–40°C to 85°C
OUTPUT
OUTPUT
f
SN74AC11-Q1
TRIPLE 3-INPUT POSITIVE-AND GATE
SCLS523 – AUGUST 2003
1A
1B
2A
2B
2C
2Y
GND
D PACKAGE
(TOP VIEW)
1
14
13
2
12
3
4
11
10
5
6
7
9
8
V
1C
1Y
3A
3B
3C
3Y
CC
D
Qualification in Accordance With
AEC-Q100
D
Qualified for Automotive Applications
D
Customer-Specific Configuration Control
†
Can Be Supported Along With
Major-Change Approval
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
2-V to 6-V VCC Operation
D
Inputs Accept Voltages to 6 V
D
Max tpd of 7.5 ns at 5 V
†
Contact factory for details. Q100 qualification data available on
request.
description/ordering information
The ’AC11 device contains three independent 3-input AND gates. This device performs the Boolean function
Y = A • B • C or Y = A
T
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
+ B + C in positive logic.
A
SOIC – D Tape and reel SN74AC11IDRQ1 AC11IQ1
TSSOP – PW Tape and reel SN74AC11IPWRQ1 AC11IQ1
ORDERING INFORMA TION
PACKAGE
†
PART NUMBER
ORDERABLE
TOP-SIDE
MARKING
FUNCTION TABLE
(each gate)
INPUTS
A B C
H H H H
L XX L
X LX L
X X L L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Y
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
1
SN74AC11-Q1
TRIPLE 3-INPUT POSITIVE-AND GATE
SCLS523 – AUGUST 2003
logic diagram, each gate (positive logic)
1
1A
2
1B
13
1C
3
2A
4
2B
5
2C
11
3A
10
3B
9
3C
12
1Y
6
2Y
8
3Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
(VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
(VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OK
(VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
†
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VIHHigh-level input voltage
V
IH
VILLow-level input voltage
V
IL
IOHHigh-level output current
mA
OH
IOLLow-level output current
mA
OL
PARAMETER
TEST CONDITIONS
V
CC
MIN
MAX
UNIT
IOH = –50 µA
OH
V
OH
V
IOH = –24 mA
IOL = 50 µA
OL
V
OL
V
IOL = 24 mA
SN74AC11-Q1
TRIPLE 3-INPUT POSITIVE-AND GATE
SCLS523 – AUGUST 2003
recommended operating conditions (see Note 3)
MIN MAX UNIT
V
CC
V
I
V
O
∆t/∆v Input transition rise or fall rate 8 ns/V
T
A
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage 2 6 V
VCC = 3 V 2.1
VCC = 4.5 V 3.15
VCC = 5.5 V 3.85
VCC = 3 V 0.9
VCC = 4.5 V 1.35
VCC = 5.5 V 1.65
Input voltage 0 V
Output voltage 0 V
VCC = 3 V –12
VCC = 4.5 V –24
VCC = 5.5 V –24
VCC = 3 V 12
VCC = 4.5 V 24
VCC = 5.5 V 24
Operating free-air temperature –40 85 °C
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
CC
V
V
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°C
MIN TYP MAX
3 V 2.9 2.99 2.9
4.5 V 4.4 4.49 4.4
5.5 V 5.4 5.49 5.4
IOH = –12 mA 3 V 2.56 2.46
4.5 V 3.86 3.76
5.5 V 4.86 4.76
IOH = –50 mA
IOH = –75 mA
IOL = 12 mA 3 V 0.36 0.44
IOL = 50 mA
IOL = 75 mA
I
I
I
CC
C
i
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
VI = VCC or GND 5.5 V ±0.1 ±1 µA
VI = VCC or GND, IO = 0 5.5 V 2 20 µA
VI = VCC or GND 5 V 2.6 pF
†
†
†
†
5.5 V
5.5 V 3.85
3 V 0.002 0.1 0.1
4.5 V 0.001 0.1 0.1
5.5 V 0.001 0.1 0.1
4.5 V 0.36 0.44
5.5 V 0.36 0.44
5.5 V
5.5 V 1.65
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN74AC11-Q1
FROM
TO
PARAMETER
FROM
TO
MIN
MAX
UNIT
A, B, or C
Y
ns
FROM
TO
PARAMETER
FROM
TO
MIN
MAX
UNIT
A, B, or C
Y
ns
TRIPLE 3-INPUT POSITIVE-AND GATE
SCLS523 – AUGUST 2003
switching characteristics over recommended operating free-air temperature range,
= 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
TA = 25°C
(INPUT)
t
PLH
t
PHL
switching characteristics over recommended operating free-air temperature range,
= 5 V " 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
(INPUT)
t
PLH
t
PHL
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
CpdPower dissipation capacitance CL = 50pF, f = 1 MHz 20 pF
(OUTPUT)
(OUTPUT)
MIN TYP MAX
1.5 5.5 9.5 1 10
1.5 5.5 8.5 1 9.5
TA = 25°C
MIN TYP MAX
1.5 4 8 1 8.5
1.5 4 7 1 7.5
PARAMETER MEASUREMENT INFORMATION
S1TEST
t
PLH/tPHL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Open
500 Ω
500 Ω
Figure 1. Load Circuit and Voltage Waveforms
S1
2 × V
Open
CC
Input
(see Note B)
In-Phase
Output
Out-of-Phase
Output
50% V
CC
t
PLH
50% V
t
PHL
50% V
VOLTAGE WAVEFORMS
CC
CC
50 % V
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
V
0 V
V
V
V
V
CC
OH
OL
OH
OL
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Oct-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN74AC11IDRQ1 ACTIVE SOIC D 14 2500 Pb-Free
SN74AC11IPWRQ1 ACTIVE TSSOP PW 14 2000 Pb-Free
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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