TEXAS INSTRUMENTS SN54LS682 Technical data

查询74LS682供应商

PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

84151012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 8415101RA ACTIVE CDIP J 20 1 TBD CallTI Level-NC-NC-NC 8415101RA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC 8415101SA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC 8415101SA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC 84152012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 8415201RA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC 8415201SA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC 84153012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 8415301RA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC

8415301SA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC SN54LS682J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SN54LS682J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SN54LS684J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SN54LS688J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC

SN74LS682DW ACTIVE SOIC DW 20 25 Green (RoHS &

SN74LS682DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &

SN74LS682DWR ACTIVE SOIC DW 20 2000 Green (RoHS &

SN74LS682DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &

SN74LS682N ACTIVE PDIP N 20 20 Pb-Free

SN74LS682NE4 ACTIVE PDIP N 20 20 Pb-Free

SN74LS682NSR ACTIVE SO NS 20 2000 Green (RoHS &

SN74LS682NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU Level-NC-NC-NC

CU NIPDAU Level-1-260C-UNLIM

26-Sep-2005

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

SN74LS684DW ACTIVE SOIC DW 20 25 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS684DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS684DWR ACTIVE SOIC DW 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS684DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS684N ACTIVE PDIP N 20 20 Pb-Free

CU NIPDAU Level-NC-NC-NC

(RoHS)

SN74LS684NSR ACTIVE SO NS 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS684NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS686DW OBSOLETE SOIC DW 24 TBD Call TI Call TI

SN74LS686NT OBSOLETE PDIP NT 24 TBD Call TI Call TI SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI Call TI SN74LS687NT OBSOLETE PDIP NT 24 TBD Call TI Call TI

SN74LS688DW ACTIVE SOIC DW 20 25 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS688DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS688DWR ACTIVE SOIC DW 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS688DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS688N ACTIVE PDIP N 20 20 Pb-Free

CU NIPDAU Level-NC-NC-NC

(RoHS)

SN74LS688N3 OBSOLETE PDIP N 20 TBD Call TI Call TI

SN74LS688NE4 ACTIVE PDIP N 20 20 Pb-Free

CU NIPDAU Level-NC-NC-NC

(RoHS)

SN74LS688NSR ACTIVE SO NS 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74LS688NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br) SNJ54LS682FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS682FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS682J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS682J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS682W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS684FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS684J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS684W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS688FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC

SNJ54LS688J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS688W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC

26-Sep-2005

(3)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

(1)

The marketing status values are defined as follows:

26-Sep-2005

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A SQ

B SQ

19

20

21

22

23

24

25

12826 27

12

1314151618 17

0.020 (0,51)

0.010 (0,25)

MIN

0.342 (8,69)

0.442

0.640

0.739

0.938

1.141

A

0.358 (9,09)

0.458

(11,63)

0.660

(16,76)

0.761

(19,32)(18,78)

0.962

(24,43)

1.165

(29,59)

NO. OF

TERMINALS

**

11

10

9

8

7

6

5

432

20

28

44

52

68

84

0.020 (0,51)

0.010 (0,25)

(11,23)

(16,26)

(23,83)

(28,99)

MINMAX

0.307 (7,80)

0.406

(10,31)

0.495

(12,58)

0.495

(12,58)

0.850 (21,6)

1.047 (26,6)

0.080 (2,03)

0.064 (1,63)

B

MAX

0.358 (9,09)

0.458

(11,63)

0.560

(14,22)

0.560

(14,22)

0.858 (21,8)

1.063 (27,0)

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

4040140/D 10/96

MECHANICAL DATA

MPDI004 – OCTOBER 1994

NT (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE

24 PINS SHOWN

24

DIM

A MAX

A MIN

B MAX

B MIN

PINS **

24

1.260

(32,04)

1.230

(31,24)

0.310

(7,87)

0.290

(7,37)

0°–15°

28

1.425

(36,20)

1.385

(35,18)

0.315 (8,00)

0.295 (7,49)

B

A

13

0.280 (7,11)

0.250 (6,35)

1

0.070 (1,78) MAX

0.020 (0,51) MIN

0.100 (2,54)

0.021 (0,53)

0.015 (0,38)

0.010 (0,25)

M

12

0.200 (5,08) MAX Seating Plane

0.125 (3,18) MIN

0.010 (0,25) NOM

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

4040050/B 04/95

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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