PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
JM38510/07102BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30103BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112AN ACTIVE PDIP N 16 25 Pb-Free
SN74LS112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS112ANE4 ACTIVE PDIP N 16 25 Pb-Free
SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74LS112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112AD OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112AN ACTIVE PDIP N 16 25 Pb-Free
SN74S112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S112ANE4 ACTIVE PDIP N 16 25 Pb-Free
SN74S112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
4-Jun-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
4-Jun-2007
(3)
SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS112AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S112FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
JM38510/07102BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30103BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74LS112AN ACTIVE PDIP N 16 25 Pb-Free
SN74LS112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS112ANE4 ACTIVE PDIP N 16 25 Pb-Free
SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74LS112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112AD OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
SN74S112AN ACTIVE PDIP N 16 25 Pb-Free
SN74S112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S112ANE4 ACTIVE PDIP N 16 25 Pb-Free
SN74S112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
SN74S112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
9-Oct-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
9-Oct-2007
(3)
SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS112AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S112FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
19-Mar-2008
*All dimensions are nominal
Device Package
SN74LS112ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LS112ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S112ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74S112ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length(mm) Width (mm) Height (mm)
SN74LS112ADR SOIC D 16 2500 333.2 345.9 28.6
SN74LS112ANSR SO NS 16 2000 346.0 346.0 33.0
SN74S112ADR SOIC D 16 2500 333.2 345.9 28.6
SN74S112ANSR SO NS 16 2000 346.0 346.0 33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
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