SOIC
DW
AHCT541
40°C to 85°C
TSSOP
PW
HB541
SN54AHCT541, SN74AHCT541
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS269O – DECEMBER 1995 – REVISED JUL Y 2003
D
Inputs Are TTL-Voltage Compatible
D
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
The ’AHCT541 octal buffers/drivers are ideal for
driving bus lines or buffer memory address
registers. These devices feature inputs and
outputs on opposite sides of the package to
facilitate printed circuit board layout.
The 3-state control gate is a 2-input AND gate with
active-low inputs so that if either output-enable
(OE1
or OE2) input is high, all corresponding
outputs are in the high-impedance state. The
outputs provide noninverted data when they are
not in the high-impedance state.
T o ensure the high-impedance state during power
up or power down, OE
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
T
A
–
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
should be tied to V
PACKAGE
PDIP – N Tube SN74AHCT541N SN74AHCT541N
–
SOP – NS Tape and reel SN74AHCT541NSR AHCT541
SSOP – DB Tape and reel SN74AHCT541DBR HB541
–
TVSOP – DGV Tape and reel SN74AHCT541DGVR HB541
CDIP – J Tube SNJ54AHCT541J SNJ54AHCT541J
CFP – W Tube SNJ54AHCT541W SNJ54AHCT541W
LCCC – FK Tube SNJ54AHCT541FK SNJ54AHCT541FK
SN74AHCT541 . . . DB, DGV, DW, N, NS, OR PW PACKAGE
CC
ORDERING INFORMA TION
†
Tube SN74AHCT541DW
Tape and reel SN74AHCT541DWR
Tube SN74AHCT541PW
Tape and reel SN74AHCT541PWR
ORDERABLE
PART NUMBER
SN54AHCT541 ...J OR W PACKAGE
(TOP VIEW)
1
OE1
2
A1
3
A2
4
A3
5
A4
6
A5
7
A6
8
A7
9
A8
GND
SN54AHCT541 . . . FK PACKAGE
10
(TOP VIEW)
A2A1OE1
A3
A4
A5
A6
A7
3212019
4
5
6
7
8
910111213
A8
Y8
20
19
18
17
16
15
14
13
12
11
V
CC
Y7
V
CC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
18
17
16
15
14
Y6 OE2
Y1
Y2
Y3
Y4
Y5
GND
TOP-SIDE
MARKING
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
SN54AHCT541, SN74AHCT541
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS269O – DECEMBER 1995 – REVISED JULY 2003
logic diagram (positive logic)
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE1 OE2 A
L L L L
L LH H
H XX Z
X H X Z
OUTPUT
Y
OE1
OE2
1
19
218
A1
To Seven Other Channels
Y1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
(VI < 0) –20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
(VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OK
(VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
or GND ±75 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC
(see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
DGV package 92°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
†
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
PARAMETER
TEST CONDITIONS
V
UNIT
V
4.5 V
V
V
4.5 V
V
SN54AHCT541, SN74AHCT541
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS269O – DECEMBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 3)
SN54AHCT541 SN74AHCT541
MIN MAX MIN MAX
V
V
V
V
V
I
OH
I
OL
∆t/∆v Input transition rise or fall rate 20 20 ns/V
T
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
†
This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
Supply voltage 4.5 5.5 4.5 5.5 V
CC
High-level input voltage 2 2 V
IH
Low-level input voltage 0.8 0.8 V
IL
Input voltage 0 5.5 0 5.5 V
I
Output voltage 0 V
O
High-level output current –8 –8 mA
Low-level output current 8 8 mA
Operating free-air temperature –55 125 –40 85 °C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
TA = 25°C SN54AHCT541 SN74AHCT541
MIN TYP MAX MIN MAX MIN MAX
4.4 4.5 4.4 4.4
3.94 3.8 3.8
0.1 0.1 0.1
0.36 0.44 0.44
I
I
I
∆I
C
C
OH
OL
I
OZ
CC
i
o
CC
CC
IOH = –50 mA
IOH = –8 mA
IOL = 50 mA
IOL = 8 mA
VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1
VO = VCC or GND 5.5 V ±0.25 ±2.5 ±2.5
VI = VCC or GND, IO = 0 5.5 V 4 40 40
One input at 3.4 V ,
†
Other inputs at VCC or GND
VI = VCC or GND 5 V 2 10 10 pF
VO = VCC or GND 5 V 4 pF
5.5 V 1.35 1.5 1.5 mA
CC
0 V
CC
V
m
A
m
A
m
A
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AHCT541, SN74AHCT541
PARAMETER
UNIT
AYC
15 pF
ns
OE
Y
C
15 pF
ns
OE
Y
C
15 pF
ns
AYC
50 pF
ns
OE
Y
C
50 pF
ns
OE
Y
C
50 pF
ns
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS269O – DECEMBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROM TO LOAD
(INPUT) (OUTPUT) CAPACITANCE
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
sk(o)
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
** On products compliant to MIL-PRF-38535, this parameter does not apply.
CL = 50 pF 1** 1 ns
p
=
L
p
=
L
p
=
L
p
=
L
p
=
L
p
=
L
TA = 25°C SN54AHCT541 SN74AHCT541
MIN TYP MAX MIN MAX MIN MAX
4.1* 6* 1* 6.5* 1 6.5
3.7* 5.5* 1* 6.5* 1 6.5
5* 7* 1* 8* 1 8
5* 7* 1* 8* 1 8
4.5* 7* 1* 8* 1 8
4.5* 7* 1* 8* 1 8
6.2 8.5 1 9.5 1 9.5
6 8.5 1 9.5 1 9.5
7.5 10 1 12 1 12
7.5 10 1 12 1 12
7 10 1 12 1 12
7 10 1 12 1 12
operating characteristics, V
C
Power dissipation capacitance No load, f = 1 MHz 12 pF
pd
= 5 V, TA = 25°C
CC
PARAMETER TEST CONDITIONS TYP UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHCT541, SN74AHCT541
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCLS269O – DECEMBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
Test
Point
C
L
From Output
Under Test
(see Note A)
C
L
RL = 1 kΩ
S1
CC
Open
GND
TEST S1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
t
w
Input
Input
In-Phase
Output
Out-of-Phase
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
1.5 V 1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
t
PLH
50% V
t
PHL
50% V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
3-STATE AND OPEN-DRAIN OUTPUTS
CC
CC
LOAD CIRCUIT FOR
3 V
0 V
3 V
0 V
t
PHL
V
t
PLH
CC
V
V
CC
V
OH
OL
OH
OL
50% V
50% V
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
1.5 V
t
CC
CC
h
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
t
su
1.5 V 1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V 1.5 V1.5 V 1.5 V
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
3 V
0 V
3 V
0 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
5962-9685801Q2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
5962-9685801QRA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC
5962-9685801QSA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC
SN74AHCT541DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74AHCT541DBR ACTIVE SSOP DB 20 2000 Pb-Free
SN74AHCT541DBRE4 ACTIVE SSOP DB 20 2000 Pb-Free
SN74AHCT541DW ACTIVE SOIC DW 20 25 Pb-Free
SN74AHCT541DWE4 ACTIVE SOIC DW 20 25 Pb-Free
SN74AHCT541DWR ACTIVE SOIC DW 20 2000 Pb-Free
SN74AHCT541DWRE4 ACTIVE SOIC DW 20 2000 Pb-Free
SN74AHCT541N ACTIVE PDIP N 20 20 Pb-Free
SN74AHCT541NE4 ACTIVE PDIP N 20 20 Pb-Free
SN74AHCT541NSR ACTIVE SO NS 20 2000 Pb-Free
SN74AHCT541NSRE4 ACTIVE SO NS 20 2000 Pb-Free
SN74AHCT541PW ACTIVE TSSOP PW 20 70 Pb-Free
SN74AHCT541PWE4 ACTIVE TSSOP PW 20 70 Pb-Free
SN74AHCT541PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74AHCT541PWR ACTIVE TSSOP PW 20 2000 Pb-Free
SN74AHCT541PWRE4 ACTIVE TSSOP PW 20 2000 Pb-Free
SN74AHCT541PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br)
SNJ54AHCT541FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54AHCT541J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC
SNJ54AHCT541W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
8-Jun-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
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deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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