These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
The eight flip-flops of the ’ACT574 devices are
D-type edge-triggered flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels set up at the data (D)
inputs.
A buffered output-enable (OE
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
the increased drive provide the capability to drive
bus lines in a bus-organized system without need
for interface or pullup components.
) input can be used
SN54ACT574 ...J OR W PACKAGE
SN74ACT574 . . . DB, DW, N, NS, OR PW PACKAGE
SN54ACT574 . . . FK PACKAGE
3D
4D
5D
6D
7D
(TOP VIEW)
1
OE
2
1D
3
2D
4
3D
5
4D
6
5D
7
6D
8
7D
9
8D
GND
10
(TOP VIEW)
2D1DOE
3212019
4
5
6
7
8
910111213
8D
GND
20
19
18
17
16
15
14
13
12
11
CLK
V
8Q
CC
V
CC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
1Q
18
17
16
15
14
7Q
2Q
3Q
4Q
5Q
6Q
OE
does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
T o ensure the high-impedance state during power up or power down, OE
should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMA TION
T
A
PDIP – NTubeSN74ACT574NSN74ACT574N
–
–55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SOP – NSTape and reelSN74ACT574NSRACT574
SSOP – DBTape and reelSN74ACT574DBRAD574
TSSOP – PWTape and reelSN74ACT574PWRAD574
CDIP – JTubeSNJ54ACT574JSNJ54ACT574J
CFP – WTubeSNJ54ACT574WSNJ54ACT574W
LCCC – FKTubeSNJ54ACT574FKSNJ54ACT574FK
PACKAGE
–
†
TubeSN74ACT574DW
Tape and reelSN74ACT574DWR
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 2002, Texas Instruments Incorporated
1
SN54ACT574, SN74ACT574
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS537D – OCTOBER 1995 – REVISED NOVEMBER 2002
FUNCTION TABLE
(each flip-flop)
INPUTS
OECLKD
L↑HH
L↑LL
LH or LXQ
HXXZ
logic diagram (positive logic)
1
OE
11
CLK
OUTPUT
Q
0
1D
C1
2
To Seven Other Channels
1D
19
1Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
TA = 25°CSN54ACT574SN74ACT574
MINTYPMAXMINMAXMINMAX
OH
OL
I
OZ
I
I
I
CC
∆ICC‡
C
i
CC
= –
OH
= –
OH
IOH = –50 mA
IOH = –75 mA
=
OL
=
OL
IOL = 50 mA
IOL = 75 mA
VO = VCC or GND5.5 V±0.25±5±2.5µA
VI = VCC or GND5.5 V±0.1±1±1µA
VI = VCC or GND,IO = 05.5 V48040µA
One input at 3.4 V ,
Other inputs at GND or V
VI = VCC or GND5 V4.5pF
†
†
†
†
CC
4.5 V4.44.494.44.4
5.5 V5.45.495.45.4
4.5 V3.863.73.76
5.5 V4.864.74.76
5.5 V3.85
5.5 V3.85
4.5 V0.10.10.1
5.5 V0.10.10.1
4.5 V0.360.440.44
5.5 V0.360.440.44
5.5 V1.65
5.5 V1.65
5.5 V0.61.51.5mA
CC
CC
0V
0V
CC
CC
V
V
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
SN54ACT574, SN74ACT574
UNIT
PARAMETER
UNIT
CLK
Q
ns
OE
Q
ns
OE
Q
ns
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCAS537D – OCTOBER 1995 – REVISED NOVEMBER 2002
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°CSN54ACT574SN74ACT574
MINMAXMINMAXMINMAX
f
clock
t
w
t
su
t
h
switching characteristics over recommended operating free-air temperature range,
V
CC
Clock frequency1007085MHz
Pulse duration, CLK high or low354ns
Setup time, data before CLK↑2.53.52.5ns
Hold time, data after CLK↑121ns
= 5 V ± 0.5V (unless otherwise noted) (see Figure 1)
Power dissipation capacitanceCL = 50 pF,f = 1 MHz40pF
pd
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
From Output
Under Test
CL = 50 pF
(see Note A)
OCTAL D-TYPE EDGE-TRIGGERED FLIP-FLOPS
SCAS537D – OCTOBER 1995 – REVISED NOVEMBER 2002
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
500 Ω
500 Ω
S1
SN54ACT574, SN74ACT574
WITH 3-STATE OUTPUTS
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
2 × V
Open
CC
LOAD CIRCUIT
t
w
Input
Input
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
1.5 V1.5 V
VOLTAGE WAVEFORMS
1.5 V1.5 V
t
PLH
50% V
VOLTAGE WAVEFORMS
CC
t
50% V
PHL
3 V
0 V
V
CC
V
3 V
0 V
OH
OL
Timing Input
Data Input
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
CC
1.5 V
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
1.5 V1.5 V
t
PZL
50% V
t
PZH
50% V
VOLTAGE WAVEFORMS
CC
CC
t
h
VOL + 0.3 V
VOH – 0.3 V
t
PLZ
t
PHZ
3 V
0 V
3 V
0 V
3 V
0 V
≈V
V
OL
V
OH
≈0 V
CC
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2005
PACKAGING INFORMATION
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
SN74ACT574DBLEOBSOLETESSOPDB20TBDCall TICall TI
SN74ACT574DBRACTIVESSOPDB202000Pb-Free
SN74ACT574DBRE4ACTIVESSOPDB202000Pb-Free
SN74ACT574DWACTIVESOICDW2025Pb-Free
SN74ACT574DWE4ACTIVESOICDW2025Pb-Free
SN74ACT574DWRACTIVESOICDW202000Pb-Free
SN74ACT574DWRE4ACTIVESOICDW202000Pb-Free
SN74ACT574NACTIVEPDIPN2020Pb-Free
SN74ACT574NSRACTIVESONS202000Pb-Free
SN74ACT574NSRE4ACTIVESONS202000Pb-Free
SN74ACT574PWACTIVETSSOPPW2070Pb-Free
SN74ACT574PWE4ACTIVETSSOPPW2070Pb-Free
SN74ACT574PWG4ACTIVETSSOPPW2070Green (RoHS &
no Sb/Br)
SN74ACT574PWLEOBSOLETETSSOPPW20TBDCall TICall TI
SN74ACT574PWRACTIVETSSOPPW202000Pb-Free
SN74ACT574PWRE4ACTIVETSSOPPW202000Pb-Free
SN74ACT574PWRG4ACTIVETSSOPPW202000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-250C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-2-260C-1 YEAR/
Level-1-235C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-250C-UNLIM
CU NIPDAULevel-1-260C-UNLIM
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
8-Jun-2005
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50
4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60
6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75
0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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Use of such information may require a license from a third party under the patents or other intellectual property
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
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Mailing Address:Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated
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