TEXAS INSTRUMENTS SN54AHC374 Technical data

SOIC

DW

AHC374

40°C to 85°C

TSSOP

PW

HA374

D

Operating Range 2-V to 5.5-V V

D

3-State Outputs Drive Bus Lines Directly

D

Latch-Up Performance Exceeds 250 mA Per

CC

JESD 17

SN74AHC374 . . . DB, DGV, DW, N, NS, OR PW PACKAGE

SN54AHC374 ...J OR W PACKAGE

(TOP VIEW)

1

20 19 18 17 16 15 14 13 12 11

V

CC

8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK

OE

1Q 1D 2D 2Q 3Q 3D 4D 4Q

GND

2 3 4 5 6 7 8 9 10

SN54AHC374, SN74AHC374

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS

WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JUL Y 2003

D

ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)

SN54AHC374 . . . FK PACKAGE

2D 2Q 3Q 3D 4D

(TOP VIEW)

1D1QOE

3 2 1 20 19

4 5 6 7 8

9 10 11 12 13

4Q

CLK

GND

V

CC

5Q

8Q

18 17 16 15 14

5D

8D 7D 7Q 6Q 6D

description/ordering information

The ’AHC374 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels of the data (D) inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high

or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly . The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

ORDERING INFORMA TION

T

A

PDIP – N Tube SN74AHC374N SN74AHC374N

–

–55°C to 125°C

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

SOP – NS Tape and reel SN74AHC374NSR AHC374 SSOP – DB Tape and reel SN74AHC374DBR HA374

TVSOP – DGV Tape and reel SN74AHC374DGVR HA374 CDIP – J Tube SNJ54AHC374J SNJ54AHC374J CFP – W Tube SNJ54AHC374W SNJ54AHC374W LCCC – FK Tube SNJ54AHC374FK SNJ54AHC374FK

PACKAGE

–

†

Tube SN74AHC374DW Tape and reel SN74AHC374DWR

Tube SN74AHC374PW Tape and reel SN74AHC374PWR

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Copyright  2003, Texas Instruments Incorporated

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

1

SN54AHC374, SN74AHC374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

description/ordering information (continued)

OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

T o ensure the high-impedance state during power up or power down, OE

should be tied to V

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

FUNCTION TABLE

(each flip-flop)

INPUTS

OE CLK D

L ↑ H H L ↑ LL L H or L X Q

H X X Z

OUTPUT

Q

0

logic diagram (positive logic)

1

OE

11

CLK

1D

3

C1

1D

2

1Q

through a pullup

CC

To Seven Other Channels

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

UNIT

mA

∆t/∆v

Input transition rise or fall rate

ns/V

SN54AHC374, SN74AHC374

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS

WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V Input voltage range, V Output voltage range, V Input clamp current, I Output clamp current, I Continuous output current, I Continuous current through V Package thermal impedance, θ

–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CC

(see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I

(see Note 1) –0.5 V to V

O

(V

< 0) –20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IK

I

(V

OK

< 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

(V

= 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

O

or GND ±75 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CC

(see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JA

CC

†

+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DGV package 92°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

stg

recommended operating conditions (see Note 3)

SN54AHC374 SN74AHC374

MIN MAX MIN MAX

V

V V

I

OH

I

OL

T

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Supply voltage 2 5.5 2 5.5 V

CC

VCC = 2 V 1.5 1.5

High-level input voltage

IH

Low-level input voltage

IL

Input voltage 0 5.5 0 5.5 V

I

Output voltage 0 V

O

High-level output current

Low-level output current

p

Operating free-air temperature –55 125 –40 85 °C

A

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

VCC = 3 V VCC = 5.5 V 3.85 3.85 VCC = 2 V 0.5 0.5 VCC = 3 V VCC = 5.5 V 1.65 1.65

VCC = 2 V –50 –50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V –8 –8 VCC = 2 V 50 50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 8 8 VCC = 3.3 V ± 0.3 V 100 100 VCC = 5 V ± 0.5 V 20 20

2.1 2.1

0.9 0.9

CC

–4 –4

4 4

0 V

CC

V

m

A

m

A

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

3

SN54AHC374, SN74AHC374

PARAMETER

TEST CONDITIONS

V

UNIT

OH

OL

UNIT

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)

CC

2 V 1.9 2 1.9 1.9

IOH = –50 mA

V

OH

IOH = –4 mA IOH = –8 mA

IOL = 50 mA

V

OL

IOL = 4 mA IOL = 8 mA

I

OZ

I

CC

C

i

C

o

* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.

VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1 VO = VCC or GND 5.5 V ±0.25 ±2.5 ±2.5 VI = VCC or GND, IO = 0 5.5 V 4 40 40 VI = VCC or GND 5 V 4 10 10 pF VO = VCC or GND 5 V 6 pF

3 V 2.9 3 2.9 2.9

4.5 V 4.4 4.5 4.4 4.4 3 V 2.58 2.48 2.48

4.5 V 3.94 3.8 3.8 2 V 0.1 0.1 0.1 3 V 0.1 0.1 0.1

4.5 V 0.1 0.1 0.1 3 V 0.36 0.5 0.44

4.5 V 0.36 0.5 0.44

TA = 25°C SN54AHC374 SN74AHC374

MIN TYP MAX MIN MAX MIN MAX

V

m

A

m

A

m

A

timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)

TA = 25°C SN54AHC374 SN74AHC374 MIN MAX MIN MAX MIN MAX

t

Pulse duration, CLK high or low 5 5.5 5.5 ns

w

t

Setup time, data before CLK↑

su

t

Hold time, data after CLK↑ 2 2 2 ns

h

4.5 4 4 ns

timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)

TA = 25°C SN54AHC374 SN74AHC374 MIN MAX MIN MAX MIN MAX

t

Pulse duration, CLK high or low 5 5 5 ns

w

t

Setup time, data before CLK↑

su

t

Hold time, data after CLK↑ 2 2 2 ns

h

3 3 3 ns

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER

UNIT

f

MHz

CLK

Q

C

15 pF

ns

OE

Q

C

15 pF

ns

OE

Q

C

15 pF

ns

CLK

Q

C

50 pF

ns

OE

Q

C

50 pF

ns

OE

Q

C

50 pF

ns

PARAMETER

UNIT

f

MHz

CLK

Q

C

15 pF

ns

OE

Q

C

15 pF

ns

OE

Q

C

15 pF

ns

CLK

Q

C

50 pF

ns

OE

Q

C

50 pF

ns

OE

Q

C

50 pF

ns

SN54AHC374, SN74AHC374

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS

WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

switching characteristics over recommended operating free-air temperature range, V

= 3.3 V ±0.3 V (unless otherwise noted) (see Figure 1)

CC

FROM TO LOAD

(INPUT) (OUTPUT) CAPACITANCE

max

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

sk(o)

∗

On products compliant to MIL-PRF-38535, this parameter is not production tested.

∗∗

On products compliant to MIL-PRF-38535, this parameter does not apply.

CL = 15 pF 80* 130* 70* 70 CL = 50 pF 55 85 50 50

p

=

L

p

=

L

p

=

L

p

=

L

p

=

L

p

=

L

CL = 50 pF 1.5** 1.5 ns

TA = 25°C SN54AHC374 SN74AHC374

MIN TYP MAX MIN MAX MIN MAX

8.1* 12.7* 1* 15* 1 15

7.1* 11* 1* 13* 1 13

7.5* 10.5* 1* 12.5* 1 12.5

10.6 16.2 1 18.5 1 18.5

9.6 14.5 1 16.5 1 16.5

10.2 14 1 16 1 16

switching characteristics over recommended operating free-air temperature range, V

= 5 V ±0.5 V (unless otherwise noted) (see Figure 1)

CC

FROM TO LOAD

(INPUT) (OUTPUT) CAPACITANCE

max

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

t

sk(o)

∗

On products compliant to MIL-PRF-38535, this parameter is not production tested.

∗∗

On products compliant to MIL-PRF-38535, this parameter does not apply.

CL = 15 pF 130* 185* 110* 110 CL = 50 pF 85 120 75 75

p

=

L

p

=

L

p

=

L

p

=

L

p

=

L

p

=

L

CL = 50 pF 1** 1 ns

TA = 25°C SN54AHC374 SN74AHC374

MIN TYP MAX MIN MAX MIN MAX

5.4* 8.1* 1* 9.5* 1 9.5

5.1* 7.6* 1* 9* 1 9

4.6* 6.8* 1* 8* 1 8

6.9 10.1 1 11.5 1 11.5

6.6 9.6 1 11 1 11

6.1 8.8 1 10 1 10

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

5

SN54AHC374, SN74AHC374

PARAMETER

UNIT

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

noise characteristics, V

V

OL(P)

V

OL(V)

V

OH(V)

V

IH(D)

V

IL(D)

NOTE 4: Characteristics are for surface-mount packages only.

Quiet output, maximum dynamic V Quiet output, minimum dynamic V Quiet output, minimum dynamic V High-level dynamic input voltage 3.5 V Low-level dynamic input voltage 1.5 V

operating characteristics, V

C

Power dissipation capacitance No load, f = 1 MHz 32 pF

pd

= 5 V, CL = 50 pF, TA = 25°C (see Note 4)

CC

OL OL OH

= 5 V, TA = 25°C

CC

PARAMETER TEST CONDITIONS TYP UNIT

SN74AHC374

MIN TYP MAX

0.5 1 V

–0.5 –0.8 V

4 V

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

From Output

Under Test

(see Note A)

SN54AHC374, SN74AHC374

OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS

WITH 3-STATE OUTPUTS

SCLS240I – OCTOBER 1995 – REVISED JULY 2003

PARAMETER MEASUREMENT INFORMATION

V

Test Point

C

L

From Output

Under Test

(see Note A)

C

L

RL = 1 kΩ

S1

CC

Open

GND

TEST S1

t

PLH/tPHL

t

PLZ/tPZL

t

PHZ/tPZH

Open Drain

Open

V

CC

GND V

CC

LOAD CIRCUIT FOR

TOTEM-POLE OUTPUTS

Input

t

PLH

In-Phase

Output

t

PHL

Out-of-Phase

Output

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

t

w

50% V

CC

VOLTAGE WAVEFORMS

PULSE DURATION

50% V

CC

50% V

VOLTAGE WAVEFORMS

50% V

CC

3-STATE AND OPEN-DRAIN OUTPUTS

50% V

LOAD CIRCUIT FOR

V

CC

0 V

V

CC

t

PHL

50% V

t

PLH

50% V

CC

0 V

V

OH

OL

OH

OL

Timing Input

Data Input

Output

Control

Output

Waveform 1

S1 at V

(see Note B)

Output

Waveform 2

S1 at GND

(see Note B)

50% V

t

su

50% V

CC

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

50% V

CC

t

PZL

50% V

CC

t

PZH

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

CC

t

50% V

h

CC

t

PLZ

VOL + 0.3 V

t

PHZ

VOH – 0.3 V

V

CC

0 V

V

CC

0 V

V

CC

0 V

≈V

V

OL

V

OH

≈0 V

CC

NOTES: A. CL includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

7

PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-9686401Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A forPkg Type 5962-9686401QRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9686401QSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type

SN74AHC374DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI

SN74AHC374DBR ACTIVE SSOP DB 20 2000 Green(RoHS &

SN74AHC374DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &

SN74AHC374DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &

SN74AHC374DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS &

SN74AHC374DGVRE4 ACTIVE TVSOP DGV 20 2000 Green(RoHS &

SN74AHC374DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS &

SN74AHC374DW ACTIVE SOIC DW 20 25 Green (RoHS &

SN74AHC374DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &

SN74AHC374DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &

SN74AHC374DWR ACTIVE SOIC DW 20 2000 Green (RoHS &

SN74AHC374DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS&

SN74AHC374DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &

SN74AHC374N ACTIVE PDIP N 20 20 Pb-Free

SN74AHC374NE4 ACTIVE PDIP N 20 20 Pb-Free

SN74AHC374NSR ACTIVE SO NS 20 2000 Green(RoHS &

SN74AHC374NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &

SN74AHC374NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &

SN74AHC374PW ACTIVE TSSOP PW 20 70 Green (RoHS &

SN74AHC374PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &

SN74AHC374PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &

SN74AHC374PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI

SN74AHC374PWR ACTIVE TSSOP PW 20 2000 Green (RoHS&

SN74AHC374PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(RoHS)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

9-Oct-2007

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

(2)

SN74AHC374PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

9-Oct-2007

(3)

no Sb/Br)

SNJ54AHC374FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54AHC374J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type

SNJ54AHC374W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

SN74AHC374DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

SN74AHC374DGVR TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

SN74AHC374DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74AHC374PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74AHC374DBR SSOP DB 20 2000 346.0 346.0 33.0

SN74AHC374DGVR TVSOP DGV 20 2000 346.0 346.0 29.0

SN74AHC374DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74AHC374PWR TSSOP PW 20 2000 346.0 346.0 33.0

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,65

28

1

2,00 MAX

0,38 0,22

15

14

A

0,05 MIN

0,15

5,60 5,00

M

8,20 7,40

Seating Plane

0,10

0,25 0,09

0°–ā8°

Gage Plane

0,25

0,95 0,55

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

14

6,50

5,905,90

2016

7,50

6,90

24

8,50

28

10,50

9,907,90

30

10,50

9,90

38

12,90

12,30

4040065 /E 12/01

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65

1,20 MAX

14

0,30

0,19

8

4,50 4,30

PINS **

7

Seating Plane

0,15 0,05

8

1

A

DIM

14

0,10

6,60 6,20

M

0,10

0,15 NOM

0°–8°

2016

Gage Plane

24

0,25

0,75 0,50

28

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

7,70

9,80

9,60

4040064/F 01/97

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A SQ

B SQ

19

20

21

22

23

24

25

12826 27

12

1314151618 17

0.020 (0,51)

0.010 (0,25)

MIN

0.342 (8,69)

0.442

0.640

0.739

0.938

1.141

A

0.358 (9,09)

0.458

(11,63)

0.660

(16,76)

0.761

(19,32)(18,78)

0.962

(24,43)

1.165

(29,59)

NO. OF

TERMINALS

**

11

10

9

8

7

6

5

432

20

28

44

52

68

84

0.020 (0,51)

0.010 (0,25)

(11,23)

(16,26)

(23,83)

(28,99)

MINMAX

0.307 (7,80)

0.406

(10,31)

0.495

(12,58)

0.495

(12,58)

0.850 (21,6)

1.047 (26,6)

0.080 (2,03)

0.064 (1,63)

B

MAX

0.358 (9,09)

0.458

(11,63)

0.560

(14,22)

0.560

(14,22)

0.858 (21,8)

1.063 (27,0)

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

4040140/D 10/96

MECHANICAL DATA

MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000

DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE

24 PINS SHOWN

0,40

24

112

A

0,23 0,13

13

0,07

4,50 4,30

M

6,60 6,20

0,16 NOM

Gage Plane

0,25

0°–8°

0,75 0,50

1,20 MAX

PINS **

DIM

A MAX

A MIN

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153

14/16/20/56 Pins – MO-194

0,15 0,05

14

3,70

3,50

Seating Plane

3,50

20

5,10

4,90

0,08

5,103,70

4,90

382416

7,90

7,70

48

9,80

9,60

56

11,40

11,20

4073251/E 08/00

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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TEXAS INSTRUMENTS SN54AHC374 Technical data

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