Small-Outline Packages, Ceramic Chip
Carriers, and Standard Plastic and Ceramic
300-mil DIPs
description
These devices contain two independent J-K
positive-edge-triggered flip-flops. A low level at
the preset (PRE
resets the outputs regardless of the levels of the
other inputs. When PRE
(high), data at the J and K
setup-time requirements are transferred to the
outputs on the positive-going edge of the clock
pulse. Clock triggering occurs at a voltage level
and is not directly related to the rise time of the
clock pulse. Following the hold time interval, data
at the J and K
affecting the levels at the outputs. These versatile
flip-flops can perform as toggle flip-flops by
grounding K
perform as D-type flip-flops if J and K
together.
The SN54F109 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F109 is characterized for
operation from 0°C to 70°C.
) or clear (CLR) inputs sets or
and CLR are inactive
input meeting the
inputs may be changed without
and trying J high. They also can
are tied
SN54F109 ...J PACKAGE
SN74F109 ...D OR N PACKAGE
1CLR
1CLK
1PRE
1K
1CLK
NC
1PRE
1Q
NC – No internal connection
(TOP VIEW)
NC
NC
16
15
14
13
12
11
10
9
CC
V
2Q
VCC
2CLR
2J
2K
2CLK
2PRE
2Q
2Q
2CLR
18
17
16
15
14
2Q
1
1J
2
1K
3
4
5
1Q
6
7
1Q
GND
SN54F109 . . . FK PACKAGE
8
(TOP VIEW)
1J
1CLR
3212019
4
5
6
7
8
910111213
1Q
GND
2J
2K
NC
2CLK
2PRE
FUNCTION TABLE
INPUTS
PRECLRCLKJKQQ
LHXXXHL
HLXXXLH
LLXXXH
HH↑LLLH
HH↑HLToggle
HH↑LHQ
HH↑HHHL
HHLXXQ
†
The output levels are not guaranteed to meet the minimum
levels for VOH. Furthermore, this configuration is nonstable;
that is, it will not persist when PRE
inactive (high) level.
OUTPUTS
†
H
Q
0
Q
0
or CLR returns to its
†
0
0
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
SN54F109, SN74F109
UNIT
DUAL J-K
POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SDFS047A – MARCH 1987 – REVISED OCT OBER 1993
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, and N packages.
†
1PRE
1J
1CLK
1K
1CLR
2PRE
2J
2CLK
2K
2CLR
5
2
4
3
1
11
14
12
13
15
S
1J
1K
R
C1
10
6
1Q
7
1Q
2Q
9
2Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
5962-9758001Q2AACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
5962-9758001QEAACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
5962-9758001QFAACTIVECFPW161TBDA42N / A for Pkg Type
JM38510/34102B2AACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
JM38510/34102BEAACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
JM38510/34102BFAACTIVECFPW161TBDA42N / A for Pkg Type
SN74F109DACTIVESOICD1640Green (RoHS &
no Sb/Br)
SN74F109DE4ACTIVESOICD1640Green (RoHS &
no Sb/Br)
SN74F109DG4ACTIVESOICD1640Green (RoHS &
no Sb/Br)
SN74F109DRACTIVESOICD162500 Green (RoHS &
no Sb/Br)
SN74F109DRE4ACTIVESOICD162500 Green (RoHS &
no Sb/Br)
SN74F109DRG4ACTIVESOICD162500 Green (RoHS &
no Sb/Br)
SN74F109NACTIVEPDIPN1625Pb-Free
SN74F109NE4ACTIVEPDIPN1625Pb-Free
SNJ54F109FKACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type
SNJ54F109JACTIVECDIPJ161TBDA42 SNPBN / A for Pkg Type
SNJ54F109WACTIVECFPW161TBDA42N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAUN / A for Pkg Type
CU NIPDAUN / A for Pkg Type
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.