Small-Outline (DW) Packages, Plastic (FN)
and Ceramic (FK) Chip Carriers, and
Standard Plastic (NT) and Ceramic (JT)
300-mil DIPs
description
These dual 4-bit D-type edge-triggered flip-flops
feature 3-state outputs designed specifically as
bus drivers. They are particularly suitable for
implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
The edge-triggered flip-flops enter data on the
low-to-high transition of the clock (CLK) input.
The SN54ALS874B, SN74ALS874B, and
SN74AS874 have clear (CLR
noninverting Q outputs. The SN74ALS876A and
SN74AS876 have preset (PRE
inverting Q
four Q or Q
outputs; taking PRE low causes the
outputs to go low independently of the
clock.
The SN54ALS874B is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74ALS874B, SN74ALS876A,
SN74AS874, and SN74AS876 devices are
characterized for operation from 0°C to 70°C.
) inputs and
) inputs and
SN74ALS874B, SN74AS874 . . . DW OR NT PACKAGE
SN74ALS876A, SN74AS876 . . . DW OR NT PACKAGE
SN54ALS874B ...JT PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
1CLR
NC
28 27 26
15 16 17 18
NC
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
CC
V
2CLR
24
23
22
21
20
19
18
17
16
15
14
13
1CLR
1OE
1D1
1D2
1D3
1D4
2D1
2D2
2D3
2D4
2OE
GND
SN54ALS874B . . . FK PACKAGE
1D2
5
1D3
6
1D4
7
NC
8
2D1
9
2D2
10
2D3
11
NC – No internal connection
4
12
1D1
13 14
2D4
(TOP VIEW)
1OE
321
2OE
(TOP VIEW)
1PRE
1OE
1D1
1D2
1D3
1D4
2D1
2D2
2D3
2D4
2OE
GND
V
CC
1CLK
1Q1
1Q2
1Q3
1Q4
2Q1
2Q2
2Q3
2Q4
2CLK
2CLR
1CLK
1Q1
2Q4
2CLK
V
CC
1CLK
1Q
1Q
1Q3
1Q
2Q
2Q
2Q3
2Q
2CLK
2PRE
25
24
23
22
21
20
19
1
2
4
1
2
4
1Q2
1Q3
1Q4
NC
2Q1
2Q2
2Q3
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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