Texas Instruments SN65LVDS301, SN65LVDS301ZQER Datasheet

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Flatlink 3Gä
1
4
7
*
3
6
9
#
2
5
8
0
Processor
with
RGB
Video
Interface
LVDS302
LVDS301
LCD
Driver
DATACLK
PROGRAMMABLE 27-BIT DISPLAY SERIAL INTERFACE TRANSMITTER
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006

FEATURES

FlatLink™3G serial interface technology
Compatible with FlatLink3G receivers such as
SN65LVDS302
Input supports 24-bit RGB video mode
interface
24-Bit RGB Data, 3 Control Bits, 1 Parity Bit
and 2 Reserved Bits Transmitted over 1, 2 or 3 Differential Lines
SubLVDS Differential Voltage Levels
Effective Data Throughput up to 1755 Mbps
Three Operating Modes to Conserve Power
Active-Mode QVGA 17.4 mW (typ) – Active-Mode VGA 28.8 mW (typ)
FPC cabling typically interconnects the SN65LVDS301 with the display. Compared to parallel signaling, the LVDS301 outputs significantly reduce the EMI of the interconnect by over 20 dB. The electromagnetic emission of the device itself is very low and meets the meets SAE J1752/3 'M'-spec. (see Figure 37 )
The SN65LVDS301 supports three power modes (Shutdown, Standby and Active) to conserve power. When transmitting, the PLL locks to the incoming pixel clock PCLK and generates an internal high-speed clock at the line rate of the data lines. The parallel data are latched on the rising or falling edge of PCLK as selected by the external control signal CPOL. The serialized data is presented on the serial outputs D0, D1, D2 with a recreated PCLK generated from the internal high-speed clock, output
Shutdown Mode 0.5 µ A (typ) on the CLK output. If PCLK stops, the device enters Standby Mode 0.5 µ A (typ)
Bus Swap for Increased PCB Layout
Flexibility
1.8-V Supply Voltage
ESD Rating > 2 kV (HBM)
Typical Application: Host-Controller to
Display-Module Interface
Pixel Clock Range of 4 MHz–65 MHz
a standby mode to conserve power The parallel (CMOS) input bus offers a bus-swap
feature. The SWAP pin configures the input order of the pixel data to be either R[7:0]. G[7:0], B[7:0], VS, HS, DE or B[0:7]. G[0:7], R[0:7], VS, HS, DE. This gives a PCB designer the flexibility to better match the bus to the host controller pinout or to put the transmitter device on the top side or the bottom side of the PCB.
Failsafe on all CMOS Inputs
Packaging: 80 Pin 5mm × 5mm µ BGA
®
Very low EMI meets SAE J1752/3 'M'-spec

DESCRIPTION

The SN65LVDS301 serializer device converts 27 parallel data inputs to 1, 2, or 3 Sub Low-Voltage Differential Signaling (SubLVDS) serial outputs. It loads a shift register with 24 pixel bits and 3 control bits from the parallel CMOS input interface. In addition to the 27 data bits, the device adds a parity bit and two reserved bits into a 30-bit data word. Each word is latched into the device by the pixel clock (PCLK). The parity bit (odd parity) allows a receiver to detect single bit errors. The serial shift register is uploaded at 30, 15, or 10 times the pixel-clock data rate depending on the number of serial links used. A copy of the pixel clock is output on a separate differential output.
FlatLink is a trademark of Texas Instruments. µ BGA is a registered trademark of Tessera, Inc..
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2006, Texas Instruments Incorporated
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[0..26]
0
1
PLL
multiplier
TXEN
PCLK
VS
HS
B[0:7]
G[0:7]
R[0:7]
DE
LS1
8
8
8
SubLVDS
D0+
D0−
SubLVDS
D2+
D2−
SubLVDS
CLK+
CLK−
SubLVDS
D1+
D1−
LS0
CPOL
SWAP
Parity
Calc
1
0
iPCLK
Bit28=0 Bit27=0
3x10, 2x15, or 1x30−bit parallel to serial conversion
Bit29
Glitch
supression
Control /
standby Monitor
x1
x10, x15, or x30
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION (CONTINUED)

Two Link Select lines LS0 and LS1 control whether 1, 2 or 3 serial links are used. The TXEN input may be used to put the SN65LVDS301 in a shutdown mode. The SN65LVDS301 enters an active Standby mode if the input clock PCLK stops. This minimizes power consumption without the need for controlling an external pin. The SN65LVDS301 is characterized for operation over ambient air temperatures of –40 ° C to 85 ° C. All CMOS inputs offer failsafe features to protect them from damage during power-up and to avoid current flow into the device inputs during power-up. An input voltage of up to 2.165 V can be applied to all CMOS inputs while V between 0V and 1.65V.
Functional Block Diagram
is
DD
2
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PINOUT - TOP VIEW

9
8764 5321
A
D
C
B
G
F
E
H
J
G0
B7
R7
B0
DE
HS VS
PCLK
B5
B1B4B2
B3
B6
R1
G6
G5G3
G2
G1 R3R6R5
R2 R4
G7
R0G4
SN65LVDS301
TopView
SWAP
SWAP=0
9
8764 5321
A
D
C
B
G
F
E
H
J
G7
R0
B0
R7
DE
HS VS
PCLK
R2
R6R3R5
R4
R1
B6
G1
G2G4
G5
G6 B4B1B2
B5 B3
G0
B7G3
SN65LVDS301
TopView
SWAP
SWAP=1
1.8V
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006

SWAP PIN FUNCTIONALITY

The SWAP pin allows the pcb designer to reverse the RGB bus to minimize potential signal crossovers in the PCB routing. The two drawings beneath show the RGB signal pin assignment based on the SWAP-pin setting.
Figure 1. SWAP PIN = 0 Figure 2. SWAP PIN = 1
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SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006
Table 1. NUMERIC PIN LIST
PIN SWAP SIGNAL PIN SWAP . . SIGNAL PIN SWAP SIGNAL
A1 GND 0 B6 0 B1
A2
A3
A4
A5
A6
A7 D1
A8 D2
0 G2 1 R1 1 R6 1 G5 0 B7 0 B2 0 G4 1 R0 1 R5 1 G3 C3 UNPOPULATED F3 VDD 0 G6 C4 VDD F4 GND 1 G1 C5 GND F5 GND 0 R0 C6 VDD F6 GND 1 B7 C7 VDD F7 GND 0 R2 C8 GND F8 V 1 B5 C9 LS0 F9 D1+ 0 R4 0 B4 G1 PCLK 1 B3 1 R3 0 B0 0 R6 0 B5 1 R7 1 B1 1 R2 G3 V
A9 GND D3 VDD G4 GND
B1
B2
B3
B4 E1
B5
B6
B7
B8
B9
0 G0 D4 GND G5 GND 1 G7 D5 GND G6 GND 0 G1 D6 GND G7 GND 1 G6 D7 GND G8 GND 0 G3 D8 LS1 G9 D1– 1 G4 D9 D2+ H1 HS 0 G5 0 B3 H2 VS 1 G2 1 R4 H3 GND 0 G7 E2 GND H4 GND 1 G0 E3 VDD H5 V 0 R1 E4 GND H6 GND 1 B6 E5 GND H7 V 0 R3 E6 GND H8 V 1 B4 E7 GND H9 CPOL 0 R5 E8 GND 1 B2 E9 D2– J2 DE 0 R7 J3 TXEN 1 B0 J4 D0–
C1 F1
C2 F2
PLLD
G2
J1 GND
J5 D0+ J6 CLK– J7 CLK+ J8 SWAP J9 GND
DDPLLD
DD
LVDS
LVDS
DDLVDS
PLLA DDPLLA DDLVDS
LVDS
4
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SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006
TERMINAL FUNCTIONS
NAME I/O DESCRIPTION
D0+, D0– SubLVDS Data Link (active during normal operation) D1+, D1–
SubLVDS Out
D2+, D2– CLK+, CLK– SubLVDS output Clock; clock polarity is fixed
R0–R7 Red Pixel Data (8); pin assignment depends on SWAP pin setting G0–G7 Green Pixel Data (8); pin assignment depends on SWAP pin setting B0–B7 Blue Pixel Data (8); pin assignment depends on SWAP pin setting HS Horizontal Sync VS Vertical Sync DE Data Enable PCLK Input Pixel Clock; rising or falling clock polarity is selected by control input CPOL LS0, LS1 Link Select (Determines active SubLVDS Data Links and PLL Range) See Table 2
CMOS IN
TXEN
CPOL CMOS In
SWAP CMOS In
V
DD
GND Supply Ground V
DDLVDS
GND
LVDS
V
DDPLLA
GND
PLLA
V
DDPLLD
GND
PLLD
Power Supply
(1)
(1) For a multilayer pcb, it is recommended to keep one common GND layer underneath the device and connect all ground terminals
directly to this plane.
SubLVDS Data Link (active during normal operation when LS0 = high and LS1 = low, or LS0 = low and LS1=high; high impedance if LS0 = LS1 = low)
SubLVDS Data Link (active during normal operation when LS0 = low and LS1 = high, high-impedance when LS1 = low)
Disables the CMOS Drivers and Turns Off the PLL, putting device in shutdown mode
1 Transmitter enabled 0 Transmitter disabled (Shutdown)
Note: The TXEN input incorporates glitch-suppression logic to avoid device malfunction on short input spikes. It is necessary to pull TXEN high for longer than 10 µ s to enable the transmitter. It is necessary to pull the TXEN input low for longer than 10 µ s to disable the transmitter. At power up, the transmitter is enabled immediately if TXEN = 1 and disabled if TXEN = 0
Input Clock Polarity Selection
0 rising edge clocking 1 falling edge clocking
Bus Swap swaps the bus pins to allow device placement on top or bottom of pcb. See pinout drawing for pin assignments.
0 data input from B0...R7 1 data input from R7...B0
Supply Voltage
SubLVDS I/O supply Voltage SubLVDS Ground PLL analog supply Voltage PLL analog GND PLL digital supply Voltage PLL digital GND
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D0+/– CHANNEL
CLK+
B7
B6
R7
R6
R5
R4
R3
R2 R1
R0
G7 G6 G5 G4G3G2 G1 G0
B5
B4
B3
B2 B1
B0
VS HS DE
0 0
CP R7
R6
CP
00
CLK–
R7
R6
R5
R4
R3
R2 R1
R0
G7 G6 G5 G4 VS0CP
0
B7
B6
G3
G2 G1 G0
B5
B4
B3
B2 B1
B0
HS DE
0
CP R7
R6
G3
G2
CLK+
CLK–
D0+/– Channel
D1+/– Channel
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006

FUNCTIONAL DESCRIPTION

Serialization Modes

The SN65LVDS301 transmitter has three modes of operation controlled by link-select pins LS0 and LS1.
Table 2 shows the serializer modes of operation.
Table 2. Logic Table: Link Select Operating Modes
LS1 LS0 Mode of Operation Data Links Status
0 0 1ChM 1-channel mode (30-bit serialization rate) D0 active;
0 1 2ChM 2-channel mode (15-bit serialization rate) D0, D1 active;
1 0 3ChM 3-channel mode (10-bit serialization rate) D0, D1, D2 active 1 1 Reserved Reserved

1-Channel Mode

While LS0 and LS1 are held low, the SN65LVDS301 transmits payload data over a single SubLVDS data pair, D0. The PLL locks to PCLK and internally multiplies the clock by a factor of 30. The internal high-speed clock is used to serialize (shift out) the data payload on D0. Two reserved bits and the parity bit are added to the data frame. Figure 3 illustrates the timing and the mapping of the data payload into the 30-bit frame. The internal high-speed clock is divided by a factor of 30 to recreate the pixel clock, and presented on the SubLVDS CLK output. While in this mode, the PLL can lock to a clock that is in the range of 4 MHz through 15 MHz. This mode is intended for smaller video display formats (e.g. QVGA to HVGA) that do not require the full bandwidth capabilities of the SN65LVDS301.
D1, D2 high-impedance
D2 high-impedance
Figure 3. Data and Clock Output in 1-Channel Mode (LS0 and LS1 = low).

2-Channel Mode

While LS0 is held high and LS1 is held low, the SN65LVDS301 transmits payload data over two SubLVDS data pairs, D0 and D1. The PLL locks to PCLK and internally multiplies it by a factor of 15. The internal high-speed clock is used to serialize the data payload on D0, and D1. Two reserved bits and the parity bit are added to the data frame. Figure 4 illustrates the timing and the mapping of the data payload into the 30-bit frame and how the frame becomes split into the two output channels. The internal high-speed clock is divided by 15 to recreate the pixel clock, and presented on SubLVDS CLK. The PLL can lock to a clock that is in the range of 8 MHz through 30 MHz in this mode. Typical applications for using the 2-channel mode are HVGA and VGA displays.
Figure 4. Data and Clock Output in 2-Channel Mode (LS0 = high; LS1 = low).
6
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D0+/-CHANNEL
CLK+
B7 B6
R7 R6 R5 R4 R3 R2 R1 R0
G7 G6 G5 G4 G3 G2 G1 G0
B5 B4 B3 B2 B1 B0
VS
HS
DE
CP
0
0
CP
0
0
CLK-
B7 B6
R7 R6
G7 G6D1+/-CHANNEL
D2+/-CHANNEL
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006

3-Channel Mode

While LS0 is held low and LS1 is held high, the SN65LVDS301 transmits payload data over three SubLVDS data pairs D0, D1, and D2. The PLL locks to PCLK, and internally multiplies it by 10. The internal high-speed clock is used to serialize the data payload on D0, D1, and D2. Two reserved bits and the parity bit are added to the data frame. Figure 5 illustrates the timing and the mapping of the data payload into the 30-bit frame and how the frame becomes split over the three output channels. The internal high speed clock is divided back down by a factor of 10 to recreate the pixel clock and presented on SubLVDS CLK output. While in this mode, the PLL can lock to a clock in the range of 20 MHz through 65 MHz. The 3-channel mode supports applications with very large display resolutions such as VGA or XGA.
Figure 5. Data and Clock Output in 3-Channel Mode (LS0 = low; LS1 = high).

Powerdown Modes

The SN65LVDS301 Transmitter has two powerdown modes to facilitate efficient power management.

Shutdown Mode

The SN65LVDS301 enters Shutdown mode when the TXEN pin is asserted low. This turns off all transmitter circuitry, including the CMOS input, PLL, serializer, and SubLVDS transmitter output stage. All outputs are high-impedance. Current consumption in Shutdown mode is nearly zero.

Standby Mode

The SN65LVDS301 enters the Standby mode if TXEN is high and the PCLK input signal frequency is less than 500kHz. All circuitry except the PCLK input monitor is shut down, and all outputs enter high-impedance mode. The current consumption in Standby mode is very low. When the PCLK input signal is completely stopped, the IDDcurrent consumption is less than 10 µ A. The PCLK input must not be left floating.
NOTE:
A floating (left open) CMOS input allows leakage currents to flow from V To prevent large leakage current, a CMOS gate must be kept at a valid logic level, either V
or VIL. This can be achieved by applying an external voltage of V
IH
all SN65LVDS301 inputs.
to GND.
DD
or V
IH
to
IL
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Standby
Mode
Transmit
Mode
Acquire
Mode
TXENHigh>10 sm
PowerUp TXEN=0
PowerUp TXEN=1
CLK Active
PLL AchievedLock
Shutdown
Mode
TXENLow
>10 sm
TXENLow
>10 sm
TXENLow
>10 sm
PCLK
StopsorLost
PCLK
StopsorLost
PCLK Active
PowerUp TXEN=1
CLKInactive
SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006

Active Modes

When TXEN is high and the PCLK input clock signal is faster than 3 MHz, the SN65LVDS301 enters Active mode. Current consumption in Active mode depends on operating frequency and the number of data transitions in the data payload.

Acquire Mode (PLL approaches lock)

The PLL is enabled and attempts to lock to the input Clock. All outputs remain in high-impedance mode. When the PLL monitor detects stable PLL operation, the device switches from Acquire to Transmit mode. For proper device operation, the pixel clock frequency must fall within the valid f operating conditions. If the pixel clock frequency is larger than 3 MHz but smaller than f SN65LVDS301 PLL is enabled. Under such conditions, it is possible for the PLL to lock temporarily to the pixel clock, causing the PLL monitor to release the device into transmit mode. If this happens, the PLL may or may not be properly locked to the pixel clock input, potentially causing data errors, frequency oscillation, and PLL deadlock (loss of VCO oscillation).

Transmit Mode

After the PLL achieves lock, the device enters the normal transmit mode. The CLK pin outputs a copy of PCLK. Based on the selected mode of operation, the D0, D1, and D2 outputs carry the serialized data. In 1-channel mode, outputs D1 and D2 remain high-impedance. In the 2-channel mode, output D2 remains high-impedance.

Parity Bit Generation

The SN65LVDS301 transmitter calculates the parity of the transmit data word and sets the parity bit accordingly. The parity bit covers the 27 bit data payload consisting of 24 bits of pixel data plus VS, HS and DE. The two reserved bits are not included in the parity generation. ODD Parity bit signaling is used. The transmitter sets the Parity bit if the sum of the 27 data bits result in an even number of ones. The Parity bit is cleared otherwise. This allows the receiver to verify Parity and detect single bit errors.
PCLK
range specified under recommended
(min), the
PCLK

Status Detect and Operating Modes Flow diagram

The SN65LVDS301 switches between the power saving and active modes in the following way:
8
Figure 6. Status Detect and Operating Modes Flow Diagram
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SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006
Table 3. Status Detect and Operating Modes Descriptions
Mode Characteristics Conditions
Shutdown Mode Least amount of power consumption
off); All outputs are high-impedance
Standby Mode Low power consumption (only clock activity circuit active; PLL TXEN is high; PCLK input signal is missing or
is disabled to conserve power); All outputs are inactive high-impedance
Acquire Mode PLL tries to achieve lock; All outputs are high-impedance TXEN is high; PCLK input monitor detected input
Transmit Mode Data transfer (normal operation); Transmitter serializes data TXEN is high and PLL is locked to incoming clock
and transmits data on serial output; unused outputs remain high-impedance
(1) In Shutdown Mode, all SN65LVDS301 internal switching circuits (e.g., PLL, serializer, etc.) are turned off to minimize power
consumption. The input stage of any input pin remains active.
(2) Leaving inputs unconnected can cause random noise to toggle the input stage and potentially harm the device. All inputs must be tied to
a valid logic level VILor VIHduring Shutdown or Standby Mode.
(1)
(most circuitry turned TXEN is low
activity
Operating Mode Transitions
MODE TRANSITION USE CASE TRANSITION SPECIFICS
Shutdown Standby Drive TXEN high to enable 1. TXEN high > 10 µ s
Standby Acquire Transmitter activity detected 1. PCLK input monitor detects clock input activity;
Acquire Transmit Link is ready to transfer data 1. PLL is active and approaches lock
Transmit Standby Request Transmitter to enter 1. PCLK Input monitor detects missing PCLK
Transmit/Standby Turn off Transmitter 1. TXEN pulled low for longer than 10us Shutdown
transmitter
Standby mode by stopping PCLK
2. Transmitter enters standby mode a. All outputs are high-impedance b. Transmitter turns on clock input monitor
2. Outputs remain high-impedance;
3. PLL circuit is enabled
2. PLL achieved lock within 2 ms
3. Parallel Data input latches into shift register
4. CLK output turns on
5. selected Data outputs turn on and send out first serial data bit
2. Transmitter indicates standby, putting all outputs into high-impedance;
3. PLL shuts down;
4. PCLK activity input monitor remains active
2. Transmitter indicates standby, putting output CLK+ and CLK– into high-impedance state;
3. Transmitter puts all other outputs into high-impedance state
4. Most IC circuitry is shut down for least power consumption
(1) (2)
(2)
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SN65LVDS301
SLLS681C – FEBRUARY 2006 – REVISED AUGUST 2006
PART NUMBER PACKAGE SHIPPING METHOD
SN65LVDS301ZQE Tray
SN65LVDS301ZQER Reel
ORDERING INFORMATION
ZQE

ABSOLUTE MAXIMUM RATINGS

(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
Supply voltage range, V Voltage range at any input When V
or output terminal
Electrostatic discharge Charged-Device Mode
DD
(2)
, V
When V Human Body Model
Machine Model
, V
DDPLLA
DDx DDx
, V
DDPLLD
DDLVDS
> 0 V -0.5 to 2.175 V
0 V -0.5 to V
(3)
(all Pins) ± 3 kV
(4)
l (all Pins) ± 500 V
(5)
(all pins) ± 200
-0.3 to 2.175 V
+ 2.175 V
DD
Continuous power dissipation See Dissipation Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the GND terminals. (3) In accordance with JEDEC Standard 22, Test Method A114-A. (4) In accordance with JEDEC Standard 22, Test Method C101. (5) In accordance with JEDEC Standard 22, Test Method A115-A

DISSIPATION RATINGS

PACKAGE TA< 25 ° C
ZQE Low-K
CIRCUIT DERATING FACTOR
BOARD MODEL ABOVE TA= 25 ° C POWER RATING
(2)
592 mW 7.407 mW/ ° C 148 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. (2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-2.
(1)
TA= 85 ° C

THERMAL CHARACTERISTICS

PARAMETER TEST CONDITIONS VALUE UNIT
Typical V
P
Device Power Dissipation
D
Maximum V
10
= 1.8 V, TA= 25 ° C mW
DDx
= 1.95 V, TA= –40 ° C mW
DDx
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PCLK at 4 MHz 14.4 PCLK at 65 MHz 44.5 PCLK at 4 MHz 22.3 PCLK=65 MHz 71.8
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