ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D
Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Very Small-Outline (DGV), and
Thin Shrink Small-Outline (PW) Packages,
Ceramic Flat (W) Packages, Ceramic Chip
Carriers (FK), and Standard Plastic (N) and
Ceramic (J) DIPs
description
The ’AHC367 devices are hex buffers and line
drivers designed for 2-V to 5.5-V VCC operation.
These devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters. The
’AHC367 devices are organized as dual 4-line
and 2-line buffers/drivers with active-low
output-enable (1OE
low, the device passes noninverted data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
and 2OE) inputs. When OE is
SN54AHC367 ...J OR W PACKAGE
SN74AHC367 . . . D, DB, DGV, N, OR PW PACKAGE
SN54AHC367 . . . FK PACKAGE
1Y1
1A2
NC
1Y2
1A3
NC – No internal connection
(TOP VIEW)
1OE
1
1A1
2
1Y1
3
1A2
4
5
1Y2
6
1A3
7
1Y3
GND
8
(TOP VIEW)
1A1
3212019
4
5
6
7
8
910111213
1Y3
1OE
GND
NC
NC
16
15
14
13
12
11
10
9
CC
V
1Y4
V
CC
2OE
2A2
2Y2
2A1
2Y1
1A4
1Y4
2OE
18
17
16
15
14
1A4
2A2
2Y2
NC
2A1
2Y1
T o ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54AHC367 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74AHC367 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer/driver)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
INPUTS
OEA
LHH
LLL
HXZ
OUTPUT
Y
Copyright 2000, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424D – JUNE 1998 – REVISED JANUARY 2000
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
†
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
1
2
4
6
10
15
12
14
EN
EN
logic diagram (positive logic)
1OE
1
2OE
15
11
13
3
1Y1
5
1Y2
7
1Y3
9
1Y4
2Y1
2Y2
23
1A1
To Three Other Channels
Pin numbers shown are for the D, DB, DGV, J, N, PW, and W packages.
1Y1
1211
2A1
To One Other Channel
2Y1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage25.525.5V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage05.505.5V
I
Output voltage0V
O
High-level output current
Low-level output current
p
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs
, literature number SCBA004.
VCC = 3 V
VCC = 5.5 V3.853.85
VCC = 2 V0.50.5
VCC = 3 V
VCC = 5.5 V1.651.65
VCC = 2 V–50–50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V–8–8
VCC = 2 V5050
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V88
VCC = 3.3 V ± 0.3 V100100
VCC = 5 V ± 0.5 V2020
2.12.1
0.90.9
CC
–4–4
44
0V
CC
V
V
V
m
A
m
A
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
2 V1.921.91.9
IOH = –50 mA
V
OH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
V
OL
IOL = 4 mA
IOL = 8 mA
I
I
I
OZ
I
CC
C
i
C
o
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
VI = VCC or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND, VO = VCC or GND,
OE
= V
IH
VI = VCC or GND,IO = 05.5 V44040
VI = VCC or GND5 V31010pF
VO = VCC or GND5 V5.1pF
3 V2.932.92.9
4.5 V4.44.54.44.4
3 V2.582.482.48
4.5 V3.943.83.8
2 V0.10.10.1
3 V0.10.10.1
4.5 V0.10.10.1
3 V0.360.50.44
4.5 V0.360.50.44
5.5 V±0.25±2.5±2.5
TA = 25°CSN54AHC367 SN74AHC367
MINTYPMAXMINMAXMINMAX
V
V
m
A
m
A
m
A
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AHC367, SN74AHC367
PARAMETER
UNIT
AYC
15 pF
ns
OE
Y
C
15 pF
ns
OE
Y
C
L
F
ns
AYC
pF
ns
OE
Y
C
pF
ns
OE
Y
C
L
F
ns
PARAMETER
UNIT
AYC
pF
ns
OE
Y
C
15 pF
ns
OE
Y
C
L
F
ns
AYC
pF
ns
OE
Y
C
pF
ns
OE
Y
C
L
F
ns
PARAMETER
UNIT
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424D – JUNE 1998 – REVISED JANUARY 2000
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
=
L
=
L
= 15
= 50
L
= 50
L
= 50
p
p
p
p
p
p
TA = 25°CSN54AHC367 SN74AHC367
MINTYPMAXMINMAXMINMAX
4.7*8.3*1*10*110
4.7*8..3*1*10*110
5.1*10.5*1*12.5*112.5
5.1*10.5*1*12.5*112.5
4*10.5*1*12.5*112.5
4.9*10.5*1*12.5*112.5
6.111.8113.5113.5
6.211.8113.5113.5
6.414116116
6.814116116
6.213.6115.5115.5
7.313.6115.5115.5
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 4: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage3.5V
Low-level dynamic input voltage1.5V
= 5 V, C
CC
= 50 pF, TA = 25°C (see Note 4)
L
OL
OL
OH
= 15
L
=
L
= 15
= 50
L
= 50
L
= 50
p
p
p
p
p
p
TA = 25°CSN54AHC367 SN74AHC367
MINTYPMAXMINMAXMINMAX
3.4*5.9*1*7*17
3.6*5.9*1*7*17
3.6*7.2*1*8.5*18.5
3.8*7.2*1*8.5*18.5
2.6*7.2*0*8.5*08.5
2.6*7.2*0*8.5*08.5
4.37.91919
4.57.91919
4.69.2110.5110.5
4.99.2110.5110.5
3.49.2010.5010.5
4.59.2010.5010.5
SN74AHC367
MINTYPMAX
0.9V
–0.8V
4.2V
PRODUCT PREVIEW information concerns products in the formative or
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424D – JUNE 1998 – REVISED JANUARY 2000
operating characteristics, V
C
Power dissipation capacitanceOutputs enabledNo load,f = 1 MHz22.4pF
pd
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Test
Point
C
L
t
w
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
V
CC
Open
GND
t
su
50% V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
50% V
CC
TESTS1
Open
V
CC
GND
V
CC
CC
t
h
50% V
CC
V
0 V
V
0 V
From Output
Under Test
C
(see Note A)
3-STATE AND OPEN-DRAIN OUTPUTS
50% V
L
LOAD CIRCUIT FOR
V
CC
0 V
RL = 1 kΩ
CC
S1
Timing Input
Data Input
CC
CC
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
50% V
CC
50% V
50% V
VOLTAGE WAVEFORMS
50% V
CC
CC
Figure 1. Load Circuit and Voltage Waveforms
CC
t
PHL
50% V
t
50% V
PLH
V
0 V
V
CC
V
V
CC
V
CC
OH
OL
OH
OL
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
50% V
CC
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
CC
CC
50% V
VOL + 0.3 V
VOH – 0.3 V
CC
t
t
PLZ
PHZ
V
CC
0 V
≈ V
V
OL
V
OH
≈ 0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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