Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the logic level at the
direction-control (DIR) input. The output enable
(OE
) input can be used to disable the device so the
buses are effectively isolated.
The SN74F245 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F245 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F245 is characterized for
operation from 0°C to 70°C.
SN54F245 ...J PACKAGE
SN74F245 . . . DB, DW, OR N PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
DIR
1
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
9
A8
GND
SN54F245 . . . FK PACKAGE
10
(TOP VIEW)
A2A1DIR
3212019
4
5
6
7
8
910 11 12 13
20
19
18
17
16
15
14
13
12
11
V
CC
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
CC
B1
B2
B3
B4
B5
FUNCTION TABLE
INPUTS
OEDIR
LLB data to A bus
LHA data to B bus
HXIsolation
A8
GND
B8
B7
B6OE
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCT OBER 1993
19
1
2
3
4
5
6
7
8
9
†
G3
3EN1[BA]
3EN2[AB]
1
2
18
17
16
15
14
13
12
11
logic diagram (positive logic)
1
DIR
B1
B2
B3
B4
B5
B6
B7
B8
A1
2
To Seven Other Channels
19
18
OE
B1
logic symbol
OE
DIR
A1
A2
A3
A4
A5
A6
A7
A8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
t
†
NOTE 2: Load circuits and waveforms are shown in Section 1.
PLZ
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
FROM
INPUT
TO
OUTPUT
RL = 500 Ω,
TA = 25°C
′F245SN54F245SN74F245
MINTYPMAXMINMAXMINMAX
1.73.861.27.51.77
1.74.261.27.51.77
2.24.971.792.28
2.75.682.2102.79
2.24.66.51.792.27.5
1.24.66.51.2101.27.5
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX
†
UNIT
2–4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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