Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK), and Standard Plastic (N)
and Ceramic (J) 300-mil DIPs
description
These octal buffers and line drivers are designed
specifically to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters by eliminating the need for 3-state
overlap protection. The designer has a choice of
selected combinations of inverting and
noninverting outputs, symmetrical active-low
output-enable (OE
OE and OE
fan-out and improved fan-in.
The SN54AS756 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74AS756 and SN74AS757 are
characterized for operation from 0°C to 70°C.
) inputs, and complementary
inputs. These devices feature high
SN74AS756, SN74AS757 . . . DW OR N PACKAGE
SN54AS756 ...J PACKAGE
(TOP VIEW)
1OE
1
1A1
2
2Y4
3
1A2
4
2Y3
5
1A3
6
2Y2
7
1A4
8
9
2Y1
GND
SN54AS756 . . . FK PACKAGE
1A2
2Y3
1A3
2Y2
1A4
†
2OE for ′AS756 or 2OE for SN74AS757
10
(TOP VIEW)
2Y4
1A1
3 2 1 20 19
4
5
6
7
8
910111213
2Y1
GND
20
19
18
17
16
15
14
13
12
11
V
1OE
2A1
V
2OE/2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
CC
18
17
16
15
14
1Y4
2A22OE
CC
1Y1
2A4
1Y2
2A3
1Y3
†
logic symbols
1
1OE
2
1A1
4
1A2
6
1A3
8
1A4
19
2OE
11
2A1
13
2A2
15
2A3
17
2A4
‡
These symbols are in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
‡
′AS756
EN
EN
18
16
14
12
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
5
2Y3
3
2Y4
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
2
4
6
8
19
11
13
15
17
SN74AS757
EN
18
1Y1
16
1Y2
14
1Y3
12
1Y4
EN
9
2Y1
7
2Y2
5
2Y3
3
2Y4
Copyright 1995, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54AS756, SN74AS756, SN74AS757
OCTAL BUFFERS AND LINE DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SDAS040B – DECEMBER 1983 – REVISED JANUARY 1995
logic diagrams (positive logic)
′AS756SN74AS757
1
1OE
1OE
1
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
2
4
6
8
19
11
13
15
17
18
16
14
12
1Y1
1Y2
1Y3
1Y4
2OE
9
2Y1
7
2Y2
5
2Y3
3
2Y4
1A1
1A2
1A3
1A4
2A1
2A2
2A3
2A4
2
4
6
8
19
11
13
15
17
18
16
14
12
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
5
2Y3
3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
OCTAL BUFFERS AND LINE DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SDAS040B – DECEMBER 1983 – REVISED JANUARY 1995
switching characteristics (see Figure 1)
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
PARAMETER
t
PLH
t
PHL
t
PLH
t
†
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
PHL
FROM
INPUT
TO
OUTPUT
switching characteristics (see Figure 1)
PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
†
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
PHL
FROM
INPUT
TO
OUTPUT
RL = 500 Ω
TA = MIN to MAX
SN54AS756SN74AS756
MINMAXMINMAX
320319
1716
322319.5
18.517.5
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω
TA = MIN to MAX
,
†
,
SN74AS757
MINMAX
318.5
16
320
17
321
17.5
UNIT
†
UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AS756, SN74AS756, SN74AS757
OCTAL BUFFERS AND LINE DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SDAS040B – DECEMBER 1983 – REVISED JANUARY 1995
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
7 V
V
CC
S1
R
L
Test
Point
C
L
R
L
From Output
Under Test
(see Note A)
Test
Point
C
L
From Output
Under Test
(see Note A)
R1
C
L
RL = R1 = R2
Test
Point
R2
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
Timing
Input
t
su
Data
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Output
Control
(low-level
enabling)
Waveform 1
S1 Closed
(see Note B)
Waveform 2
S1 Open
(see Note B)
t
PZL
t
PZH
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
1.3 V
t
PHZ
1.3 V
1.3 V
t
1.3 V1.3 V
1.3 V1.3 V
FOR OPEN-COLLECTOR OUTPUTS
h
t
PLZ
LOAD CIRCUIT
3.5 V
0.3 V
3.5 V
0.3 V
3.5 V
0.3 V
[
3.5 V
V
OL
0.3 V
V
OH
0.3 V
[
0 V
High-Level
Low-Level
Out-of-Phase
(see Note C)
Pulse
Pulse
Input
In-Phase
Output
Output
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
1.3 V1.3 V
t
w
1.3 V1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.3 V1.3 V
t
PLH
t
PHL
1.3 V1.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.3 V1.3 V
t
PHL
t
PLH
3.5 V
0.3 V
3.5 V
0.3 V
3.5 V
0.3 V
V
V
V
V
OH
OL
OH
OL
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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