Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the logic level at the
direction-control (DIR) input. The output enable
(OE
) input can be used to disable the device so the
buses are effectively isolated.
The SN74F245 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F245 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F245 is characterized for
operation from 0°C to 70°C.
SN54F245 ...J PACKAGE
SN74F245 . . . DB, DW, OR N PACKAGE
A3
A4
A5
A6
A7
(TOP VIEW)
DIR
1
A1
2
A2
3
A3
4
A4
5
A5
6
A6
7
A7
8
9
A8
GND
SN54F245 . . . FK PACKAGE
10
(TOP VIEW)
A2A1DIR
3212019
4
5
6
7
8
910 11 12 13
20
19
18
17
16
15
14
13
12
11
V
CC
V
OE
B1
B2
B3
B4
B5
B6
B7
B8
18
17
16
15
14
CC
B1
B2
B3
B4
B5
FUNCTION TABLE
INPUTS
OEDIR
LLB data to A bus
LHA data to B bus
HXIsolation
A8
GND
B8
B7
B6OE
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
SN54F245, SN74F245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SDFS010A – MARCH 1987 – REVISED OCT OBER 1993
19
1
2
3
4
5
6
7
8
9
†
G3
3EN1[BA]
3EN2[AB]
1
2
18
17
16
15
14
13
12
11
logic diagram (positive logic)
1
DIR
B1
B2
B3
B4
B5
B6
B7
B8
A1
2
To Seven Other Channels
19
18
OE
B1
logic symbol
OE
DIR
A1
A2
A3
A4
A5
A6
A7
A8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1YEAR
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
Addendum-Page 1
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