Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
D
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
SN54AHC139 ...J OR W PACKAGE
SN74AHC139 . . . D, DB, DGV, N, NS
OR PW PACKAGE
(TOP VIEW)
1G
1
2
1A
3
1B
4
1Y0
5
1Y1
6
1Y2
7
1Y3
GND
8
16
15
14
13
12
11
10
V
2G
2A
2B
2Y0
2Y1
2Y2
9
2Y3
CC
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
D
CC
SN74AHC139 . . . RGY PACKAGE
(TOP VIEW)
1G
116
2
1A
3
1B
4
1Y0
5
1Y1
6
1Y2
7
1Y3
89
GND
Latch-Up Performance Exceeds 250 mA Per
JESD 17
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
CC
V
2Y3
15
14
13
12
11
10
2G
2A
2B
2Y0
2Y1
2Y2
SN54AHC139 ...FK PACKAGE
1B
1Y0
NC
1Y1
1Y2
NC – No internal connection
(TOP VIEW)
1A1GNC
3212019
4
5
6
7
8
910111213
NC
1Y3
GND
CC
V
2Y3
2G
18
17
16
15
14
2Y2
2A
2B
NC
2Y0
2Y1
description/ordering information
The ’AHC139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
These devices are designed to be used in high-performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, these decoders can be
used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable
circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical
access time of the memory . This means that the effective system delay introduced by the decoders is negligible.
ORDERING INFORMATION
T
A
QFN – RGYTape and reelSN74AHC139RGYRHA139
PDIP – NTubeSN74AHC139NSN74AHC139N
–40°C to 85°C
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
SOP – NSTape and reelSN74AHC139NSRAHC139
SSOP – DBTape and reelSN74AHC139DBRHA139
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2003, Texas Instruments Incorporated
1
SN54AHC139, SN74AHC139
OUTPUTS
G
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
description/ordering information (continued)
The active-low enable (G) input can be used as a data line in demultiplexing applications. These
decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its
driving circuit.
FUNCTION TABLE
(each decoder/demultiplexer)
INPUTS
SELECT
BAY0Y1Y2Y3
HXXHHHH
LLLLHHH
LLHHLHH
LHLHHLH
LHHHHHL
logic diagram (positive logic)
1
1G
2
Select
Inputs
Select
Inputs
Pin numbers shown are for the D, DB, DGV , J, N, NS, PW , RGY, and W packages.
1A
1B
2G
2A
2B
3
15
14
13
12
11
10
4
1Y0
5
1Y1
6
1Y2
7
1Y3
Data
Outputs
2Y0
2Y1
2Y2
9
2Y3
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
mA
mA
∆t/∆v
Input transition rise or fall rate
ns/V
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage25.525.5V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage05.505.5V
I
Output voltage0V
O
High-level output current
Low-level output current
p
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
VCC = 3 V
VCC = 5.5 V3.853.85
VCC = 2 V0.50.5
VCC = 3 V
VCC = 5.5 V1.651.65
VCC = 2 V–50–50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V–8–8
VCC = 2 V5050
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V88
VCC = 3.3 V ± 0.3 V100100
VCC = 5 V ± 0.5 V2020
2.12.1
0.90.9
CC
–4–4
44
0V
CC
V
V
V
m
A
m
A
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AHC139, SN74AHC139
PARAMETER
TEST CONDITIONS
V
UNIT
OH
OL
PARAMETER
UNIT
A or B
Y
C
15 pF
ns
G
Y
C
15 pF
ns
A or B
Y
C
50 pF
ns
G
Y
C
50 pF
ns
PARAMETER
UNIT
A or B
Y
C
15 pF
ns
G
Y
C
15 pF
ns
A or B
Y
C
50 pF
ns
G
Y
C
50 pF
ns
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
2 V1.921.91.9
IOH = –50 mA
V
OH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
V
OL
IOL = 4 mA
IOL = 8 mA
I
I
I
CC
C
i
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
VI = 5.5 V or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND,IO = 05.5 V44040
VI = VCC or GND5 V21010pF
3 V2.932.92.9
4.5 V4.44.54.44.4
3 V2.582.482.48
4.5 V3.943.83.8
2 V0.10.10.1
3 V0.10.10.1
4.5 V0.10.10.1
3 V0.360.50.44
4.5 V0.360.50.44
TA = 25°CSN54AHC139 SN74AHC139
MINTYPMAXMINMAXMINMAX
V
V
m
A
m
A
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
p
=
L
p
=
L
TA = 25°CSN54AHC139 SN74AHC139
MINTYPMAXMINMAXMINMAX
7.2**11**1**13**113
7.2**11**1**13**113
6.4**9.2**1**11**111
6.4**9.2**1**11**111
9.714.5116.5116.5
9.714.5116.5116.5
8.912.7114.5114.5
8.912.7114.5114.5
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
**
On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
p
=
L
p
=
L
TA = 25°CSN54AHC139 SN74AHC139
MINTYPMAXMINMAXMINMAX
5**7.2**1**8.5**18.5
5**7.2**1**8.5**18.5
4.4**6.3**1**7.5**17.5
4.4**6.3**1**7.5**17.5
6.59.2110.5110.5
6.59.2110.5110.5
5.98.319.519.5
5.98.319.519.5
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AHC139, SN74AHC139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCLS259K – DECEMBER 1995 – REVISED MARCH 2003
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz13pF
pd
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Test
Point
C
L
t
w
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
V
CC
Open
GND
t
su
50% V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
t
Open Drain
50% V
CC
TESTS1
PLH/tPHL
t
PLZ/tPZL
PHZ/tPZH
CC
t
h
50% V
CC
Open
V
CC
GND
V
CC
From Output
Under Test
C
(see Note A)
50% V
L
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
V
CC
0 V
RL = 1 kΩ
CC
S1
Timing Input
Data Input
V
0 V
V
0 V
CC
CC
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
50% V
CC
50% V
50% V
VOLTAGE WAVEFORMS
50% V
CC
CC
Figure 1. Load Circuit and Voltage Waveforms
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
V
0 V
V
V
V
V
CC
OH
OL
OH
OL
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Waveform 2
(see Note B)
CC
Output
S1 at GND
50% V
CC
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
CC
CC
50% V
t
VOL + 0.3 V
t
VOH – 0.3 V
CC
PLZ
PHZ
V
CC
0 V
≈V
V
OL
V
OH
≈0 V
CC
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN74AHC139DACTIVESOICD1640Pb-Free
SN74AHC139DBLEOBSOLETESSOPDB16NoneCall TICall TI
SN74AHC139DBRACTIVESSOPDB162000Pb-Free
SN74AHC139DGVRACTIVETVSOPDGV162000Pb-Free
SN74AHC139DRACTIVESOICD162500Pb-Free
SN74AHC139NACTIVEPDIPN1625Pb-Free
SN74AHC139NSRACTIVESONS162000Pb-Free
SN74AHC139PWACTIVETSSOPPW1690Pb-Free
SN74AHC139PWLEOBSOLETETSSOPPW16NoneCall TICall TI
SN74AHC139PWRACTIVETSSOPPW162000Pb-Free
SN74AHC139RGYRACTIVEQFNRGY161000 Green(RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-2-260C-1YEAR
(3)
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DAT A
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
24
112
A
0,23
0,13
13
0,07
4,50
4,30
M
6,60
6,20
0,16 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
1,20 MAX
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
0,15
0,05
14
3,70
3,50
Seating Plane
3,50
20
5,10
4,90
0,08
5,103,70
4,90
382416
7,90
7,70
48
9,80
9,60
56
11,40
11,20
4073251/E 08/00
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
M
5,60
5,00
Seating Plane
8,20
7,40
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
14
0,10
6,60
6,20
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Copyright 2005, Texas Instruments Incorporated
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