ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D
Package Options Include Plastic
Small-Outline (D) and Shrink Small-Outline
(DB) Packages, Ceramic Chip Carriers (FK),
and Plastic (N) and Ceramic (J) DIPs
description
The ’ABT126 bus buffer gates feature
independent line drivers with 3-state outputs.
Each output is disabled when the associated
output-enable (OE) input is low.
When V
in the high-impedance state during power up or
power down. However, to ensure the
high-impedance state above 2.1 V , OE should be
tied to GND through a pulldown resistor; the
minimum value of the resistor is determined by the
current-sourcing capability of the driver.
is between 0 and 2.1 V, the device is
CC
SN54ABT126 ...J PACKAGE
SN74ABT126 . . . D, DB, OR N PACKAGE
SN54ABT126 . . . FK PACKAGE
1Y
NC
2OE
NC
2A
NC – No internal connection
(TOP VIEW)
1OE
2OE
GND
1
1A
2
1Y
3
4
2A
5
2Y
6
7
(TOP VIEW)
1A
3212019
4
5
6
7
8
910111213
2Y
1OE
GND
14
13
12
11
10
NC
NC
9
8
CC
V
3Y
V
CC
4OE
4A
4Y
3OE
3A
3Y
4OE
18
17
16
15
14
3A
4A
NC
4Y
NC
3OE
The SN54ABT126 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT126 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
INPUTS
OEA
HHH
HLL
LXZ
OUTPUT
Y
Copyright 1999, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183D – FEBRUARY 1991 – REVISED JANUARY 1999
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, DB, J, and N packages.
†
1OE
1A
2OE
2A
3OE
3A
4OE
4A
1
2
4
5
10
9
13
12
EN
1
logic diagram (positive logic)
1
1OE
2
1A1Y
4
2OE
3
3OE
3A3Y
4OE
10
9
13
3
1Y
6
2Y
8
3Y
11
4Y
8
5
2A2Y
Pin numbers shown are for the D, DB, J, and N packages.
6
12
4A4Y
11
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Voltage range applied to any output in the high or power-off state, V
Current into any output in the low state, I
Input clamp current, I
Output clamp current, I
Package thermal impedance, θ
Storage temperature range, T
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stressratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
VCC = 0 to 5.5 V,VI = VCC or GND±1±1±1µA
VCC = 0 to 2.1 V, VO = 0.5 V to 2.7 V, OE = X
VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V, OE = X
VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE ≤ 0.8 V101010µA
VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE ≤ 0.8 V–10–10–10µA
VCC = 0,VI or VO ≤ 4.5 V±100±100µA
VCC = 5.5 V, VO = 5.5 VOutputs high505050µA
VCC = 5.5 V,VO = 2.5 V–50–100–200–50–200–50–200mA
VCC = 5.5 V, IO = 0,
=
or
VCC = 5.5 V,
p
ne input at 3.4 V,
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V3pF
VO = 2.5 V or 0.5 V7pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54ABT126, SN74ABT126
(INPUT)
(OUTPUT)
A
Y
ns
OE
Y
ns
OE
Y
ns
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183D – FEBRUARY 1991 – REVISED JANUARY 1999
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 1)
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183D – FEBRUARY 1991 – REVISED JANUARY 1999
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
1.5 V1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω , tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
t
PHL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
S1
t
PHL
1.5 V
t
PLH
3 V
0 V
V
V
V
V
7 V
OH
OL
OH
OL
Open
GND
3 V
0 V
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
t
PLZ
1.5 V
t
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
PHZ
1.5 V
Open
Open
1.5 V
t
7 V
h
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
3 V
0 V
3 V
0 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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