ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
D
Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Very Small-Outline (DGV), Thin
Shrink Small-Outline (PW), and Ceramic
Flat (W) Packages, Ceramic Chip Carriers
(FK), and Standard Plastic (N) and Ceramic
(J) DIPs
description
The ’AHCT125 devices are quadruple bus buffer
gates featuring independent line drivers with
3-state outputs. Each output is disabled when the
associated output-enable (OE) input is high.
When OE
data from the A input to its Y output.
T o ensure the high-impedance state during power
up or power down, OE should be tied to V
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
is low, the respective gate passes the
CC
SN54AHCT125 ...J OR W PACKAGE
SN74AHCT125 . . . D, DB, DGV, N, OR PW PACKAGE
SN54AHCT125 . . . FK PACKAGE
1Y
NC
2OE
NC
2A
NC – No internal connection
(TOP VIEW)
1OE
1
1A
2
1Y
3
2OE
4
2A
5
6
2Y
GND
7
(TOP VIEW)
1A
3212019
4
5
6
7
8
910111213
2Y
1OE
GND
NC
NC
14
13
12
11
10
9
8
V
3Y
CC
V
CC
4OE
4A
4Y
3OE
3A
3Y
4OE
18
17
16
15
14
3A
4A
NC
4Y
NC
3OE
The SN54AHCT125 is characterized for
operation over the full military temperature range
of –55°C to 125°C. The SN74AHCT125 is
characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each buffer)
INPUTS
OEA
LHH
LLL
HXZ
OUTPUT
Y
Copyright 2000, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54AHCT125, SN74AHCT125
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS264L – DECEMBER 1995 – REVISED JANUARY 2000
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
†
1OE
1A
2OE
2A
3OE
3A
4OE
4A
1
2
4
5
10
9
13
12
EN
1
logic diagram (positive logic)
1
1OE
2
1A1Y
4
2OE
5
2A2Y
3
1Y
6
2Y
8
3Y
11
4Y
3
6
10
3OE
9
3A3Y
13
4OE
12
4A4Y
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
8
11
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
SN54AHCT125, SN74AHCT125
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS264L – DECEMBER 1995 – REVISED JANUARY 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
OH
OL
I
I
I
OZ
I
CC
∆I
CC
C
i
C
o
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
†
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC.
IOH = –50 mA
IOH = –8 mA
IOL = 50 mA
IOL = 8 mA
VI = VCC or GND0 V to 5.5 V±0.1±1*±1
VO = VCC or GND5.5 V±0.25±2.5±2.5
VI = VCC or GND,IO = 05.5 V22020
One input at 3.4 V ,
†
Other inputs at VCC or GND
VI = VCC or GND5 V41010pF
VO = VCC or GND5 V15pF
5.5 V1.351.51.5mA
TA = 25°CSN54AHCT125SN74AHCT125
MINTYPMAXMINMAXMINMAX
4.44.54.44.4
3.943.83.8
0.10.10.1
0.360.440.44
m
A
m
A
m
A
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
*** On products compliant to MIL-PRF-38535, this parameter does not apply.
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 4: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage2V
Low-level dynamic input voltage0.8V
= 5 V, CL = 50 pF, TA = 25°C (see Note 4)
CC
CL = 50 pF1***1ns
OL
OL
OH
= 15
L
= 15
L
=
L
=
L
= 50
L
= 50
L
p
p
p
p
p
p
TA = 25°CSN54AHCT125SN74AHCT125
MINTYPMAXMINMAXMINMAX
3.8**5.5**1**6.5**16.5
3.8**5.5**1**6.5**16.5
3.6**5.1**1**6**16
3.6**5.1**1**6**16
4.6**6.8**1**8**18
4.6**6.8**1**8**18
5.37.518.518.5
5.37.518.518.5
5.17.11818
5.17.11818
6.18.8110110
6.18.8110110
SN74AHCT125
MINMAX
4.4V
0.8V
–0.8V
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHCT125, SN74AHCT125
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCLS264L – DECEMBER 1995 – REVISED JANUARY 2000
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz14pF
pd
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Test
Point
C
L
t
w
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
V
CC
Open
GND
Open Drain
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
1.5 V
t
h
Open
V
CC
GND
V
CC
From Output
Under Test
C
(see Note A)
L
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
RL = 1 kΩ
3 V
0 V
S1
Timing Input
Data Input
3 V
0 V
3 V
0 V
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
50% V
50% V
CC
CC
Figure 1. Load Circuit and Voltage Waveforms
t
PHL
50% V
t
PLH
50% V
CC
CC
3 V
0 V
V
V
V
V
OH
OL
OH
OL
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
1.5 V1.5 V1.5 V1.5 V
t
PZL
50% V
CC
t
PZH
50% V
CC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
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any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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