Datasheet SN54HC32, SN74HC32 Datasheet (TEXAS INSTRUMENTS)

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SOIC – D

HC32

–40°C to 85°C

TSSOP – PW

HC32

–55°C to 125°C

SN54HC32, SN74HC32

QUADRUPLE 2-INPUT POSITIVE-OR GATES

SCLS200D – DECEMBER 1982 – REVISED AUGUST 2003

Wide Operating Voltage Range of 2 V to 6 V

Outputs Can Drive Up To 10 LSTTL Loads

Low Power Consumption, 20-µA Max I

SN54HC32 ...J OR W PACKAGE

SN74HC32 . . . D, DB, N, NS, OR PW PACKAGE

1A 1B 1Y 2A 2B 2Y

GND

(TOP VIEW)

10 6 7

4B 4A 4Y 3B

Typical t

±4-mA Output Drive at 5 V

Low Input Current of 1 µA Max

SN54HC32 . . . FK PACKAGE

NC – No internal connection

= 8 ns

(TOP VIEW)

1B1ANC

3212019

4 5 6 7 8

910111213

GND

18 17 16 15 14

4A NC 4Y NC 3B

description/ordering information

The ’HC32 devices contain four independent 2-input OR gates. They perform the Boolean function

Y+A

• B or Y+A)B

in positive logic.

ORDERING INFORMA TION

PDIP – N Tube of 25 SN74HC32N SN74HC32N

SOP – NS Reel of 2000 SN74HC32NSR HC32 SSOP – DB Reel of 2000 SN74HC32DBR HC32

CDIP – J Tube of 25 SNJ54HC32J SNJ54HC32J CFP – W T ube of 150 SNJ54HC32W SNJ54HC32W LCCC – FK Tube of 55 SNJ54HC32FK SNJ54HC32FK

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

PACKAGE

†

Tube of 50 SN74HC32D Reel of 2500 SN74HC32DR Reel of 250 SN74HC32DT

Tube of 90 SN74HC32PW Reel of 2000 SN74HC32PWR Reel of 250 SN74HC32PWT

ORDERABLE

PART NUMBER

TOP-SIDE MARKING

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

SN54HC32, SN74HC32

OUTPUT

UNIT

VIHHigh-level input voltage

VILLow-level input voltage

Input transition rise/fall time

QUADRUPLE 2-INPUT POSITIVE-OR GATES

SCLS200D – DECEMBER 1982 – REVISED AUGUST 2003

FUNCTION TABLE

(each gate)

INPUTS

A B

H X H X HH

L L L

logic diagram (positive logic)

A B

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V Input clamp current, I Output clamp current, I Continuous output current, I Continuous current through V Package thermal impedance, θ

–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†

DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

stg

recommended operating conditions (see Note 3)

SN54HC32 SN74HC32

MIN NOM MAX MIN NOM MAX

V V

∆t/∆

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Supply voltage 2 5 6 2 5 6 V

VCC = 2 V 1.5 1.5 VCC = 4.5 V 3.15 3.15 VCC = 6 V 4.2 4.2 VCC = 2 V 0.5 0.5 VCC = 4.5 V 1.35 1.35 VCC = 6 V 1.8 1.8

Input voltage 0 V

Output voltage 0 V

VCC = 2 V 1000 1000 VCC = 4.5 V 500 500 VCC = 6 V 400 400

Operating free-air temperature –55 125 –40 85 °C

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

CC CC

0 V 0 V

CC CC

V V

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54HC32, SN74HC32

PARAMETER

TEST CONDITIONS

UNIT

IOH = –20 µA

VI = VIH or V

IIH IL

IOL = 20 µA

VI = VIH or V

IIH IL

FROM

PARAMETER

FROM

UNIT

tpdA or B

ttY

QUADRUPLE 2-INPUT POSITIVE-OR GATES

SCLS200D – DECEMBER 1982 – REVISED AUGUST 2003

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)

TA = 25°C SN54HC32 SN74HC32

MIN TYP MAX MIN MAX MIN MAX

2 V 1.9 1.998 1.9 1.9

4.5 V 4.4 4.499 4.4 4.4 6 V 5.9 5.999 5.9 5.9

IOH = –4 mA 4.5 V 3.98 4.3 3.7 3.84 IOH = –5.2 mA 6 V 5.48 5.8 5.2 5.34

2 V 0.002 0.1 0.1 0.1

4.5 V 0.001 0.1 0.1 0.1 6 V 0.001 0.1 0.1 0.1

IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33

IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33 I I C

I CC

VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA VI = VCC or 0, IO = 0 6 V 2 40 20 µA

2 V to 6 V 3 10 10 10 pF

switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)

TA = 25°C SN54HC32 SN74HC32

(INPUT)

(OUTPUT)

MIN TYP MAX MIN MAX MIN MAX

2 V 50 100 150 125

4.5 V 10 20 30 25 6 V 8 17 25 21 2 V 38 75 110 95

4.5 V 8 15 22 19 6 V 6 13 19 16

operating characteristics, TA = 25°C

PARAMETER TEST CONDITIONS TYP UNIT

Power dissipation capacitance per gate No load 20 pF

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54HC32, SN74HC32

PLH

PHL

QUADRUPLE 2-INPUT POSITIVE-OR GATES

SCLS200D – DECEMBER 1982 – REVISED AUGUST 2003

PARAMETER MEASUREMENT INFORMATION

From Output

Under Test

LOAD CIRCUIT

Input

NOTES: A. CL includes probe and test-fixture capacitance.

90% 90%

VOLTAGE WAVEFORM

INPUT RISE AND FALL TIMES

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following

characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. t

and t

Test Point

CL = 50 pF (see Note A)

50%50%

are the same as tpd.

10%10%

0 V

Figure 1. Load Circuit and Voltage Waveforms

Input

In-Phase

Output

Out-of-Phase

Output

50%

PLH

90% 90%

PHL

50% 50%

10% 10%

PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

VOLTAGE WAVEFORMS

50%

PHL

50%50%

PLH

0 V

10%10%

90%90%

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-8404501VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-8404501VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

84045012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 8404501CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 8404501DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

JM38510/65201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/65201BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type JM38510/65201BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

SN54HC32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

SN74HC32D ACTIVE SOIC D 14 50 Green (RoHS &

SN74HC32DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI

SN74HC32DBR ACTIVE SSOP DB 14 2000 Green(RoHS &

SN74HC32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &

SN74HC32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &

SN74HC32DE4 ACTIVE SOIC D 14 50 Green (RoHS &

SN74HC32DG4 ACTIVE SOIC D 14 50 Green (RoHS &

SN74HC32DR ACTIVE SOIC D 14 2500 Green (RoHS &

SN74HC32DRE4 ACTIVE SOIC D 14 2500 Green(RoHS &

SN74HC32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &

SN74HC32DT ACTIVE SOIC D 14 250 Green (RoHS &

SN74HC32DTE4 ACTIVE SOIC D 14 250 Green (RoHS &

SN74HC32DTG4 ACTIVE SOIC D 14 250 Green (RoHS &

SN74HC32N ACTIVE PDIP N 14 25 Pb-Free

SN74HC32N3 OBSOLETE PDIP N 14 TBD Call TI Call TI

SN74HC32NE4 ACTIVE PDIP N 14 25 Pb-Free

SN74HC32NSR ACTIVE SO NS 14 2000 Green (RoHS &

SN74HC32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &

SN74HC32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &

SN74HC32PW ACTIVE TSSOP PW 14 90 Green (RoHS &

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

9-Oct-2007

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

SN74HC32PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

9-Oct-2007

(3)

no Sb/Br)

SN74HC32PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI

SN74HC32PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWT ACTIVE TSSOP PW 14 250 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SN74HC32PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SNJ54HC32FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54HC32J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

SNJ54HC32W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

19-Mar-2008

*All dimensions are nominal

Device Package

SN74HC32DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

SN74HC32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74HC32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

SN74HC32PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

19-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74HC32DBR SSOP DB 14 2000 346.0 346.0 33.0

SN74HC32DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC32DR SOIC D 14 2500 346.0 346.0 33.0

SN74HC32NSR SO NS 14 2000 346.0 346.0 33.0

SN74HC32PWR TSSOP PW 14 2000 346.0 346.0 29.0

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,65

2,00 MAX

0,38 0,22

0,05 MIN

0,15

5,60 5,00

8,20 7,40

Seating Plane

0,10

0,25 0,09

0°–ā8°

Gage Plane

0,25

0,95 0,55

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

6,50

5,905,90

2016

7,50

6,90

8,50

10,50

9,907,90

10,50

9,90

12,90

12,30

4040065 /E 12/01

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A SQ

B SQ

12826 27

1314151618 17

0.020 (0,51)

0.010 (0,25)

MIN

0.342 (8,69)

0.442

0.640

0.739

0.938

1.141

0.358

(9,09)

0.458

(11,63)

0.660

(16,76)

0.761

(19,32)(18,78)

0.962

(24,43)

1.165

(29,59)

NO. OF

TERMINALS

432

0.020 (0,51)

0.010 (0,25)

(11,23)

(16,26)

(23,83)

(28,99)

MINMAX

0.307 (7,80)

0.406

(10,31)

0.495

(12,58)

0.495

(12,58)

0.850 (21,6)

1.047 (26,6)

0.080 (2,03)

0.064 (1,63)

MAX

0.358 (9,09)

0.458

(11,63)

0.560

(14,22)

0.560

(14,22)

0.858 (21,8)

1.063 (27,0)

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

4040140/D 10/96

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

0,30 0,19

4,50 4,30

PINS **

Seating Plane

0,15 0,05

DIM

0,10

6,60 6,20

0,10

0,15 NOM

0°–8°

2016

Gage Plane

0,25

0,75 0,50

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Datasheet SN54HC32, SN74HC32 Datasheet (TEXAS INSTRUMENTS)

Specifications and Main Features

Frequently Asked Questions

User Manual