Package Options Include Plastic
Small-Outline (D) and Ceramic Flat (W)
Packages, Ceramic Chip Carriers (FK), and
Standard Plastic (N) and Ceramic (J)
300-mil DIPs
description
These monolithic positive-edge-triggered D-type
flip-flops have a direct clear (CLR) input.
Information at the data (D) inputs meeting the
setup time requirements is transferred to the
outputs on the positive-going edge of the clock
(CLK) pulse. Clock triggering occurs at a
particular voltage level and is not directly related
to the transition time of the positive-going edge of
CLK. When CLK is at either the high or low level,
the D input has no effect at the output.
SN54HC174 ...J OR W PACKAGE
SN74HC174 . . . D OR N PACKAGE
SN54HC174 . . . FK PACKAGE
1D
2D
NC
2Q
3D
(TOP VIEW)
CLR
1
1Q
2
1D
3
2D
4
2Q
5
3D
6
3Q
7
GND
8
(TOP VIEW)
1Q
3212019
4
5
6
7
8
910111213
CLR
NC
16
15
14
13
12
11
10
9
V
CC
V
CC
6Q
6D
5D
5Q
4D
4Q
CLK
6Q
18
17
16
15
14
6D
5D
NC
5Q
4D
The SN54HC174 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74HC174 is characterized for
operation from –40°C to 85°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
CLRCLKD
LXXL
H↑HH
H↑LL
HLXQ
OUTPUT
Q
0
NC
CLK
4Q
3Q
GND
NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
SN54HC174, SN74HC174
HEX D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS119B – DECEMBER 1982 – REVISED MAY 1997
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, N, and W packages.
†
CLR
CLK
1D
2D
3D
4D
5D
6D
1
9
3
4
6
11
13
14
R
C1
1D
logic diagram (positive logic)
1
CLR
9
CLK
1D
3
1D
C1
R
10
12
15
2
1Q
5
2Q
7
3Q
4Q
5Q
6Q
2
1Q
To Five Other Channels
Pin numbers shown are for the D, J, N, and W packages.
absolute maximum ratings over operating free-air temperature range
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°CSN54HC174SN74HC174
CC
MINMAXMINMAXMINMAX
2 V0604.205
f
clock
t
h
Clock frequency
p
Hold time, data after CLK
CLR low
CLK high or low
Data
CLR inactive
4.5 V
6 V036025029
2 V80120100
4.5 V162420
6 V142017
2 V80120100
4.5 V162420
6 V142017
2 V100150125
4.5 V203025
6 V172521
2 V100150125
4.5 V203025
6 V172521
2 V000
4.5 V000
6 V000
031021025
MHz
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54HC174SN74HC174
MINTYPMAXMINMAXMINMAX
MHz
ns
f
max
pd
t
t
FROMTO
(INPUT)(OUTPUT)
CLRAny
CLKAny
Any
CC
2 V694.25
4.5 V31442125
6 V36502529
2 V58160240200
4.5 V17324840
6 V14274134
2 V58160240200
4.5 V17324840
6 V14274134
2 V387511090
4.5 V8152219
6 V6131916
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitance per flip-flopNo load27pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
50%
Test
Point
CL = 50 pF
(see Note A)
t
h
50%50%
From Output
Under Test
LOAD CIRCUIT
Reference
Input
t
su
Data
Input
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
90%90%
t
r
VOLTAGE WAVEFORMS
SN54HC174, SN74HC174
HEX D-TYPE FLIP-FLOPS
WITH CLEAR
SCLS119B – DECEMBER 1982 – REVISED MAY 1997
V
0 V
V
0 V
CC
CC
V
CC
0 V
V
50%50%
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
High-Level
Pulse
Low-Level
Pulse
Input
V
CC
0 V
V
CC
10%10%
0 V
t
f
In-Phase
Output
Out-of-Phase
Output
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
t
t
PLH
PHL
50%
t
w
50%
VOLTAGE WAVEFORMS
PULSE DURATIONS
90%90%
t
r
50%50%
10%10%
t
f
VOLTAGE WAVEFORMS
50%
t
50%
50%
t
PHL
PLH
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, f
D. The outputs are measured one at a time with one input transition per measurement.
E. t
PLH
and t
PHL
is measured when the input duty cycle is 50%.
max
are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. T esting and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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