OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
D
Choice of Eight Latches or Eight D-Type
Flip-Flops in a Single Package
D
3-State Bus-Driving Outputs
D
Full Parallel Access for Loading
D
Buffered Control Inputs
D
Clock-Enable Input Has Hysteresis to
Improve Noise Rejection (’S373 and ’S374)
D
P-N-P Inputs Reduce DC Loading on Data
Lines (’S373 and ’S374)
description
These 8-bit registers feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The
high-impedance 3-state and increased
high-logic-level drive provide these registers with
the capability of being connected directly to and
driving the bus lines in a bus-organized system
without need for interface or pullup components.
These devices are particularly attractive for
implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
The eight latches of the ’LS373 and ’S373 are
transparent D-type latches, meaning that while
the enable (C or CLK) input is high, the Q outputs
follow the data (D) inputs. When C or CLK is taken
low, the output is latched at the level of the data
that was set up.
The eight flip-flops of the ’LS374 and ’S374 are
edge-triggered D-type flip-flops. On the positive
transition of the clock, the Q outputs are set to the
logic states that were set up at the D inputs.
SN54LS373, SN54LS374, SN54S373,
SN74LS373, SN74S374 . . . DW, N, OR NS PACKAGE
SN54S374 . . . J OR W PACKAGE
SN74LS374 . . . DB, DW, N, OR NS PACKAGE
SN74S373 . . . DW OR N PACKAGE
†
C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
SN54LS373, SN54LS374, SN54S373,
SN54S374 . . . FK PACKAGE
2D
2Q
3Q
3D
4D
†
C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
(TOP VIEW)
1
OC
2
1Q
3
1D
4
2D
5
2Q
6
3Q
7
3D
8
4D
9
4Q
GND
10
(TOP VIEW)
1D1QOC
3212019
4
5
6
7
8
910111213
4Q
†
GND
20
V
CC
19
8Q
18
8D
17
7D
16
7Q
15
6Q
14
6D
13
5D
12
5Q
†
11
C
CC
8Q
V
8D
18
7D
17
7Q
16
6Q
15
6D
14
5D
C
5Q
Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design
as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered
output-control (OC
) input can be used to place the eight outputs in either a normal logic state (high or low logic
levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly.
OC
does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new
data can be entered, even while the outputs are off.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2002, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
PACKAGE
–
–
–
–
†
TubeSN74LS373NSN74LS373N
TubeSN74LS374NSN74LS374N
TubeSN74S373NSN74S373N
TubeSN74S374NSN74S374N
TubeSN74LS373DW
Tape and reelSN74LS373DWR
TubeSN74LS374DW
Tape and reelSN74LS374DWR
TubeSN74S373DW
Tape and reelSN74S373DWR
TubeSN74S374DW
Tape and reelSN74S374DWR
Tape and reelSN74LS373NSR74LS373
Tape and reelSN74LS374NSR74LS374
Tape and reelSN74S374NSR74S374
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. V oltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Outputs high160
Outputs low160
Outputs disabled190
Outputs high110
Outputs low140
Outputs disabled160
CLK and OC at 4 V, D inputs at 0 V180
‡
TYP
2V
MAXUNIT
0.8V
mA
m
A
m
A
m
A
m
A
switching characteristics, V
FROMTO
(INPUT)(OUTPUT)
f
max
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
NOTE 3. Maximum clock frequency is tested with all outputs loaded.
f
= maximum clock frequency
max
t
= propagation delay time, low-to-high-level output
PLH
t
= propagation delay time, high-to-low-level output
PHL
t
= output enable time to high level
PZH
t
= output enable time to low level
PZL
t
= output disable time from high level
PHZ
t
= output disable time from low level
PLZ
= 5 V, TA = 25°C (see Figure 2)
CC
RL = 280 Ω, CL = 15 pF,
See Note 3
R
= 280 Ω,C
See Note 3
R
= 280 Ω,C
See Note 3
R
= 280 Ω,C
See Note 3
=
L
= 15 pF,
= 15 pF,
= 15 pF,
p
=
L
’S373’S374
MINTYPMAXMINTYPMAX
75100MHz
712
712
714815
12181117
815815
11181118
6959
812712
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
SERIES 54LS/74LS DEVICES
V
Test
Point
C
L
V
CC
R
L
(see Note B)
From Output
Under Test
(see Note A)
CC
V
CC
R
L
Test
Point
C
L
From Output
Under Test
(see Note A)
Test
R
Point
C
L
L
S1
(see Note B)
5 kΩ
S2
FOR 2-STATE TOTEM-POLE OUTPUTS
High-Level
Low-Level
In-Phase
(see Note D)
Out-of-Phase
(see Note D)
NOTES: A. CL includes probe and jig capacitance.
LOAD CIRCUIT
Pulse
Pulse
Input
t
PLH
Output
t
PHL
Output
PROPAGATION DELAY TIMES
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for t
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
H. All parameters and waveforms are not applicable to all devices .
The marketing status values are defined as follows:
8-Jun-2005
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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