Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OUTPUT
A
HL
LH
Y
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
SN54AHC04, SN74AHC04
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
logic diagram, each inverter (positive logic)
YA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage25.525.5V
CC
VCC = 2 V1.51.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage05.505.5V
I
Output voltage0V
O
High-level output current
Low-level output current
p
Operating free-air temperature–55125–4085°C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
VCC = 3 V
VCC = 5.5 V3.853.85
VCC = 2 V0.50.5
VCC = 3 V
VCC = 5.5 V1.651.65
VCC = 2 V–50–50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V–8–8
VCC = 2 V5050
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V88
VCC = 3.3 V ± 0.3 V100100
VCC = 5 V ± 0.5 V2020
2.12.1
0.90.9
CC
–4–4
44
0V
CC
V
V
V
m
A
m
A
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CC
2 V1.921.91.9
IOH = –50 mA
V
OH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
V
OL
IOL = 4 mA
IOL = 8 mA
I
I
I
CC
C
i
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
VI = 5.5 V or GND0 V to 5.5 V±0.1±1*±1
VI = VCC or GND,IO = 05.5 V22020
VI = VCC or GND5 V21010pF
3 V2.932.92.9
4.5 V4.44.54.44.4
3 V2.582.482.48
4.5 V3.943.83.8
2 V0.10.10.1
3 V0.10.10.1
4.5 V0.10.10.1
3 V0.360.50.44
4.5 V0.360.50.44
TA = 25°CSN54AHC04SN74AHC04
MINTYPMAXMINMAXMINMAX
V
V
m
A
m
A
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54AHC04, SN74AHC04
PARAMETER
UNIT
A
Y
C
15 pF
ns
A
Y
C
50 pF
ns
PARAMETER
UNIT
A
Y
C
15 pF
ns
A
Y
C
50 pF
ns
PARAMETER
UNIT
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROMTOLOAD
(INPUT)(OUTPUT)CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
TA = 25°CSN54AHC04SN74AHC04
MINTYPMAXMINMAXMINMAX
5*8.9*1*10.5*110.5
5*8.9*1*10.5*110.5
7.511.4113113
7.511.4113113
TA = 25°CSN54AHC04SN74AHC04
MINTYPMAXMINMAXMINMAX
3.8*5.5*1*6.5*16.5
3.8*5.5*1*6.5*16.5
5.37.518.518.5
5.37.518.518.5
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 5: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V
Quiet output, minimum dynamic V
Quiet output, minimum dynamic V
High-level dynamic input voltage3.5V
Low-level dynamic input voltage1.5V
operating characteristics, V
C
Power dissipation capacitanceNo load,f = 1 MHz12pF
pd
= 5 V, CL = 50 pF, TA = 25°C (see Note 5)
CC
OL
OL
OH
= 5 V, TA = 25°C
CC
PARAMETERTEST CONDITIONSTYPUNIT
SN74AHC04
MINTYPMAX
0.4V
–0.4V
4.8V
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHC04, SN74AHC04
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
Test
Point
C
L
From Output
Under Test
(see Note A)
C
L
RL = 1 kΩ
S1
CC
Open
GND
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND
V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
t
w
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
50% V
CC
50% V
50% V
VOLTAGE WAVEFORMS
50% V
CC
CC
3-STATE AND OPEN-DRAIN OUTPUTS
50% V
LOAD CIRCUIT FOR
V
CC
CC
0 V
V
CC
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
0 V
V
V
V
V
OH
OL
OH
OL
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
50% V
t
su
50% V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
50% V
CC
t
PZL
50% V
50% V
CC
CC
CC
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
CC
t
50% V
50% V
h
CC
CC
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
V
CC
0 V
V
CC
0 V
V
CC
0 V
≈V
V
OL
V
OH
≈0 V
CC
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-2-260C-1YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
30-Mar-2005
Addendum-Page 2
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