A FIFO memory is a storage device that allows data to be written into and read from its array at independent
data rates. The SN74ACT2235 is arranged as two 1024 by 9-bit FIFOs for high speed and fast access times.
It processes data at rates up to 50 MHz, with access times of 25 ns in a bit-parallel format.
The SN74ACT2235 consists of bus-transceiver circuits, two 1024 × 9 FIFOs, and control circuitry arranged for
multiplexed transmission of data directly from the data bus or from the internal FIFO memories. Enable (GAB
and GBA) inputs are provided to control the transceiver functions. The select-control (SAB and SBA) inputs are
provided to select whether real-time or stored data is transferred. The circuitry used for select control eliminates
the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data.
Figure 2 shows the eight fundamental bus-management functions that can be performed with the
SN74ACT2235.
D
Access Times of 25 ns With a 50-pF Load
D
Data Rates up to 50 MHz
D
Fall-Through Times of 22 ns Maximum
D
High Output Drive for Direct Bus Interface
D
Package Options Include 44-Pin Plastic
Leaded Chip Carriers (FN) and 64-Pin Thin
Quad Flat (PAG, PM) Packages
For more information on this device family, see the application report,
SN74ACT2235
, literature number SCAA010.
The SN74ACT2235 is characterized for operation from 0°C to 70°C.
FN PACKAGE
(TOP VIEW)
GAB
SAB
DBF
GNDB0B1
42 41 4043
UNCKA
EMPTY A
B2
39
B3
38
B4
37
V
36
CC
B5
35
B6
34
B7
33
B8
32
GND
31
AF/AEB
30
HFB
29
FULLB
LDCKB
A3
A4
V
CC
A5
A6
A7
A8
GND
AF/AEA
HFA
LDCKA
A2A1A0
7
8
9
10
11
12
13
14
15
16
17
1819
FULLA
GND
GBA
SBA
54321644
20 21 22 23
UNCKB
EMPTYB
DAF
RSTA
24 25 26 27 28
RSTB
1K × 9 × 2 Asynchronous FIFO
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Almost full/almost empty flags. The almost-full/almost-empty A flag (AF/AEA) is defined by the
almost-full/almost-empty offset value for FIFO A (X). AF/AEA is high when FIFO A contains X or fewer words
O
or 1024–X words. AF/AEA is low when FIFO A contains between (X + 1) or (1023 – X) words. The operation
of the almost-full/almost-empty B flag (AF/AEB) is the same as AF/AEA for FIFO B.
I/OA-data inputs and outputs
I/OB-data inputs and outputs
Define-flag inputs. The high-to-low transition of DAF stores the binary value on A0–A8 as the
almost-full/almost-empty offset value for FIFO A (X). The high-to-low transition of DBF
I
of B0–B8 as the almost-full/almost-empty offset value for FIFO B (Y).
Empty flags. EMPTYA and EMPTYB are low when their corresponding memories are empty and high when
O
they are not empty.
Full flags. FULLA and FULLB are low when their corresponding memories are full and high when they are
O
not full.
Half-full flags. HFA and HFB are high when their corresponding memories contain 512 or more words and
O
low when they contain 511 or fewer words.
Load clocks. Data on A0–A8 is written into FIFO A on a low-to-high transition of LDCKA. Data on B0–B8 is
written into FIFO B on a low-to-high transition of LDCKB. When the FIFOs are full, LDCKA and LDCKB have
I
no effect on the data residing in memory .
Output enables. GAB, GBA control the transceiver functions. When GBA is low, A0–A8 are in the
I
high-impedance state. When GAB is low, B0–B8 are in the high-impedance state.
Reset. A reset is accomplished in each direction by taking RSTA and RSTB low. This sets EMPTYA,
I
EMPTYB
Select-control inputs. SAB and SBA select whether real-time or stored data is transferred. A low level selects
real-time data and a high level selects stored data. Eight fundamental bus-management functions can be
I
performed as shown in Figure 2.
Unload clocks. Data in FIFO A is read to B0–B8 on a low-to-high transition of UNCKB. Data in FIFO B is read
to A0–A8 on a low-to-high transition of UNCKB. When the FIFOs are empty, UNCKA and UNCKB have no
, FULLA, FULLB, and AF/AEB high. Both FIFOs must be reset upon power up.
programming procedure for AF/AEA
The almost-full/almost-empty flags (AF/AEA, AF/AEB) are programmed during each reset cycle. The
almost-full/almost-empty offset value for FIFO A (X) and for FIFO B (Y) is either a user-defined value or the
default values of X = 256 and Y = 256. Below are instructions to program AF/AEA using both methods. AF/AEB
is programmed in the same manner for FIFO B.
user-defined X
Take DAF
If RSTA
With DAF
To retain the current offset for the next reset, keep DAF
default X
To redefine AF/AE using the default value of X = 256, hold DAF
from high to low. This stores A0–A8 as X.
is not already low, take RSTA low .
held low, take RSTA high. This defines AF/AEA using X.
Storage temperature range, T
Maximum junction temperature, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
V
OH
FlagsVCC = 4.5 V,IOL = 8 mA0.5
OL
I/O portsVCC = 4.5 V,IOL = 16 mA0.5
I
I
I
OZ
‡
I
CC
§
∆I
CC
C
i
C
o
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
ICC is tested with outputs open.
§
This is the supply current when each input is at one of the specified TTL voltage levels rather than 0 V or VCC.
timing requirements over recommended operating conditions (unless otherwise noted) (see
Figure 3)
clock
t
su
t
h
Setup time
Hold time
VCC = 4.5 V,IOH = –8 mA2.4V
VCC = 5.5 V,VI = VCC or 0±5µA
VCC = 5.5 V,VO = VCC or 0±5µA
VI = VCC – 0.2 V or 010400µA
VCC = 5.5 V,One input at 3.4 V ,Other inputs at VCC or GND1mA
VI = 0,f = 1 MHz4pF
VO = 0,f = 1 MHz8pF
’ACT2235-20’ACT2235-30’ACT2235-40’ACT2235-60
MINMAXMINMAXMINMAXMINMAX
LDCKA or LDCKB50332516.7
y
UNCKA or UNCKB
RSTA or RSTB low20202525
LDCKA or LDCKB low8101420
LDCKA or LDCKB high8101420
UNCKA or UNCKB low8101420
UNCKA or UNCKB high8101420
DAF or DBF high10101010
Data before LDCKA
or LDCKB↑
Define AF/AE:
D0–D8 before DAF
Define AF/AE: DAF
before RSTA
Define AF/AE (default):
DAF
or DBF high before
RSTA
or RSTB↑
RSTA or RSTB inactive (high)
before LDCKA or LDCKB↑
Data after LDCKA or LDCKB↑1122
Define AF/AE: D0–D8
4.5 4.6 4.74.954.85.1 5.2 5.3 5.4 5.5
VCC – Supply Voltage – V
Figure 5
12
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Copyright 1999, Texas Instruments Incorporated
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