – OCTOBER 1995 – REVISED JANUARY 2000
PARAMETER MEASUREMENT INFORMATION
V
Test
Point
C
L
From Output
Under Test
C
(see Note A)
RL = 1 kΩ
L
S1
CC
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
VOLTAGE WAVEFORMS
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
t
w
50% V
CC
PULSE DURATION
50% V
CC
50% V
50% V
3-STATE AND OPEN-DRAIN OUTPUTS
50% V
50% V
CC
CC
LOAD CIRCUIT FOR
V
CC
CC
0 V
V
CC
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
0 V
V
V
V
V
OH
OL
OH
OL
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
50% V
CC
t
CC
CC
h
50% V
50% V
VOL + 0.3 V
VOH – 0.3 V
CC
t
t
CC
PLZ
PHZ
t
su
50% V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
50% V
CC
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
V
CC
0 V
V
CC
0 V
V
CC
0 V
≈V
V
OL
V
OH
≈0 V
CC
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. T esting and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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