The ’HC04 devices contain six independent inverters. They perform the Boolean function
Y = A
in positive logic.
ORDERING INFORMA TION
T
A
PDIP – NTube of25SN74HC04NSN74HC04N
SOIC – D
–
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
SOP – NSReel of 2000SN74HC04NSRHC04
TSSOP – PW
CDIP – JTube of 25SNJ54HC04JSNJ54HC04J
CFP – WT ube of 150SNJ54HC04WSNJ54HC04W
LCCC – FKTube of 55SNJ54HC04FKSNJ54HC04FK
PACKAGE
†
Tube of 50SN74HC04D
Reel of 2500SN74HC04DR
Reel of 250SN74HC04DT
Tube of 90SN74HC04PW
Reel of 2000SN74HC04PWR
Reel of 250SN74HC04PWT
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
HC04
HC04
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
FUNCTION TABLE
(each inverter)
INPUT
A
HL
LH
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OUTPUT
Y
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
SN54HC04, SN74HC04
UNIT
HEX INVERTERS
SCLS078D – DECEMBER 1982 – REVISED JULY 2003
logic diagram (positive logic)
AY
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
FROMTO
(INPUT)(OUTPUT)
t
pd
t
t
AY
Y
CC
2 V4595145120
4.5 V9192924
6 V8162520
2 V387511095
4.5 V8152219
6 V6131916
TA = 25°CSN54HC04SN74HC04
MINTYPMAXMINMAXMINMAX
ns
ns
operating characteristics, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
Power dissipation capacitance per inverterNo load20pF
pd
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54HC04, SN74HC04
HEX INVERTERS
SCLS078D – DECEMBER 1982 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
Test
Point
CL = 50 pF
(see Note A)
Input
From Output
Under Test
LOAD CIRCUIT
90%90%
t
r
V
Input
In-Phase
Output
V
50%50%
CC
10%10%
0 V
t
f
Out-of-Phase
Output
50%
t
t
PLH
PHL
50%
t
PHL
90%90%
t
r
t
PLH
50%50%
10%10%
t
f
50%50%
CC
0 V
V
OH
10%10%
V
OL
t
f
V
OH
90%90%
V
OL
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. t
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
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