TEXAS INSTRUMENTS SN65LVDS32B, SN65LVDT32B, SN65LVDS3486B, SN65LVDT3486B, SN65LVDS9637B Technical data

...
www.ti.com
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
1B 1A 1Y
G 2Y 2A 2B
GND
V
CC
4B 4A 4Y G 3Y 3A 3B
SN65LVDT32B
1 2 3 4
8 7 6 5
V
CC
1Y 2Y
GND
1A 1B 2A 2B
D PACKAGE
(TOP VIEW)
D PACKAGE
(TOP VIEW)
SN65LVDS32B
G G
1A 1B
2A 2B
3A 3B 4A 4B
1Y
2Y
3Y
4Y
Logic Diagram
(positive logic)
SN65LVDT32B ONLY (4 Places)
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10
9
1B 1A 1Y
1,2EN
2Y 2A 2B
GND
V
CC
4B 4A 4Y 3,4EN 3Y 3A 3B
SN65LVDT3486B
D PACKAGE
(TOP VIEW)
SN65LVDS3486B
1A 1B
2A 2B
3A 3B 4A 4B
1Y
2Y
3Y
4Y
Logic Diagram
(positive logic)
SN65LVDT3486B ONLY (4 Places)
1,2EN
3,4EN
1A 1B
2A 2B
1Y
2Y
SN65LVDT9637B ONLY
SN65LVDT9637B
SN65LVDS9637B
Logic Diagram
(positive logic)
HIGH-SPEED DIFFERENTIAL RECEIVERS

FEATURES

Meets or Exceeds the Requirements of ANSI
EIA/TIA-644 Standard for Signaling Rates to 400 Mbps
Operates With a Single 3.3-V Supply
–2-V to 4.4-V Common-Mode Input Voltage
Range
Differential Input Thresholds <50 mV With
50 mV of Hysteresis Over Entire Common­Mode Input Voltage Range
Integrated 110- Line Termination Resistors
Offered With the LVDT Series
Propagation Delay Times 4 ns (typ)
Active Fail Safe Assures a High-Level Output
With No Input
Bus-Pin ESD Protection Exceeds 15 kV HBM
Inputs Remain High-Impedance on Power
Down
Recommended Maximum Parallel Rate of
200 M-Transfer/s
Available in Small-Outline Package With
1,27-mm Terminal Pitch
Pin-Compatible With the AM26LS32, MC3486,
or µA9637

DESCRIPTION

This family of differential line receivers offers improved performance and features that implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS is defined in the TIA/EIA-644 standard. This improved performance represents the second generation of receiver products for this standard, providing a better overall solution for the cabled environment. This generation of products is an extension to TI's overall product portfolio and is not necessarily a replacement for older LVDS receivers.
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
(1)
up
(1) Signaling rate, 1/t, where t is the minimum unit interval and is
expressed in the units bit/s (bits per second).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2000–2007, Texas Instruments Incorporated
www.ti.com
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION (CONTINUED)

Improved features include an input common-mode voltage range 2 V wider than the minimum required by the standard. This will allow longer cable lengths by tripling the allowable ground noise tolerance to 3 V between a driver and receiver. TI has additionally introduced an even wider input common-mode voltage range of –4 to 5 V in their SN65LVDS/T33 and SN65LVDS/T34.
Precise control of the differential input voltage thresholds now allows for inclusion of 50 mV of input voltage hysteresis to improve noise rejection on slowly changing input signals. The input thresholds are still no more than ±50 mV over the full input common-mode voltage range.
The high-speed switching of LVDS signals almost always necessitates the use of a line impedance matching resistor at the receiving-end of the cable or transmission media. The SN65LVDT series of receivers eliminates this external resistor by integrating it with the receiver. The non-terminated SN65LVDS series is also available for multidrop or other termination circuits.
The receivers can withstand ±15-kV human-body model (HBM) and ±600 V-machine model (MM) electrostatic discharges to the receiver input pins with respect to ground without damage. This provides reliability in cabled and other connections where potentially damaging noise is always a threat.
The receivers also include a (patent pending) fail-safe circuit that will provide a high-level output within 600 ns after loss of the input signal. The most common causes of signal loss are disconnected cables, shorted lines, or powered-down transmitters. This prevents noise from being received as valid data under these fault conditions. This feature may also be used for wired-OR bus signaling.
The intended application of these devices and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN65LVDS32B, SN65LVDT32B, SN65LVDS3486B, SN65LVDT3486B, SN65LVDS9637B, and SN65LVDT9637B are characterized for operation from –40°C to 85°C.
AVAILABLE OPTIONS
PART NUMBER
SN65LVDS32BD 4 No LVDS32B
SN65LVDT32BD 4 Yes LVDT32B SN65LVDS3486BD 4 No LVDS3486 SN65LVDT3486BD 4 Yes LVDT3486 SN65LVDS9637BD 2 No DK637B SN65LVDT9637BD 2 Yes DR637B
(1) Add the suffix R for taped and reeled carrier.
(1)
NUMBER OF TERMINATION
RECEIVERS RESISTOR
SYMBOLIZATION
2
Submit Documentation Feedback
www.ti.com

FUNCTION TABLES

SN65LVDS32B and SN65LVDT32B
DIFFERENTIAL INPUT ENABLES
A-B G G Y
VID≥ –32 mV
–100 mV < VID≤ –32 mV
VID≤ –100 mV
X L H Z
Open
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate
SN65LVDS3486B and SN65LVDT3486B
DIFFERENTIAL INPUT ENABLES
A-B EN Y
VID≥ –32 mV H H
–100 mV < VID≤ –32 mV H ?
VID≤ –100 mV H L
X L Z
Open H H
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
(1)
H X H X L H
H X ? X L ?
H X L X L L
H X H X L H
(1)
OUTPUT
OUTPUT
(1)
(1)
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), ? = indeterminate
SN65LVDS9637B and SN65LVDT9637B
DIFFERENTIAL INPUT OUTPUT
A-B Y
VID≥ -32 mV H
–100 mV < VID≤ -32 mV ?
VID≤ -100 mV L
Open H
(1) H = high level, L = low level, ? = indeterminate
(1)
Submit Documentation Feedback
3
www.ti.com
V
CC
37
7 V
Y Output
LVDT Only 110
7 V
300 k
50
V
CC
Enable
Inputs
300 k
(G Only)
(EN and G Only)
7 V
V
CC
Attenuation
Network
A Input
Attenuation
Network
B Input
7 V
V
CC
Attenuation
Network
60 k
250 k
200 k
1 pF
3 pF
7 V
7 V
6.5 k 6.5 k
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

4
Submit Documentation Feedback
www.ti.com
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)
V
Supply voltage range
CC
Voltage range A or B –4 V to 6 V
Electrostatic discharge: A, B, and GND Continuous power dissipation See Dissipation Rating Table Storage temperature range –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) Tested in accordance with MIL-STD-883C Method 3015.7.
(2)
Enables or Y –0.5 V to V
|VA– VB| (LVDT) 1 V
(3)

DISSIPATION RATING TABLE

PACKAGE
D8 725 mW 5.8 mW/°C 377 mW
D16 950 mW 7.6 mW/°C 494 mW
TA≤ 25°C OPERATING FACTOR
POWER RATING ABOVE TA= 25°C POWER RATING
(1)
UNIT
–0.5 V to 4 V
CC
Class 3, A: 15 kV, B: 600 V
(1)
TA= 85°C
+ 3 V
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air
flow.

RECOMMENDED OPERATING CONDITIONS

V
CC
V
IH
V
IL
| VID| Magnitude of differential input voltage
VIor V T
A
Supply voltage 3 3.3 3.6 V High-level input voltage Enables 2 V Low-level input voltage Enables 0.8 V
Voltage at any bus terminal (separately or common-mode) –2 4.4 V
IC
Operating free-air temperature –40 85 °C
MIN NOM MAX UNIT
LVDS 0.1 3 V LVDT 0.8 V
Submit Documentation Feedback
5
www.ti.com
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

ELECTRICAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
V V V V V V
I
CC
I
I
I
ID
I
I(OFF)
I
IH
I
IL
I
OZ
C
(1) All typical values are at 25°C and with a 3.3 V supply.
Positive-going differential input voltage threshold 50
IT1
Negative-going differential input voltage threshold –50
IT2
Differential input fail-safe voltage threshold See Table 1 and Figure 5 –32 –100 mV
IT3
Differential input voltage hysteresis, V
ID(HYS)
High-level output voltage IOH= –4 mA 2.4 V
OH
Low-level output voltage IOL= 4 mA 0.4 V
OL
Supply current G or EN at GND 1.1 5 mA
V
IT1
IT2
'32B or '3486B
'9637B No load, Steady-state 8 12
SN65LVDS µA
Input current (A or B inputs)
SN65LVDT µA
Differential input current (IIA- IIB)
SN65LVDS ±3 µA SN65LVDT VID= 0.2 V, VIC= –2 V or 4.4 V 1.55 2.22 mA
SN65LVDS Power-off input current (A or B inputs)
SN65LVDT
High-level input current (enables) VIH= 2 V 10 µA Low-level input current (enables) VIL= 0.8 V 10 µA High-impedance output current ±10 µA Input capacitance, A or B input to GND VI= 0.4 sin (4E6 π t) + 0.5 V 5 pF
I
(1)
VIB= -2 V or 4.4 V, See Figure 1 and Figure 2
50 mV
G or EN at VCC, No load, Steady-state 16 23
VI= 0 V, Other input open ±20 VI= 2.4 V, Other input open ±20 VI= –2 V, Other input open ±40 VI= 4.4 V, Other input open ±40 VI= 0 V, Other input open ±40 VI= 2.4 V, Other input open ±40 VI= –2 V, Other input open ±80 VI= 4.4 V, Other input open ±80 VID= 100 mV, VIC= –2 V or 4.4 V,
See Figure 1
VAor VB= 0 V or 2.4 V, V VAor VB= –2 V or 4.4 V, V VAor VB= 0 V or 2.4 V, V VAor VB= –2 V or 4.4 V, V
= 0 V ±20
CC
= 0 V ±35
CC
= 0 V ±30
CC
= 0 V ±50
CC
MAX UNIT
mV
µA
6
Submit Documentation Feedback
www.ti.com
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

SWITCHING CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
t
Propagation delay time, low-to-high-level output 2.5 4 6 ns
PLH
t
Propagation delay time, high-to-low-level output 2.5 4 6 ns
PHL
t
Delay time, fail-safe deactivate time 9 ns
d1
t
Delay time, fail-safe activate time 0.3 1.5 µs
d2
t
Pulse skew (|t
sk(p)
t
Output skew
sk(o)
t
Part-to-part skew
sk(pp)
t
Output signal rise time 0.8 ns
r
t
Output signal fall time 0.8 ns
f
t
Propagation delay time, high-level-to-high-impedance output 5.5 9 ns
PHZ
t
Propagation delay time, low-level-to-high-impedance output 4.4 9 ns
PLZ
t
Propagation delay time, high-impedance -to-high-level output 3.8 9 ns
PZH
t
Propagation delay time, high-impedance-to-low-level output 7 9 ns
PZL
- t
PHL1
(2)
|) 200 ps
PLH1
(3)
(1) All typical values are at 25°C and with a 3.3-V supply. (2) t
(3) t
is the magnitude of the time difference between the t
sk(o)
together.
is the magnitude of the time difference in propagation delay times between any specified terminals of two devices when both
sk(pp)
devices operate with the same supply voltages, at the same temperature, and have identical packages and test circuits.
or t
PLH
See Figure 3
See Figure 3 and
Figure 6
CL= 10 pF, See Figure 3 1 ns
See Figure 4
of all receivers of a single device with all of their inputs driven
PHL
(1)
MAX UNIT
150 ps
Submit Documentation Feedback
7
www.ti.com
V
ID
A
B
Y
V
O
V
IB
V
IA
V
IC
(VIA + VIB)/2
I
IB
I
IA
V
O
V
ID
V
O
10 pF, 2 Places
10 pF
100
1000
1000
100
V
IC
V
ID
V
O
V
ID
V
O
V
IT1
0 V –100 mV
100 mV
0 V V
IT2
Removed for testing the LVDT device
NOTE: Input signal of 3 Mpps, duration of 167 ns, and transition time of <1 ns.
+ –
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

PARAMETER MEASUREMENT INFORMATION

Figure 1. Voltage and Current Definitions
8
Figure 2. V
and V
IT1
Input Voltage Threshold Test Circuit and Definitions
IT2
Submit Documentation Feedback
www.ti.com
V
ID
V
O
V
IB
V
IA
CL = 10 pF
t
PHL
t
PLH
t
f
t
r
80%
20%
80%
20%
V
IA
V
IB
V
ID
V
O
1.4 V
1 V
0.4 V
0 V
–0.4 V
V
OH
1.4 V V
OL
PARAMETER MEASUREMENT INFORMATION (continued)
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
A. All input pulses are supplied by a generator having the following characteristics: tror tf≤ 1 ns, pulse repetition rate
(PRR) = 50 Mpps, Pulsewidth = 10 ±0.2 ns . CLincludes instrumentation and fixture capacitance within 0,06 mm of the D.U.T.
Figure 3. Timing Test Circuit and Waveforms
Submit Documentation Feedback
9
www.ti.com
B
A
G G
V
O
±
500
V
TEST
10 pF
1.2 V
t
PZL
t
PLZ
t
PZL
t
PLZ
t
PZH
t
PHZ
t
PZH
t
PHZ
2.5 V 1 V
2 V
1.4 V
0.8 V 2 V
1.4 V
0.8 V
2.5 V
1.4 V VOL +0.5 V V
OL
0
1.4 V 2 V
1.4 V
0.8 V 2 V
1.4 V
0.8 V
V
OH
VOH –0.5 V
1.4 V 0
V
TEST
A
G, 1,2EN,or 3,4EN
G
Y
V
TEST
A
G
Y
Inputs
G, 1,2EN,or 3,4EN
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf 1 ns, pulse
repetition rate (PRR) = 0.5 Mpps, Pulsewidth = 500 ±10 ns . CL includes instrumentation and fixture capacitance within 0,06 mm of the D.U.T.
1,2,EN, or 3,4, EN
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
PARAMETER MEASUREMENT INFORMATION (continued)
10
Figure 4. Enable/Disable Time Test Circuit and Waveforms
Submit Documentation Feedback
www.ti.com
V
IA
V
IB
V
O
–100 mV @ 250 KHz
–32 mV @ 250 KHz
Failsafe Asserted
V
IA
V
IB
V
O
a) No Failsafe
b) Failsafe Asserted
t
d1
t
d2
1.4 V
1 V
0.4 V
0 V
–0.4 V
V
OH
1.4 V V
OL
–0.2 V
>1.5 µs
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
Table 1. Receiver Minimum and Maximum V
APPLIED VOLTAGES
VIA(mV) VIB(mV) VID(mV) VIC(mV) Output
–2000 –1900 –100 –1950 L –2000 –1968 –32 –1984 H
4300 4400 –100 4350 L 4368 4400 –32 4384 H
(1) These voltages are applied for a minimum of 1.5 µs.
(1)
Input Threshold Test Voltages
IT3
RESULTANT INPUTS
Figure 5. V
Failsafe Threshold Test
IT3
Figure 6. Waveforms for Failsafe Activate and Deactivate
Submit Documentation Feedback
11
www.ti.com
0
IOL − Low-Level Output Current − mA
4
3
0
20 30
2
10
V
CC
= 3.3 V
TA = 25°C
1
V
OL
− Low-Level Output Voltage − V
5
40
IOH − High-Level Output Current − mA
V
OH
− High-Level Output Voltage − V
4
3
0
2
1
−30 −20−40 0−10
V
CC
= 3.3 V
TA = 25°C
4.5
4
3.5
3
−50 0 50
5
100
TA − Free-Air Temperature − °C
VCC = 3 V
VCC = 3.6 V
VCC = 3.3 V
− Low-To-High Propagation Delay T ime − ns
t
PLH
4.5
4
3.5
3
−50 0 50
5
100
TA − Free-Air Temperature − °C
VCC = 3.3 V
VCC = 3 V
VCC = 3.6 V
− High-To-Low Propagation Delay T ime − ns
t
PHL
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

TYPICAL CHARACTERISTICS

LOW-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE
LOW-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
LOW-TO-HIGH PROPAGATION DELAY TIME HIGH-TO-LOW PROPAGATION DELAY TIME
FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE
vs vs
Figure 7. Figure 8.
vs vs
12
Figure 9. Figure 10.
Submit Documentation Feedback
www.ti.com
80
60
20
0
0 100
100
120
150 200
40
− Supply Current − mAI CC
f − Switching Frequency − MHz
VCC = 3 V
VCC = 3.6 V
VCC = 3.3 V
140
TYPICAL CHARACTERISTICS (continued)
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
SUPPLY CURRENT
vs
FREQUENCY
Figure 11.
Submit Documentation Feedback
13
www.ti.com
1B
1A
1Y
G
2Y
2A
2B
GND
V
CC
4B
4A
4Y
G
3Y
3A
3B
1
2
3
4
5
6
7
8
16
15
14
13 12 11
10
9
100
100
100 (see Note B)
100
V
CC
See Note C
3.6 V
0.1 µF (see Note A)
1N645
(2 places)
0.01 µF
5 V
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007

APPLICATION INFORMATION

A. Place a 0.1-µF Z5U ceramic, mica or polystyrene dielectric, 0805 size, chip capacitor between V
plane. The capacitor should be located as close as possible to the device terminals.
B. The termination resistance value should match the nominal characteristic impedance of the transmission media with
±10%.
C. Unused enable inputs should be tied to V
or GND as appropriate.
CC
and the ground
CC
Figure 12. Operation with 5-V Supply

RELATED INFORMATION

IBIS modeling is available for this device. contact the local TI sales office or the TI Web site at www.ti.com for more information.
For more application guidelines, see the following documents:
Low-Voltage Differential Signaling Design Notes (SLLA014 )
Interface Circuits for TIA/EIA-644 (LVDS) (SLLA038 )
Reducing EMI With LVDS (SLLA030 )
Slew Rate Control of LVDS Circuits (SLLA034 )
Using an LVDS Receiver With RS-422 Data (SLLA031 )
Evaluating the LVDS EVM (SLLA033 )

TERMINATED FAILSAFE

A differential line receiver commonly has a fail-safe circuit to prevent it from switching on input noise. Current LVDS fail-safe solutions require either external components with subsequent reduction in signal quality or integrated solutions with limited application. This family of receivers has a new integrated fail-safe that solves the limitations seen in present solutions. A detailed theory of operation is presented in application note The Active Fail-Safe Feature of the SN65LVDS32A (SLLA082 ).
Figure 13 shows one receiver channel with active fail-safe. It consists of a main receiver that can respond to a
high-speed input differential signal. Also connected to the input pair are two fail-safe receivers that form a window comparator. The window comparator has a much slower response than the main receiver and detects when the input differential falls below 80 mV. A 600-ns fail-safe timer filters the window comparator outputs. When fail-safe is asserted, the fail-safe logic drives the main receiver output to logic high.
14
Submit Documentation Feedback
www.ti.com
_
+
Main Receiver
_
+
_
+
A > B + 80 mV
B > A + 80 mV
Failsafe
Timer
Failsafe
Output Buffer
Reset
Window Comparator
A B
R
R3 R3
V
CC
I
CC
5 Meters of CAT-5
R1 R1
V
EE
R2
V
CC
I
CC
R3 = 240
R1 = 50 R2 = 50
V
B
V
B
LVDSLV/PECL
APPLICATION INFORMATION (continued)
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
Figure 13. Receiver With Terminated Failsafe

ECL/PECL-to-LVTTL CONVERSION WITH TI's LVDS RECEIVER

The various versions of emitter-coupled logic (i.e., ECL, PECL and LVPECL) are often the physical layer of choice for system designers. Designers know of the established technology and that it is capable of high-speed data transmission. In the past, system requirements often forced the selection of ECL. Now technologies like LVDS provide designers with another alternative. While the total exchange of ECL for LVDS may not be a design option, designers have been able to take advantage of LVDS by implementing a small resistor divider network at the input of the LVDS receiver. TI has taken the next step by introducing a wide common-mode LVDS receiver (no divider network required) which can be connected directly to an ECL driver with only the termination bias voltage required for ECL termination (V
Figure 14 and Figure 15 show the use of an LV/PECL driver driving 5 meters of CAT-5 cable and being received
by TI's wide common-mode receiver and the resulting eye pattern. The values for R3 are required in order to provide a resistor path to ground for the LV/PECL driver. With no resistor divider, R1 simply needs to match the characteristic load impedance of 50 . The R2 resistor is a small value and is intended to minimize any possible common-mode current reflections.
2 V).
CC
Figure 14. LVPECL or PECL to Remote Wide Common-Mode LVDS Receiver
Submit Documentation Feedback
15
www.ti.com
Tektronix PS25216
Programmable
Power Supply
Bench Test Board
Tektronix HFS 9003
Stimulus System
Tektronix TDS 784D 4-Channel Digital Phosphor Oscilloscope
– DPO
Trigger
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
APPLICATION INFORMATION (continued)
Figure 15. LV/PECL to Remote SN65LVDS32B at 500 Mbps Receiver Output (CH1)

TEST CONDITIONS

V
TA= 25°C (ambient temperature)
All four channels switching simultaneously with NRZ data. Scope is pulse-triggered simultaneously with NRZ
= 3.3 V
CC
data.

EQUIPMENT

Tektronix PS25216 programmable power supply
Tektronix HFS 9003 stimulus system
Tektronix TDS 784D 4-channel digital phosphor oscilloscope DPO
16
Figure 16. Equipment Setup
Submit Documentation Feedback
www.ti.com
100 Mbit/s 200 Mbit/s
APPLICATION INFORMATION (continued)
SN65LVDS32B , , SN65LVDT32B SN65LVDS3486B , SN65LVDT3486B SN65LVDS9637B , SN65LVDT9637B
SLLS440B – OCTOBER 2000 – REVISED APRIL 2007
Figure 17. Typical Eye Pattern SN65LVDS32B
Submit Documentation Feedback
17
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
SN65LVDS32BD ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDS32BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDS32BDR ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDS32BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDS3486BD ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDS3486BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDS3486BDR ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDS3486BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDS9637BD ACTIVE SOIC D 8 75 Green (RoHS &
SN65LVDS9637BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
SN65LVDS9637BDR ACTIVE SOIC D 8 2500 Green (RoHS &
SN65LVDS9637BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
SN65LVDT32BD ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDT32BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDT32BDR ACTIVE SOIC D 16 2500 Green(RoHS&
SN65LVDT32BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDT3486BD ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDT3486BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN65LVDT3486BDR ACTIVE SOIC D 16 2500 Green (RoHS &
SN65LVDT9637BD ACTIVE SOIC D 8 75 Green (RoHS &
SN65LVDT9637BDG4 ACTIVE SOIC D 8 75 Green (RoHS &
SN65LVDT9637BDR ACTIVE SOIC D 8 2500 Green(RoHS&
SN65LVDT9637BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
SNLVDT3486BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
(1)
The marketing status values are defined as follows:
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Call TI Level-1-260C-UNLIM
Call TI Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
17-Apr-2008
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
17-Apr-2008
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
16-Apr-2008
*All dimensions are nominal
Device Package
Type
SN65LVDS32BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN65LVDS3486BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN65LVDS9637BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 SN65LVDS9637BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDT32BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN65LVDT3486BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN65LVDT9637BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Package Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65LVDS32BDR SOIC D 16 2500 333.2 345.9 28.6 SN65LVDS3486BDR SOIC D 16 2500 346.0 346.0 33.0 SN65LVDS9637BDR SOIC D 8 2500 340.5 338.1 20.6 SN65LVDS9637BDR SOIC D 8 2500 346.0 346.0 29.0
SN65LVDT32BDR SOIC D 16 2500 346.0 346.0 33.0 SN65LVDT3486BDR SOIC D 16 2500 346.0 346.0 33.0 SN65LVDT9637BDR SOIC D 8 2500 346.0 346.0 29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Wireless www.ti.com/wireless
Loading...