TEXAS INSTRUMENTS SN54AHC04 Technical data

SOIC
D
AHC04
TSSOP
PW
HA04
查询5962-9680501Q2A供应商
D
Operating Range 2-V to 5.5-V V
D
Latch-Up Performance Exceeds 250 mA Per JESD 17
SN54AHC04, SN74AHC04
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JUL Y 2003
D
ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101)
SN54AHC04 ...J OR W PACKAGE SN74AHC04 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
1A
1
1Y
2
2A
3
2Y
4
3A
5 6
3Y
GND
7
14 13 12 11 10
V
CC
6A 6Y 5A 5Y
9
4A
8
4Y
SN74AHC04 . . . RGY PACKAGE
1Y 2A 2Y 3A 3Y
(TOP VIEW)
1A
114 2 3 4 5 6
78
V
CC
13 12 11 10
6A 6Y 5A 5Y
9
4A
4Y
GND
SN54AHC04 . . . FK PACKAGE
(TOP VIEW)
1Y1ANC
2A
NC
2Y
NC
3A
3212019
4 5 6 7 8
910111213
3Y
GND
NC – No internal connection
description/ordering information
The ’AHC04 devices contain six independent inverters. These devices perform the Boolean function Y = A.
ORDERING INFORMA TION
T
A
QFN – RGY Tape and reel SN74AHC04RGYR HA04 PDIP – N Tube SN74AHC04N SN74AHC04N
–40°C to 85°C
–55°C to 125°C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
SOP – NS Tape and reel SN74AHC04NSR AHC04 SSOP – DB Tape and reel SN74AHC04DBR HA04
TVSOP – DGV Tape and reel SN74AHC04DGVR HA04 CDIP – J Tube SNJ54AHC04J SNJ54AHC04J CFP – W Tube SNJ54AHC04W SNJ54AHC04W LCCC – FK Tube SNJ54AHC04FK SNJ54AHC04FK
PACKAGE
Tube SN74AHC04D Tape and reel SN74AHC04DR
Tube SN74AHC04PW Tape and reel SN74AHC04PWR
ORDERABLE
PART NUMBER
TOP-SIDE MARKING
NC
CC
V
4Y
6A
18 17 16 15 14
4A
6Y NC 5A NC 5Y
FUNCTION TABLE
(each inverter)
INPUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
OUTPUT
A
H L
L H
Y
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
1
SN54AHC04, SN74AHC04 HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
logic diagram, each inverter (positive logic)
YA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V Input voltage range, V Output voltage range, V Input clamp current, I Output clamp current, I Continuous output current, I Continuous current through V Package thermal impedance, θ
Storage temperature range, T
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
–0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I
(see Note 1) –0.5 V to V
O
(V
< 0) –20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IK
I
(V
OK
< 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
(V
= 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
O
O
or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA
(see Note 2): DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 47°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
UNIT
mA
mA
t/v
Input transition rise or fall rate
ns/V
PARAMETER
TEST CONDITIONS
V
UNIT
OH
OL
SN54AHC04, SN74AHC04
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 4)
SN54AHC04 SN74AHC04
MIN MAX MIN MAX
V
V
V
V V
I
OH
I
OL
T
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Supply voltage 2 5.5 2 5.5 V
CC
VCC = 2 V 1.5 1.5
High-level input voltage
IH
Low-level input voltage
IL
Input voltage 0 5.5 0 5.5 V
I
Output voltage 0 V
O
High-level output current
Low-level output current
p
Operating free-air temperature –55 125 –40 85 °C
A
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
VCC = 3 V VCC = 5.5 V 3.85 3.85 VCC = 2 V 0.5 0.5 VCC = 3 V VCC = 5.5 V 1.65 1.65
VCC = 2 V –50 –50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V –8 –8 VCC = 2 V 50 50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 8 8 VCC = 3.3 V ± 0.3 V 100 100 VCC = 5 V ± 0.5 V 20 20
2.1 2.1
0.9 0.9
CC
–4 –4
4 4
0 V
CC
V
V
V
m
A
m
A
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
CC
2 V 1.9 2 1.9 1.9
IOH = –50 mA
V
OH
IOH = –4 mA IOH = –8 mA
IOL = 50 mA
V
OL
IOL = 4 mA IOL = 8 mA
I
I
I
CC
C
i
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1* ±1 VI = VCC or GND, IO = 0 5.5 V 2 20 20 VI = VCC or GND 5 V 2 10 10 pF
3 V 2.9 3 2.9 2.9
4.5 V 4.4 4.5 4.4 4.4 3 V 2.58 2.48 2.48
4.5 V 3.94 3.8 3.8 2 V 0.1 0.1 0.1 3 V 0.1 0.1 0.1
4.5 V 0.1 0.1 0.1 3 V 0.36 0.5 0.44
4.5 V 0.36 0.5 0.44
TA = 25°C SN54AHC04 SN74AHC04
MIN TYP MAX MIN MAX MIN MAX
V
V
m
A
m
A
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
SN54AHC04, SN74AHC04
PARAMETER
UNIT
A
Y
C
15 pF
ns
A
Y
C
50 pF
ns
PARAMETER
UNIT
A
Y
C
15 pF
ns
A
Y
C
50 pF
ns
PARAMETER
UNIT
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range, V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
FROM TO LOAD
(INPUT) (OUTPUT) CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
switching characteristics over recommended operating free-air temperature range, V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
FROM TO LOAD
(INPUT) (OUTPUT) CAPACITANCE
t
PLH
t
PHL
t
PLH
t
PHL
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
p
=
L
p
=
L
TA = 25°C SN54AHC04 SN74AHC04
MIN TYP MAX MIN MAX MIN MAX
5* 8.9* 1* 10.5* 1 10.5 5* 8.9* 1* 10.5* 1 10.5
7.5 11.4 1 13 1 13
7.5 11.4 1 13 1 13
TA = 25°C SN54AHC04 SN74AHC04
MIN TYP MAX MIN MAX MIN MAX
3.8* 5.5* 1* 6.5* 1 6.5
3.8* 5.5* 1* 6.5* 1 6.5
5.3 7.5 1 8.5 1 8.5
5.3 7.5 1 8.5 1 8.5
noise characteristics, V
V
OL(P)
V
OL(V)
V
OH(V)
V
IH(D)
V
IL(D)
NOTE 5: Characteristics are for surface-mount packages only.
Quiet output, maximum dynamic V Quiet output, minimum dynamic V Quiet output, minimum dynamic V High-level dynamic input voltage 3.5 V Low-level dynamic input voltage 1.5 V
operating characteristics, V
C
Power dissipation capacitance No load, f = 1 MHz 12 pF
pd
= 5 V, CL = 50 pF, TA = 25°C (see Note 5)
CC
OL OL OH
= 5 V, TA = 25°C
CC
PARAMETER TEST CONDITIONS TYP UNIT
SN74AHC04
MIN TYP MAX
0.4 V
–0.4 V
4.8 V
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
From Output
Under Test
(see Note A)
SN54AHC04, SN74AHC04
HEX INVERTERS
SCLS231M – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
V
Test Point
C
L
From Output
Under Test
(see Note A)
C
L
RL = 1 k
S1
CC
Open
GND
TEST S1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open Drain
Open
V
CC
GND V
CC
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Input
Input
t
PLH
In-Phase
Output
t
PHL
Out-of-Phase
Output
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
t
w
50% V
CC
VOLTAGE WAVEFORMS
PULSE DURATION
50% V
CC
50% V
50% V
VOLTAGE WAVEFORMS
50% V
CC
CC
3-STATE AND OPEN-DRAIN OUTPUTS
50% V
LOAD CIRCUIT FOR
V
CC
CC
0 V
V
CC
CC
t
PHL
50% V
t
PLH
50% V
CC
CC
0 V
V
V
V
V
OH
OL
OH
OL
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
50% V
t
su
50% V
CC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
50% V
CC
t
PZL
50% V
50% V
CC
CC
CC
t
PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
CC
t
50% V
50% V
h
CC
CC
t
PLZ
VOL + 0.3 V
t
PHZ
VOH – 0.3 V
V
CC
0 V
V
CC
0 V
V
CC
0 V
V
V
OL
V
OH
0 V
CC
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 Ω, tr 3 ns, tf 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
5962-9680501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-9680501QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC 5962-9680501QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SN74AHC04D ACTIVE SOIC D 14 50 Pb-Free
SN74AHC04DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74AHC04DBR ACTIVE SSOP DB 14 2000 Pb-Free
SN74AHC04DGVR ACTIVE TVSOP DGV 14 2000 Pb-Free
SN74AHC04DR ACTIVE SOIC D 14 2500 Pb-Free
SN74AHC04N ACTIVE PDIP N 14 25 Pb-Free
SN74AHC04NSR ACTIVE SO NS 14 2000 Pb-Free
SN74AHC04PW ACTIVE TSSOP PW 14 90 Pb-Free
SN74AHC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74AHC04PWR ACTIVE TSSOP PW 14 2000 Pb-Free
SN74AHC04RGYR ACTIVE QFN RGY 14 1000 Green(RoHS &
no Sb/Br)
SNJ54AHC04FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54AHC04J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54AHC04W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-2-260C-1YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
30-Mar-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342 (8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307 (7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850 (21,6)
1.047 (26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858 (21,8)
1.063 (27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
24
112
A
0,23 0,13
13
0,07
4,50 4,30
M
6,60 6,20
0,16 NOM
Gage Plane
0,25
0°8°
0,75 0,50
1,20 MAX
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
0,15 0,05
14
3,70
3,50
Seating Plane
3,50
20
5,10
4,90
0,08
5,103,70
4,90
382416
7,90
7,70
48
9,80
9,60
56
11,40
11,20
4073251/E 08/00
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,25 0,09
0°ā8°
Gage Plane
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15 0,05
8
1
A
DIM
6,60 6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-Oct-2005
PACKAGING INFORMATION
Orderable Device Status
5962-9680501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-9680501QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC 5962-9680501QDA ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
SN74AHC04D ACTIVE SOIC D 14 50 Green (RoHS &
SN74AHC04DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74AHC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74AHC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
SN74AHC04DG4 ACTIVE SOIC D 14 50 Green (RoHS &
SN74AHC04DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
SN74AHC04DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
SN74AHC04DR ACTIVE SOIC D 14 2500 Green (RoHS &
SN74AHC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
SN74AHC04N ACTIVE PDIP N 14 25 Pb-Free
SN74AHC04NSR ACTIVE SO NS 14 2000 Green (RoHS &
SN74AHC04NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
SN74AHC04PW ACTIVE TSSOP PW 14 90 Green (RoHS &
SN74AHC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
SN74AHC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74AHC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
SN74AHC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
SN74AHC04RGYR ACTIVE QFN RGY 14 1000 Green(RoHS &
SN74AHC04RGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS &
SNJ54AHC04FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54AHC04J ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC
SNJ54AHC04W ACTIVE CFP W 14 1 TBD Call TI Level-NC-NC-NC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1YEAR
CU NIPDAU Level-2-260C-1YEAR
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
24-Oct-2005
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
12826 27
12
1314151618 17
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358 (9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307 (7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850 (21,6)
1.047 (26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358 (9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858 (21,8)
1.063 (27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
24
112
A
0,23 0,13
13
0,07
4,50 4,30
M
6,60 6,20
0,16 NOM
Gage Plane
0,25
0°8°
0,75 0,50
1,20 MAX
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
0,15 0,05
14
3,70
3,50
Seating Plane
3,50
20
5,10
4,90
0,08
5,103,70
4,90
382416
7,90
7,70
48
9,80
9,60
56
11,40
11,20
4073251/E 08/00
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38 0,22
15
14
A
0,05 MIN
0,15
5,60 5,00
M
8,20 7,40
Seating Plane
0,10
0,25 0,09
0°ā8°
Gage Plane
0,25
0,95 0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15 0,05
8
1
A
DIM
6,60 6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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