Datasheet SN65LVDS94DGG, SN65LVDS94DGGR Datasheet (Texas Instruments)

SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
4:28 Data Channel Expansion at up to
D
Suited for Point-to-Point Subsystem Communication With Very Low EMI
D
4 Data Channels and Clock Low-Voltage Differential Channels in and 28 Data and Clock Out Low-Voltage TTL Channels Out
D
Operates From a Single 3.3-V Supply and 250 mW (Typ)
D
5-V Tolerant SHTDN Input
D
Rising Clock Edge Triggered Outputs
D
Bus Pins Tolerate 4-kV HBM ESD
D
Packaged in Thin Shrink Small-Outline Package With 20 Mil Terminal Pitch
D
Consumes <1 mW When Disabled
D
Wide Phase-Lock Input Frequency Range
20 MHz to 65 MHz
D
No External Components Required for PLL
D
Meets or Exceeds the Requirements of ANSI EIA/TIA-644 Standard
D
Industrial Temperature Qualified
TA = –40°C to 85°C
D
Replacement for the DS90CR286
description
The SN65LVDS94 LVDS serdes (serializer/des­erializer) receiver contains four serial-in 7-bit parallel-out shift registers, a 7× clock synthesizer, and five low-voltage differential signaling (LVDS) line receivers in a single integrated circuit. These functions allow receipt of synchronous data from a compatible transmitter, such as the SN65L VDS93 and SN65L VDS95, over five balanced-pair conductors and expansion to 28 bits of single-ended LVTTL synchronous data at a lower transfer rate.
When receiving, the high-speed LVDS data is received and loaded into registers at the rate seven times the L VDS input clock (CLKIN). The data is then unloaded to a 28-bit wide LVTTL parallel bus at the CLKIN rate. A phase-locked loop clock synthesizer circuit generates a 7× clock for internal clocking and an output clock for the expanded data. The SN65LVDS94 presents valid data on the rising edge of the output clock (CLKOUT).
The SN65L VDS94 requires only five line termination resistors for the differential inputs and little or no control. The data bus appears the same at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The only user intervention is the possible use of the shutdown/clear (SHTDN
) active-low input to inhibit the clock and shut off the LVDS receivers for lower power consumption. A
low level on this signal clears all internal registers to a low level. The SN65LVDS94 is characterized for operation over ambient air temperatures of –40°C to 85°C.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
D22 D23 D24
GND
D25 D26 D27
LVDSGND
A0M
A0P
A1M
A1P
LVDSV
CC
LVDSGND
A2M
A2P
CLKINM
CLKINP
A3M
A3P
LVDSGND
PLLGND
PLLV
CC
PLLGND
SHTDN
CLKOUT
D0
GND
V
CC
D21 D20 D19 GND D18 D17 D16 V
CC
D15 D14 D13 GND D12 D11 D10 V
CC
D9 D8 D7 GND D6 D5 D4 D3 V
CC
D2 D1
DGG PACKAGE
(TOP VIEW)
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
functional block diagram
Serial In
CLK
Serial-In/Parallel-Out
Shift Register
A,B, ...G
A0P A0M
Serial In
CLK
Serial-In/Parallel-Out
Shift Register
A,B, ...G
A1P A1M
Serial In
CLK
Serial-In/Parallel-Out
Shift Register
A,B, ...G
A2P A2M
Serial In
CLK
Serial-In/Parallel-Out
Shift Register
A,B, ...G
A3P A3M
Clock In
CLK
7× Clock/PLL
Clock Out
CLKINP CLKINM
Control Logic
SHTDN
D0 D1 D2 D3 D4 D6 D7
D8 D9 D12 D13 D14 D15 D18
D19 D20 D21 D22 D24 D25 D26
D27 D5 D10 D11 D16 D17 D23
CLKOUT
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
CLKOUT
D0-1
D7 D6 D4 D3 D2 D1 D0 D7+1
D86-1
D18 D15 D14 D13 D12 D9 D8 D18+1
D19-1
D26 D25 D24 D22 D21 D20 D19 D26+1
D27-1
D23 D17 D16 D11 D10 D5 D27 D23+1
Current Cycle Next CyclePrevious Cycle
A3
A2
A1
A0
CLKIN
Dn Dn-1 Dn Dn+1
Figure 1. SN65LVDS94 Load and Shift Sequences
equivalent input and output schematic diagrams
300 k300 k
7 V
AnMAnP
V
CC
7 V
V
CC
7 V
300 k
50
SHTDN
50
7 V
V
CC
D Output
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, VCC (see Note 1) –0.3 V to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at any terminal (except SHTDN) –0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range at SHTDN
terminal –0.5 V to V
CC
+ 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (see Note 2): Bus pins (Class 3A) 4 KV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus pins (Class 2B) 200 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
All pins (Class 3A) 3 KV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
All pins (Class 2B) 200 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the GND terminals unless otherwise noted.
2. This rating is measured using MIL-STD-883C Method, 3015.7.
DISSIPATION RATING T ABLE
PACKAGE
TA 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
DGG 1377 mW 11 mW/°C 882 mW 717 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage, V
CC
3 3.3 3.6 V
High-level input voltage (SHTDN), V
IH
2 V
Low-level input voltage (SHTDN), V
IL
0.8 V
Magnitude of differential input voltage, VID 0.1 0.6 V
Common–mode input voltage, VIC (see Figures 2 and 3)
Ť
V
ID
Ť
2
2.4
Ť
V
ID
Ť
2
V
VCC–0.8
Operating free–air temperature, T
A
–40 85 °C
timing requirements
MIN NOM MAX UNIT
t
c
§
Input clock period 15.4 t
c
50 Vns
§
tc is defined as the mean duration of a minimum of 32,000 clock periods.
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
IT+
Positive-going differential input voltage threshold 100
V
IT–
Negative-going differential input voltage threshold
–100
mV
V
OH
High-level output voltage IOH = –4 mA 2.4 V
V
OL
Low-level output voltage IOL = 4 mA 0.4 V
Disabled, all inputs open 280 µA Enabled, AnP at 1 V and AnM at 1.4 V ,
tc = 15.38 ns
62 84 mA
ICCQuiescent current (average)
Enabled, CL = 8 pF (5 places), Worst-case pattern (see Figure 4), tc = 15.38 ns
107 mA
I
IH
High-level input current (SHTDN) VIH = V
CC
±20 µA
I
IL
Low-level input current (SHTDN) VIL = 0 V ±20 µA
I
IN
Input current (A inputs) 0 V ≤ VI 2.4 V ±20 µA
I
OZ
High-impedance output current VO = 0 V or V
CC
±10 µA
All typical values are VCC = 3.3 V, TA = 25°C.
The algebraic convention, in which the less-positive (more-negative) limit is designated minimum, is used in this data sheet for the negative-going input voltage threshold only.
switching characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
t
su
Data setup time, D0 through D27 to CLKOUT
p
4 6
t
h
Data hold time, CLKOUT to D0 through D27
C
L
= 8
pF
See Figure 5
4 6
ns
Receiver input skew margin
§
t
= 15.38 ns (±0.2%),
TA = 0°C to 85°C 490 800
p
t
RSKM
g
(see Figure 7)
c
( ),
|Input clock jitter| <50 ps
TA = –40°C to 0°C 390
ps
t
d
Delay time, input clock to output clock (see Figure 7)
tc = 15.38 ns (±0.2%) 3.7 ns
Change in output clock period from cycle
tc = 15.38 + 0.75 sin (2π500E3t)±0.05 ns, See Figure 7
±80
p
t
C(O)
gy
to cycle
#
tc = 15.38 + 0.75 sin (2≠3E6t) ±0.05 ns, See Figure 7
±300
ps
t
en
Enable time, SHTDN to phase lock See Figure 8 1 ms
t
dis
Disable time, SHTDN to Off state See FIgure 9 400 ns
t
t
Output transition time (tr or tf) CL = 8 pF 3 ns
t
w
Output clock pulse duration 0.43 t
c
ns
§
t
RSKM
is the timing margin available to allocate to the transmitter and interconnection skews and clock jitter. It is defined by
t
c
14
–tsńh.
|Input clock jitter| is the magnitude of the change in the input clock period.
#
t
C(O)
is the change in the output clock period from one cycle to the next cycle observed over 15,000 cycles.
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
AP
AM
V
ID
V
IAM
V
IAP
V
IC
(V
IAP
+ V
IAM
)/2
Figure 2. Voltage Definitions
|VID|– Differential Input Voltage and VCC – V
COMMON-MODE INPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE AND V
CC
1.5
1
0.5
0
0.1 0.30.2 0.4
2.5
0
0.5 0.6
2
MIN
MAX at 3 V
MAX at >3.15 V
– Common-Mode Input Voltage – V
V
IC
Figure 3. Recommended VIC Versus VID and V
CC
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
CLKIN/
CLKOUT
EVEN Dn
ODD Dn
T
Figure 4. Worst-Case Power Test Pattern
The worst-case test pattern produces nearly the maximum switching frequency for all of the LV-TTL outputs.
70%
t
su
CLKOUT
D0–27
30%
70%
30%
V
OH
V
OH
V
OL
V
OL
t
h
Figure 5. Setup and Hold Time Measurements
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
An
and An
CLKIN
7×CLK
(Internal)
CLKOUT
t
s
t
h
4/7 tc ± t
RSKM
3/7 tc ± t
RSKM
t
c
t
d
0 V
300 mV
tr < 1 ns
V
OH
1.4 V
90%
10%
–300 mV
CLKIN or An
CLKOUT
V
OL
Tektronix
HFS9003/HFS9DG1
Stimulus System
(Repeating Patterns
1110111 and 0001000)
DUT
Tektronix Microwave
Logic Multi-BERT-100RX
Word Error Detector
D0–D27
CLKOUTCLKIN
An
CLKIN is advanced or delayed with respect to data until errors are observed at the receiver outputs. The magnitude of the advance or delay is t
RSKM
.
Figure 6. Receiver Input Skew Margin and td Definitions
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
HP8656B Signal
Generator,
0.1 MHz–990 MHz RF Output
OutputModulation Input CLKOUT
HP8665A Synthesized
Signal Generator,
0.1 MHz–4200 MHz
Device Under
Test
CLKIN Input
DTS2070C
Digital Time
Scope
Device
Under
Test
VCO
Reference
Modulation
v(t) = A sin(2πf
mod
t)
Σ
+
+
Figure 7. Output Clock Jitter Test Setup
CLKIN
An
SHTDN
Dn
t
en
Invalid
Valid
Figure 8. Enable Time Waveforms
t
dis
CLKIN
SHTDN
CLKOUT
Figure 9. Disable Time Waveforms
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
10
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
I
CC
60
40
20
0
30 40 50 60 70
80
100
120
f – Frequency – MHz
– Supply Current – mA
140
WORST-CASE SUPPLY CURRENT
vs
FREQUENCY
VCC = 3.3 V
VCC = 3 V
VCC = 3.6 V
Figure 10
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
11
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
16-bit bus extension
In a 16-bit bus application (Figure 11), TTL data and clock coming from bus transceivers that interface the backplane bus arrive at the Tx parallel inputs of the L VDS serdestransmitter. The clock associated with the bus is also connected to the device. The on-chip PLL synchronizes this clock with the parallel data at the input. The data is then multiplexed into three different line drivers which perform the TTL to LVDS conversion. The clock is also converted to L VDS and presented to a separate driver. This synchronized LVDS data and clock at the receiver, which recovers the LVDS data and clock, performs a conversion back to TTL. Data is then demultiplexed into a parallel format. An on-chip PLL synchronizes the received clock with the parallel data, and then all are presented to the parallel output port of the receiver.
SN74FB2032
8
D0–D7
8
D8–D15
SN75L0DS93
LVDS
Interface
0 To 10 Meters
(Media Dependent)
TTL
Interface
16-Bit BTL Bus Interface
CLK
Backplane
Bus
8
D0–D7
8
D8–D15
CLK
Backplane
Bus
TTL
Interface
16-Bit BTL Bus Interface
XMIT Clock RCV Clock
SN74FB2032
SN75LV0S94
SN74FB2032
SN74FB2032
Figure 11. 16-Bit Bus Extension
16-bit bus extension with parity
In the previous application we did not have a checking bit that would provide assurance that the data crosses the link. If we add a parity bit to the previous example, we would have a diagram similar to the one in Figure 12. The device following the SN74FB2032 is a low cost parity generator. Each transmit-side transceiver/parity generator takes the L VTTL data from the corresponding transceiver, performs a parity calculation over the byte, and then passes the bits with its calculated parity value on the parallel input of the LVDS serdes transmitter. Again, the on-chip PLL synchronizes this transmit clock with the eighteen parallel bits (16 data + 2 parity) at the input. The synchronized LVDS data/parity and clock arrive at the receiver.
The receiver performs the conversion from L VDS to LVTTL and the transceiver/parity generator performs the parity calculations. These devices compare their corresponding input bytes with the value received on the parity bit. The transceiver/parity generator will assert its parity error output if a mismatch is detected.
SN65LVDS94 LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
12
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
SN74FB2032
8
D0–D7
8
D8–D15
SN75LVDS93
LVDS
Interface
0 To 10 Meters
(Media Dependent)
TTL
Interface
W/Parity
16-Bit BTL Bus Interface
CLK
Backplane
Bus
8
D0–D7
8
D8–D15
CLK
Backplane
Bus
TTL
Interface
16-Bit BTL Bus Interface
XMIT Clock RCV Clock
9 Bit Latchable
Transceiver/ With
Parity Generator
Parity
Parity
TTL
Interface
Parity
Parity
Parity
Error
TTL
Interface
W/Parity
SN74FB2032
9 Bit Latchable
Transceiver/ With
Parity Generator
SN74FB2032
SN74FB2032
9 Bit Latchable
Transceiver/ With
Parity Generator
9 Bit Latchable
Transceiver/ With
Parity Generator
SN75LVDS94
Figure 12. 16-Bit Bus Extension With Parity
low cost virtual backplane transceiver
Figure 13 represents L VDS serdes in an application as a virtual backplane transceiver (VBT). The concept of a VBT can be achieved by implementing individual LVDS serdes chipsets in both directions of subsystem serialized links.
Depending on the application, the designer will face varying choices when implementing a VBT. In addition to the devices shown in Figure 13, functions such as parity and delay lines for control signals could be included. Using additional circuitry, half-duplex or full-duplex operation can be achieved by configuring the clock and control lines properly.
The designer may choose to implement an independent clock oscillator at each end of the link and then use a PLL to synchronize LVDS serdes’s parallel I/O to the backplane bus. Resynchronizing FIFOs may also be required.
Bus
Transceivers
LVDS Serdes
Transmitter
LVDS Serdes
Receiver
Bus
Transceivers
TTL Inputs Up To
21 or 28
Bits
LVDS
Serial Links
4 or 5 Pairs
TTL
Outputs
Up To
21 or 28
Bits
Bus
Transceivers
LVDS Serdes
Transmitter
LVDS Serdes
Receiver
Bus
Transceivers
Backplane
Bus
Backplane Bus
Figure 13. Virtual Backplane Transceiver
SN65LVDS94
LVDS SERDES RECEIVER
SLLS298E – MAY 1998 – REVISED FEBRUAR Y 2000
13
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PIN SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20
8,30 7,90
0,75 0,50
Seating Plane
25
0,27 0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15 0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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